JP5310820B2 - 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板 - Google Patents

金属張積層板及びその製造方法、並びに、フレキシブルプリント基板 Download PDF

Info

Publication number
JP5310820B2
JP5310820B2 JP2011233540A JP2011233540A JP5310820B2 JP 5310820 B2 JP5310820 B2 JP 5310820B2 JP 2011233540 A JP2011233540 A JP 2011233540A JP 2011233540 A JP2011233540 A JP 2011233540A JP 5310820 B2 JP5310820 B2 JP 5310820B2
Authority
JP
Japan
Prior art keywords
metal
group
resin layer
clad laminate
functional group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011233540A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012106491A (ja
Inventor
喜久 山本
洋之 吉本
秀人 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2011233540A priority Critical patent/JP5310820B2/ja
Publication of JP2012106491A publication Critical patent/JP2012106491A/ja
Application granted granted Critical
Publication of JP5310820B2 publication Critical patent/JP5310820B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
JP2011233540A 2010-10-25 2011-10-25 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板 Active JP5310820B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011233540A JP5310820B2 (ja) 2010-10-25 2011-10-25 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010238984 2010-10-25
JP2010238984 2010-10-25
JP2011233540A JP5310820B2 (ja) 2010-10-25 2011-10-25 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
JP2012106491A JP2012106491A (ja) 2012-06-07
JP5310820B2 true JP5310820B2 (ja) 2013-10-09

Family

ID=45993831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011233540A Active JP5310820B2 (ja) 2010-10-25 2011-10-25 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板

Country Status (6)

Country Link
US (1) US9392689B2 (zh)
JP (1) JP5310820B2 (zh)
KR (1) KR101555106B1 (zh)
CN (1) CN103180138B (zh)
TW (1) TWI532419B (zh)
WO (1) WO2012057124A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
JP2013123907A (ja) * 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP5914169B2 (ja) * 2012-05-28 2016-05-11 株式会社有沢製作所 フレキシブルプリント配線板用樹脂組成物
JP6235787B2 (ja) * 2013-03-29 2017-11-22 東レ・デュポン株式会社 高周波回路基板用カバーレイ
CN105814151B (zh) * 2013-12-03 2018-10-19 Ａｇｃ株式会社 液体底漆组合物以及使用其的层叠体
CN106660322B (zh) * 2014-07-16 2019-11-22 松下知识产权经营株式会社 覆金属箔层压板及其制造方法、附着树脂的金属箔、和印刷电路板
CN105282959B (zh) * 2014-07-22 2018-06-05 昆山雅森电子材料科技有限公司 具有低Dk和Df特性的高频覆盖膜及其制造方法
CN105269884B (zh) * 2014-07-22 2017-06-16 昆山雅森电子材料科技有限公司 复合式高频双面铜箔基板及其制造方法
WO2017154926A1 (ja) * 2016-03-08 2017-09-14 旭硝子株式会社 積層体の製造方法およびプリント基板の製造方法
US10716217B2 (en) * 2016-09-15 2020-07-14 Advanced Copper Foil Inc. Poly-based burr suppressor
US10998463B2 (en) * 2016-11-15 2021-05-04 Shin-Etsu Chemical Co., Ltd. High efficiency solar cell and method for manufacturing high efficiency solar cell
CN110181904A (zh) * 2018-12-31 2019-08-30 曾瑾 一种高频无胶双面挠性覆铜板及其制备方法
WO2021010783A1 (ko) * 2019-07-17 2021-01-21 한화솔루션 주식회사 고굴곡 및 저유전성 연성 동박 적층판
EP3998297A4 (en) * 2019-08-06 2023-12-06 Daikin Industries, Ltd. FLUORINATED POLYMER FOR METAL-COATED LAMINATE BOARD, COMPOSITION FOR METAL-COATED LAMINATE BOARD, CURABLE COMPOSITION, METAL-COATED LAMINATE BOARD, AND PRINTED CIRCUIT BOARD

