WO2010103861A1 - 電子部品の半田付け方法及び装置 - Google Patents
電子部品の半田付け方法及び装置 Download PDFInfo
- Publication number
- WO2010103861A1 WO2010103861A1 PCT/JP2010/050270 JP2010050270W WO2010103861A1 WO 2010103861 A1 WO2010103861 A1 WO 2010103861A1 JP 2010050270 W JP2010050270 W JP 2010050270W WO 2010103861 A1 WO2010103861 A1 WO 2010103861A1
- Authority
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- WIPO (PCT)
- Prior art keywords
- solder
- electrodes
- solder liquid
- electronic component
- axis
- Prior art date
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- 238000005476 soldering Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 151
- 239000007788 liquid Substances 0.000 claims abstract description 87
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
Definitions
- the present invention relates to a method and an apparatus for attaching a solder solution to an electrode of an electronic component such as a chip coil.
- both ends of the coil are routed to an electrode formed on the back surface of one brim of the bobbin, and then the electrode and the coil end are soldered.
- the back surface of one brim portion of the bobbin on which the electrode is formed is immersed in a solder solution, and the bobbin is pulled up to attach the solder solution to the electrode.
- the solder adheres to a portion other than the electrode or more than a necessary amount of solder simply by immersing the back surface of one brim portion of the bobbin in a solder solution and simply pulling it up.
- Patent Document 1 discloses a method of attaching a solder solution to an electrode of a chip coil.
- this method as shown in FIG. 5, after the chip coil 100 is immersed in the solder solution 101 and the solder solution is attached to the electrodes, the electrode of the chip coil 100 is pulled up from the solder solution 101, and the solution of the solder solution is applied by the surface tension.
- the pin member 102 is moved approximately in parallel with the electrode to separate the solder solution 101 connected to the electrode.
- This soldering method employs a method in which the entire lower collar is immersed in a solder solution. At this time, since the region between the electrodes of the collar portion is also immersed in the solder bath, the size between the electrodes due to the downsizing of the product is shortened, the electrode size varies, the influence of excess flux, etc. Residual defects may occur. Further, there is a problem that a pin member is required to separate the solder liquid, and a driving mechanism is also required.
- Patent Document 2 discloses a method of soldering an end portion of a coil wound around a bobbin to a pin implanted in the bobbin. That is, three orthogonal axes composed of the horizontal axes X and Y and the vertical axis Z are set, the rotation angle coordinate around the horizontal axis Y is ⁇ , and the coordinate axis that is perpendicular to the Y axis and rotates in the angle ⁇ direction is X. And the rotation angle coordinate around the X axis is ⁇ . As shown in FIG.
- the bobbin 110 is supported in the X-axis direction, the bobbin is rotated in the angle ⁇ direction by a predetermined angle set for each specification of the bobbin, and the angular position in the angle ⁇ direction is predetermined.
- the bobbin 110 is lowered in the Z-axis direction while keeping the angular position in the ⁇ direction and the angular position in the ⁇ direction at predetermined values, and the pins 111 are immersed in the solder liquid 112.
- the bobbin is tilted and lowered in the Z direction and immersed in the solder liquid, the solder liquid is attached to one electrode (pin), the bobbin is lifted in the Z direction, The operation of rotating around the X axis and then descending again in the Z direction and immersing in the solder solution is repeated.
- the soldering process takes time.
- An object of the present invention is to provide a method and apparatus for soldering an electronic component in which a defective solder residue between electrodes does not occur and an appropriate amount of solder liquid can be attached to the electrodes.
- the present invention relates to a method for attaching a solder solution to a pair of electrodes formed at one end of an electronic component with a space therebetween, and an orthogonal three-axis comprising a horizontal axis X, Y and a vertical axis Z.
- the electronic component is supported above the solder liquid surface so that the direction perpendicular to the facing direction of the pair of electrodes is the X axis and the facing direction of the pair of electrodes is parallel to the solder liquid surface.
- a second step of swinging, and the other one of the electrodes is connected to the solder solution while the one electrode is connected to the solder solution by surface tension with the electronic component as the center of rotation.
- the soldering apparatus is an apparatus that attaches a solder solution to a pair of electrodes formed at one end of an electronic component with a space therebetween, and is an orthogonal three-axis composed of horizontal axes X and Y and a vertical axis Z.
