JP5278531B2 - 電子部品の半田付け方法及び装置 - Google Patents

電子部品の半田付け方法及び装置 Download PDF

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Publication number
JP5278531B2
JP5278531B2 JP2011503743A JP2011503743A JP5278531B2 JP 5278531 B2 JP5278531 B2 JP 5278531B2 JP 2011503743 A JP2011503743 A JP 2011503743A JP 2011503743 A JP2011503743 A JP 2011503743A JP 5278531 B2 JP5278531 B2 JP 5278531B2
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JP
Japan
Prior art keywords
solder
solder liquid
axis
electronic component
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011503743A
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English (en)
Japanese (ja)
Other versions
JPWO2010103861A1 (ja
Inventor
忠則 桧垣
孝 及川
洋介 富沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2011503743A priority Critical patent/JP5278531B2/ja
Publication of JPWO2010103861A1 publication Critical patent/JPWO2010103861A1/ja
Application granted granted Critical
Publication of JP5278531B2 publication Critical patent/JP5278531B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2011503743A 2009-03-13 2010-01-13 電子部品の半田付け方法及び装置 Expired - Fee Related JP5278531B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011503743A JP5278531B2 (ja) 2009-03-13 2010-01-13 電子部品の半田付け方法及び装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009060836 2009-03-13
JP2009060836 2009-03-13
JP2011503743A JP5278531B2 (ja) 2009-03-13 2010-01-13 電子部品の半田付け方法及び装置
PCT/JP2010/050270 WO2010103861A1 (ja) 2009-03-13 2010-01-13 電子部品の半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPWO2010103861A1 JPWO2010103861A1 (ja) 2012-09-13
JP5278531B2 true JP5278531B2 (ja) 2013-09-04

Family

ID=42728156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011503743A Expired - Fee Related JP5278531B2 (ja) 2009-03-13 2010-01-13 電子部品の半田付け方法及び装置

Country Status (4)

Country Link
JP (1) JP5278531B2 (zh)
CN (1) CN102349123B (zh)
MY (1) MY158308A (zh)
WO (1) WO2010103861A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464855B (zh) * 2013-09-26 2015-10-07 郑州机械研究所 驻波约束的大面积硬质合金钎焊方法
JP6269568B2 (ja) * 2015-05-12 2018-01-31 株式会社村田製作所 フラックス塗布装置及びフラックス塗布方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151671U (ja) * 1984-03-16 1985-10-08 富士通株式会社 電子部品予備半田付け装置
JPS6163355A (ja) * 1984-09-06 1986-04-01 Mitsubishi Electric Corp プリント基板半田付装置
JPH04320016A (ja) * 1991-04-18 1992-11-10 Nittoku Eng Kk コイル用のハンダ付け方法および同ハンダ付け装置
JPH0550223A (ja) * 1991-07-25 1993-03-02 Tokin Corp 半田付け方法
JP2001230144A (ja) * 2000-02-17 2001-08-24 Nittoku Eng Co Ltd コイル巻線の端末処理方法および装置
JP2007317725A (ja) * 2006-05-23 2007-12-06 Tdk Corp 外部電極形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151671U (ja) * 1984-03-16 1985-10-08 富士通株式会社 電子部品予備半田付け装置
JPS6163355A (ja) * 1984-09-06 1986-04-01 Mitsubishi Electric Corp プリント基板半田付装置
JPH04320016A (ja) * 1991-04-18 1992-11-10 Nittoku Eng Kk コイル用のハンダ付け方法および同ハンダ付け装置
JPH0550223A (ja) * 1991-07-25 1993-03-02 Tokin Corp 半田付け方法
JP2001230144A (ja) * 2000-02-17 2001-08-24 Nittoku Eng Co Ltd コイル巻線の端末処理方法および装置
JP2007317725A (ja) * 2006-05-23 2007-12-06 Tdk Corp 外部電極形成方法

Also Published As

Publication number Publication date
JPWO2010103861A1 (ja) 2012-09-13
CN102349123A (zh) 2012-02-08
MY158308A (en) 2016-09-30
CN102349123B (zh) 2014-05-28
WO2010103861A1 (ja) 2010-09-16

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