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1313701A (en) * 1969-05-06 1973-04-18 Daikin Ind Ltd Thermo-stable composition of vinylidene fluoride polymer
US4557977A (en) * 1984-08-29 1985-12-10 Scm Corporation Polyvinylidene fluoride coatings
DE3583598D1 (de) * 1984-12-27 1991-08-29 Asahi Glass Co Ltd Haertbare harzmischung.
US4634631A (en) * 1985-07-15 1987-01-06 Rogers Corporation Flexible circuit laminate and method of making the same
KR910004817B1 (ko) * 1987-07-31 1991-07-13 니혼유시 가부시기가이샤 열경화성분체도료조성물
JPH03209792A (ja) * 1990-01-11 1991-09-12 Nitsukan Kogyo Kk 両面金属張りフレキシブル印刷配線基板およびその製造方法
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
US5367026A (en) * 1992-05-27 1994-11-22 Nippon Paint Co., Ltd. Resin composition and coating composition containing the same
JP2812637B2 (ja) 1992-05-27 1998-10-22 日本ペイント株式会社 樹脂組成物および塗料組成物
JPH06115000A (ja) 1992-09-30 1994-04-26 Nippon Carbide Ind Co Inc プライマー組成物及びそれを用いた樹脂積層金属板
EP0728776B1 (en) * 1994-06-09 1998-10-07 Daikin Industries, Limited Fluoroolefin, fluoropolymer, and thermoplastic resin composition containing the polymer
JPH09157616A (ja) * 1995-12-08 1997-06-17 Daikin Ind Ltd 含フッ素接着剤ならびにそれを用いた接着性フィルムおよび積層体
WO1998055557A1 (fr) * 1997-06-06 1998-12-10 Daikin Industries, Ltd. Adhesif fluorochimique, film adhesif et lamine obtenu au moyen de ce film
US6254972B1 (en) * 1999-06-29 2001-07-03 International Business Machines Corporation Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
KR20020003818A (ko) * 2000-07-03 2002-01-15 카나가와 치히로 가요성 인쇄 배선용 기판
JP3830384B2 (ja) * 2001-12-18 2006-10-04 株式会社日本触媒 フッ素化合物含有樹脂組成物
KR101214419B1 (ko) * 2004-12-20 2012-12-21 아사히 가라스 가부시키가이샤 플렉시블 프린트 배선판용 적층체
JP5129107B2 (ja) 2008-05-16 2013-01-23 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物、ポリイミド樹脂および金属−ポリイミド複合体
KR101566768B1 (ko) * 2008-11-10 2015-11-06 아지노모토 가부시키가이샤 프린트 배선판용 수지 조성물
CN101786354B (zh) * 2009-12-24 2012-10-10 广东生益科技股份有限公司 二层法双面挠性覆铜板及其制作方法

Also Published As

Publication number Publication date
JP2012106491A (ja) 2012-06-07
CN103180138B (zh) 2016-03-16
CN103180138A (zh) 2013-06-26
WO2012057124A1 (ja) 2012-05-03
KR20130083454A (ko) 2013-07-22
KR101555106B1 (ko) 2015-09-22
US20130213696A1 (en) 2013-08-22
TWI532419B (zh) 2016-05-01
US9392689B2 (en) 2016-07-12
TW201247067A (en) 2012-11-16

Similar Documents

Publication Publication Date Title
JP5310820B2 (ja) 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板
KR102438820B1 (ko) 수지 조성물
JP6017750B1 (ja) 樹脂含浸物、複合材及び銅張積層体の製造方法
JP5737466B1 (ja) 重合性官能基及び架橋性官能基からなる群より選択される少なくとも１種の基を含有する含フッ素重合体を含む組成物及び塗装物品
WO2015157216A1 (en) Crosslinked fluoropolymer circuit materials, circuit laminates, and methods of manufacture thereof
KR20140118917A (ko) 고주파 회로 기판용 커버레이
JP7236009B2 (ja) 金属張積層板用含フッ素ポリマー、金属張積層板用組成物、硬化性組成物、金属張積層板及びプリント基板
JP6019623B2 (ja) 含浸体の製造方法、及び、多層プリント配線板用積層板の製造方法
KR20210136965A (ko) 액상 조성물, 강유전성 절연 시트 및 그 제조 방법
JP5464258B2 (ja) 塗料、塗膜、太陽電池モジュールのバックシート、及び、太陽電池モジュール
KR101373580B1 (ko) 고차단성 코팅층 함유 태양전지 모듈용 백시트
JPWO2019189811A1 (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂付き金属箔、積層体、プリント配線板及び半導体パッケージ
JP6116601B2 (ja) プリント基板用積層体、及び、その製造方法
JP2010045376A (ja) 太陽電池のバックシート
JP2021167368A (ja) 液状組成物及び積層体の製造方法
JP6897854B2 (ja) 含フッ素ポリマー及び硬化性組成物
TWI839182B (zh) 環氧樹脂
JP5540828B2 (ja) 太陽電池モジュール用バックシートの製造方法および太陽電池モジュールの製造方法
JP2024001372A (ja) 含フッ素重合体組成物、硬化物および硬化物の製造方法
CN115702225A (zh) 涂料和涂料的制造方法、以及涂装物品和涂装物品的制造方法
JP2015074746A (ja) 離型フィルム
CN117461392A (zh) 组合物以及覆金属层叠体及其制造方法
KR20220051304A (ko) 조성물, 안테나의 제조 방법 및 성형품
JP2022050296A (ja) 熱伝導性シート及びシートの製造方法
JP2014113730A (ja) 離型フィルム

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120821

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121022

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130604

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130617

R151 Written notification of patent or utility model registration

Ref document number: 5310820

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151