- the first drive that holds the electrode connected And the chuck means for holding the electronic component above the solder liquid surface in a state where the solder liquid is connected to the electrode, and the second axis parallel to the Y axis located above the solder liquid surface is rotated upward. And second driving means for rotating and shaking off the solder liquid from the electrodes.
- the electronic component is swung around the first axis parallel to the X axis located in the solder solution below the electrodes so that the solder solution does not contact between the electrodes. Immerse in. At this time, after one electrode is immersed in the solder solution, when the other electrode is immersed in the solder solution, one electrode is maintained in a state of being connected to the solder solution by surface tension.
- the electronic component is held above the solder solution and in a state where the solder solution is connected to both electrodes by surface tension, and rotated around a second axis parallel to the Y axis located above the solder solution surface. Shake up.
- the swing-up direction is a direction orthogonal to the opposing direction of the pair of electrodes
- the solder liquid connected to both electrodes is shaken off, and no solder liquid remains between the electrodes.
- the solder solution does not contact the region between the electrodes both when immersed in the solder solution and when it is pulled up, no defective solder remains between the electrodes.
- the rotation speed (acceleration) and the initial rotation position can be set appropriately. It is possible to appropriately control the amount of solder attached to the solder. Therefore, the problem that an excessive amount of solder adheres can be solved.
- the solder is attached to both electrodes by swinging the electronic component around the first axis, and the solder is shaken off by swinging up the electronic component around the second axis from that state. Therefore, the operation of pulling up in the Z direction for each immersion as described in Patent Document 2 is not necessary, and the soldering operation can be completed with a small number of operations. Moreover, the pin member for isolate
- the third step it is preferable to pull up the electronic component in a direction perpendicular to the surface of the solder liquid while the solder liquid is connected to the electrode by the surface tension.
- the amount of solder attached to the left and right electrodes may become unbalanced. Therefore, by pulling up the electronic component that has finished swinging in a direction perpendicular to the solder liquid surface, the amount of solder liquid connected to the left and right electrodes can be made uniform, and then swung up around the second axis, The amount of solder attached to the left and right electrodes can be made uniform.
- the electronic component is swung around the first axis parallel to the X axis located in the solder solution, and after the one electrode is immersed in the solder solution one by one, Since the solder liquid is shaken off by rotating around the second axis parallel to the Y axis located above, the solder liquid does not contact between the electrodes both when immersed in the solder liquid and when it is pulled up. , It is possible to eliminate the defective solder residue between the electrodes.
- the electronic component is rotated upward about the second axis, the amount of solder liquid adhering to the electrode can be appropriately controlled without using external means such as a pin member by appropriately setting the acceleration. .
- (A) is the perspective view seen from the front side of the chip coil which is an example of the electronic component which concerns on this invention
- (b) is the perspective view seen from the back side. It is a figure which shows the principle of the soldering method which concerns on this invention. It is a front view of an example of the soldering apparatus which concerns on this invention. It is a side view of the soldering apparatus shown in FIG. It is explanatory drawing of an example of the conventional soldering method. It is explanatory drawing of the other example of the conventional soldering method.
- FIG. 1 shows a chip coil which is an example of an electronic component according to the present invention.
- the chip coil 1 is obtained by winding a coil 8 around a winding body (not shown) of a core 2 having flange portions 3 and 4 at both ends. Both end portions 8 a and 8 b of the coil 8 are routed to the back side of one collar portion 3 and are guided by a pair of groove portions 3 a and 3 b formed at both end portions of the back surface of the collar portion 3. Electrodes 3c and 3d (indicated by hatching) are formed from the bottom surfaces of the groove portions 3a and 3b to both end surfaces of the flange portion 3. As will be described later, these electrodes 3c and 3d and both ends 8a and 8b of the coil 8 are soldered.
- the direction perpendicular to the opposing direction of the pair of electrodes 3c and 3d is taken as the X axis
- the parallel direction is taken as the Y axis.
- soldering is performed by the following steps in a chip coil having a size in which the length ⁇ width of the collar portion 3 is 3.2 mm ⁇ 2.5 mm.
- the chip coil 1 is supported horizontally such that the collar portion 3 having the electrodes 3c and 3d is positioned downward and above the solder solution S.
- the collar portion 4 not having the electrodes 3c and 3d may be gripped by a chuck means or the like.
- the height H 1 of the chip coil 1 from the surface of the solder solution S is preferably about 3 to 7 mm.
- the chip coil 1 is moved from the vertical axis to the left with the first axis X1 parallel to the X axis located directly below the chip coil 1 and below the solder solution S as the rotation center.
- the electrode 3c is immersed in the solder solution S while being inclined by an angle ⁇ 1 in the direction.
- the position and angle ⁇ 1 of the first axis X1 are set so that the solder solution S does not adhere to the back surface intermediate portion of the collar portion 3 and the other electrode 3d.
- the first axis X1 is preferably set at a position 0 to 5 mm below the solder liquid surface, for example, and the swing angle ⁇ 1 is preferably 30 to 40 °, for example.
- the chip coil 1 is inclined rightward from the vertical axis by an angle ⁇ 2 with the first axis X1 as the center of rotation, and the other electrode 3d is immersed in the solder solution S. .
- the state in which the previously immersed electrode 3c and the solder solution S are connected by surface tension is maintained. Since the chip coil 1 swings at a turning radius larger than the height H 1 from the surface of the solder liquid S of the chip coil 1, the chip coil 1 is tilted while moving in the horizontal direction, and the electrode 3 c and the solder liquid are swung.
- the solder solution S does not adhere to the region between the electrodes without breaking the connection with S.
- the swing angle ⁇ 2 may be the same angle as ⁇ 1 , but may be a different angle.
- the rotation radius may be the same length on the left and right, but may be different lengths.
- the chip coil 1 is returned to the horizontal state so that the collar portion 3 is parallel to the liquid surface of the solder solution S.
- the chip coil 1 is held above the surface of the solder solution S, and the solder solution S is individually connected to the electrodes 3c and 3d by surface tension.
- the height H 2 from the liquid surface of the solder solution S of the chip coil 1 may be the same as the height H 1 in FIG. 2A, but from the height H 1 in a state parallel to the liquid surface of the solder solution S.
- the chip coil 1 may be raised by about 1 to 4 mm. In this case, the solder wet shape of both electrodes 3c and 3d can be made more uniform.
- the chip coil 1 is rapidly rotated upward about the second axis Y1 located immediately above the chip coil 1 and parallel to the Y axis, and the solder solution S From the electrodes 3c and 3d. Since the rotation direction is a direction orthogonal to the facing direction of the pair of electrodes 3c and 3d, a situation in which the solder liquid S adhering to the electrodes does not flow into a region between the electrodes does not occur.
- the rotation speed (acceleration) and the position of the rotation center Y1 the amount of the solder liquid S remaining on the electrodes 3c and 3d can be appropriately controlled.
- the above description is an example of a chip coil having a size of 3.2 ⁇ 2.5 mm, but the swing angles ⁇ 1 , ⁇ 2 , height, turning radius, and the like vary depending on the size of the chip coil.
- the flux is applied to the soldered portion before the chip coil 1 is soldered, but the flux application operation may be performed in the same manner as described above. However, since the flux has a smaller surface tension than the solder solution, the entire collar portion 3 of the chip coil 1 may be immersed in the flux.
- This soldering apparatus includes a solder bath 10 in which a solder solution S is stored, a first motor 20 for swinging, and a second motor 30 for swinging off.
- the first motor 20 is fixed horizontally on the base 11, and its rotating shaft 21 is located below the liquid surface of the solder liquid S.
- the axis of the rotating shaft 21 is the first axis X1.
- An arm 22 is connected to the rotary shaft 21 of the first motor 20, and a slide member 23 that is slidable in the vertical direction with respect to the arm 22 is attached to the tip of the arm 22.
- the second motor 30 is fixed horizontally to the slide member 23, and the chuck means 40 is connected to the rotating shaft 31 of the second motor 30.
- the axis of the rotation shaft 31 is the second axis Y1.
- the chuck means 40 includes a fixed claw 41 and a movable claw 42, and the collar portion 4 that does not have the electrode of the chip coil 1 can be chucked between the both claws 41, 42.
- a third motor 50 is fixed near the tip of the arm 22.
- the axis X1 of the rotating shaft 21 of the first motor 20 is located below the surface of the solder liquid S. Therefore, when the first motor 20 is driven in the forward / reverse direction, the chip coil 1 swings left and right, and the electrodes on both sides are immersed in the solder solution S as described with reference to FIGS. be able to. After returning the first motor 20 to the neutral position, that is, after returning the chip coil 1 horizontally so that the collar portion 3 is parallel to the liquid surface of the solder liquid S as shown in FIG. When the second motor 30 is driven, the chip coil 1 is swung up around the second axis Y1 as shown in FIG.
- FIG. 3 shows an example in which the center axis of the chip coil 1 is offset in the X-axis direction (swing-up direction) with respect to the second axis Y1, but this is not possible when the second motor 30 is driven. This is because the liquid S can be easily shaken off. This offset amount can be set arbitrarily.
- the first motor 20 constitutes the first driving means for swinging the chuck means 40 around the first axis X1
- the second motor 30 rotates the chuck means 40 around the second axis Y1.
- the first driving unit and the second driving unit may be configured by connecting the chuck unit to a three-axis and ⁇ -axis robot and controlling the X-axis, Z-axis, and ⁇ -axis by the robot.
- the swinging / raising motion of the chip coil may be performed using a transmission mechanism such as a cam or a link.
- the soldering method of the present invention is suitable for soldering a small electronic component such as a chip coil as described above, but can be applied to any electronic component having a pair of electrodes at one end.
- the electrode is not limited to a portion in which a groove is formed on the back surface of the collar portion and the end of the coil is guided in the groove, but may be a pin-shaped electrode, a plate-shaped electrode, or a planar electrode surface.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Molten Solder (AREA)
Abstract
Description
1 チップコイル(電子部品)
2 コア
3,4 つば部
3c,3d 電極
8 コイル
8a,8b 両端部
10 半田槽
20 第1モータ(第1の駆動手段)
30 第2モータ(第2の駆動手段)
40 チャック手段
50 第3モータ(第3の駆動手段)
X1 第1軸
Y1 第2軸
Claims (4)
- 電子部品の一端部に間隔をあけて形成された一対の電極に半田液を付着させる方法において、
水平軸X、Yおよび垂直軸Zよりなる直交3軸を設定し、前記一対の電極の対向方向に対して垂直な方向をX軸とし、
前記一対の電極の対向方向が半田液面と平行になるように前記電子部品を半田液面より上方で支持する第1の工程と、
前記電子部品を、半田液面より下方に位置するX軸と平行な第1軸を回転中心として、前記電極のうちの一方の電極を半田液面に浸漬する位置へ揺動させる第2の工程と、
前記電子部品を前記第1軸を回転中心として、前記一方の電極が表面張力によって半田液とつながった状態のまま、前記電極のうちの他方の電極を半田液面に浸漬する位置へ揺動させる第3の工程と、
前記一対の電極の対向方向が半田液面に対して平行になるように、前記電子部品を半田液面より上方で、かつ表面張力によって半田液が電極につながった状態で保持する第4の工程と、
前記電子部品を、半田液面より上方に位置するY軸と平行な第2軸を回転中心として上方へ回転させ、半田液を電極から振り切る第5の工程と、を有する電子部品の半田付け方法。 - 前記第4の工程は、表面張力によって半田液が電極につながった状態のまま、前記電子部品を半田液面に対して垂直方向に引き上げる工程を含むことを特徴とする請求項1に記載の電子部品の半田付け方法。
- 電子部品の一端部に間隔をあけて形成された一対の電極に半田液を付着させる装置において、
水平軸X、Yおよび垂直軸Zよりなる直交3軸を設定し、前記一対の電極の対向方向に対して垂直な方向をX軸とし、
前記電子部品の電極を形成した端部と反対側の端部をチャックするチャック手段と、
前記チャック手段を、半田液面より下方に位置するX軸と平行な第1軸を回転中心として、前記電極のうちの一方の電極を半田液面に浸漬する位置と他方の電極を半田液面に浸漬する位置との間で揺動させ、かつその中間位置で前記一対の電極の対向方向が半田液面に対して平行になるように、前記電子部品を半田液面より上方で、かつ表面張力によって半田液が電極につながった状態で保持する第1の駆動手段と、
前記半田液が電極につながった状態で電子部品を半田液面より上方で保持したチャック手段を、半田液面より上方に位置するY軸と平行な第2軸を回転中心として上方へ回転させ、半田液を電極から振り切る第2の駆動手段と、を有する電子部品の半田付け装置。 - 前記第1の駆動手段によって電子部品を半田液面より上方で、かつ表面張力によって半田液が電極につながった状態で保持した状態で、電子部品を半田液面に対して垂直方向に引き上げる第3の駆動手段を有することを特徴とする請求項3に記載の電子部品の半田付け装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2011503743A JP5278531B2 (ja) | 2009-03-13 | 2010-01-13 | 電子部品の半田付け方法及び装置 |
CN201080011071.1A CN102349123B (zh) | 2009-03-13 | 2010-01-13 | 电子元件的焊接方法及焊接装置 |
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JP2009-060836 | 2009-03-13 | ||
JP2009060836 | 2009-03-13 |
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WO2010103861A1 true WO2010103861A1 (ja) | 2010-09-16 |
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PCT/JP2010/050270 WO2010103861A1 (ja) | 2009-03-13 | 2010-01-13 | 電子部品の半田付け方法及び装置 |
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JP (1) | JP5278531B2 (ja) |
CN (1) | CN102349123B (ja) |
MY (1) | MY158308A (ja) |
WO (1) | WO2010103861A1 (ja) |
Cited By (1)
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JP2016209914A (ja) * | 2015-05-12 | 2016-12-15 | 株式会社村田製作所 | フラックス塗布装置及びフラックス塗布方法 |
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CN103464855B (zh) * | 2013-09-26 | 2015-10-07 | 郑州机械研究所 | 驻波约束的大面积硬质合金钎焊方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60151671U (ja) * | 1984-03-16 | 1985-10-08 | 富士通株式会社 | 電子部品予備半田付け装置 |
JPS6163355A (ja) * | 1984-09-06 | 1986-04-01 | Mitsubishi Electric Corp | プリント基板半田付装置 |
JPH04320016A (ja) * | 1991-04-18 | 1992-11-10 | Nittoku Eng Kk | コイル用のハンダ付け方法および同ハンダ付け装置 |
JPH0550223A (ja) * | 1991-07-25 | 1993-03-02 | Tokin Corp | 半田付け方法 |
JP2001230144A (ja) * | 2000-02-17 | 2001-08-24 | Nittoku Eng Co Ltd | コイル巻線の端末処理方法および装置 |
JP2007317725A (ja) * | 2006-05-23 | 2007-12-06 | Tdk Corp | 外部電極形成方法 |
-
2010
- 2010-01-13 MY MYPI2011004126A patent/MY158308A/en unknown
- 2010-01-13 CN CN201080011071.1A patent/CN102349123B/zh not_active Expired - Fee Related
- 2010-01-13 JP JP2011503743A patent/JP5278531B2/ja not_active Expired - Fee Related
- 2010-01-13 WO PCT/JP2010/050270 patent/WO2010103861A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60151671U (ja) * | 1984-03-16 | 1985-10-08 | 富士通株式会社 | 電子部品予備半田付け装置 |
JPS6163355A (ja) * | 1984-09-06 | 1986-04-01 | Mitsubishi Electric Corp | プリント基板半田付装置 |
JPH04320016A (ja) * | 1991-04-18 | 1992-11-10 | Nittoku Eng Kk | コイル用のハンダ付け方法および同ハンダ付け装置 |
JPH0550223A (ja) * | 1991-07-25 | 1993-03-02 | Tokin Corp | 半田付け方法 |
JP2001230144A (ja) * | 2000-02-17 | 2001-08-24 | Nittoku Eng Co Ltd | コイル巻線の端末処理方法および装置 |
JP2007317725A (ja) * | 2006-05-23 | 2007-12-06 | Tdk Corp | 外部電極形成方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016209914A (ja) * | 2015-05-12 | 2016-12-15 | 株式会社村田製作所 | フラックス塗布装置及びフラックス塗布方法 |
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Publication number | Publication date |
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CN102349123B (zh) | 2014-05-28 |
MY158308A (en) | 2016-09-30 |
JPWO2010103861A1 (ja) | 2012-09-13 |
CN102349123A (zh) | 2012-02-08 |
JP5278531B2 (ja) | 2013-09-04 |
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