MY158308A - Method of soldering electronic component, and apparatus of same - Google Patents

Method of soldering electronic component, and apparatus of same

Info

Publication number
MY158308A
MY158308A MYPI2011004126A MYPI2011004126A MY158308A MY 158308 A MY158308 A MY 158308A MY PI2011004126 A MYPI2011004126 A MY PI2011004126A MY PI2011004126 A MYPI2011004126 A MY PI2011004126A MY 158308 A MY158308 A MY 158308A
Authority
MY
Malaysia
Prior art keywords
liquid solder
electrodes
solder
electronic component
chip coil
Prior art date
Application number
MYPI2011004126A
Inventor
Higaki Tadanori
Oikawa Takashi
Tomizawa Yosuke
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of MY158308A publication Critical patent/MY158308A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

A METHOD OF SOLDERING AN ELECTRONIC COMPONENT, WHICH IS FREE OF LEFTOVER SOLDER EXISTING BETWEEN ELECTRODES AND ALLOWS A SUITABLE AMOUNT OF LIQUID SOLDER TO STICK TO THE ELECTRODES. A CHIP COIL (1) IS SUPPORTED ABOVE THE LIQUID SOLDER SURFACE SO THAT THE DIRECTION IN WHICH THE PAIR OF ELECTRODES FACE EACH OTHER IS PARALLEL TO THE LIQUID SOLDER SURFACE, AND IS SWUNG ABOUT A FIRST AXIS (X1) , WHICH IS POSITIONED BELOW THE LIQUID SOLDER SURFACE, AS A CENTER OF ROTATION SO THAT THE LEFT AND RIGHT ELECTRODES (3C, 3D) ARE ALTERNATELY DIPPED INTO THE LIQUID SOLDER SURFACE. NEXT, AFTER HORIZONTALLY HOLDING THE CHIP COIL ABOVE THE LIQUID SOLDER SURFACE AND IN A STATE IN WHICH THE LIQUID SOLDER IS CONNECTED TO THE ELECTRODE THROUGH SURFACE TENSION, THE CHIP COIL IS ROTATED UPWARD ABOUT A SECOND AXIS (Y1) AS A CENTER OF ROTATION, AND LIQUID SOLDER IS SHAKEN OFF FROM THE ELECTRODES. AS LIQUID SOLDER DOES NOT CONTACT THE REGION BETWEEN THE ELECTRODES DURING DIPPING AND PULL-UP, LEFTOVER SOLDER DOES NOT APPEAR BETWEEN THE ELECTRODES.
MYPI2011004126A 2009-03-13 2010-01-13 Method of soldering electronic component, and apparatus of same MY158308A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009060836 2009-03-13

Publications (1)

Publication Number Publication Date
MY158308A true MY158308A (en) 2016-09-30

Family

ID=42728156

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011004126A MY158308A (en) 2009-03-13 2010-01-13 Method of soldering electronic component, and apparatus of same

Country Status (4)

Country Link
JP (1) JP5278531B2 (en)
CN (1) CN102349123B (en)
MY (1) MY158308A (en)
WO (1) WO2010103861A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464855B (en) * 2013-09-26 2015-10-07 郑州机械研究所 The large area carbide alloy method for welding of standing wave constraint
JP6269568B2 (en) * 2015-05-12 2018-01-31 株式会社村田製作所 Flux coating apparatus and flux coating method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151671U (en) * 1984-03-16 1985-10-08 富士通株式会社 Electronic component preliminary soldering equipment
JPS6163355A (en) * 1984-09-06 1986-04-01 Mitsubishi Electric Corp Printed board soldering device
JP2728983B2 (en) * 1991-04-18 1998-03-18 日特エンジニアリング株式会社 Soldering method and device for coil
JPH0550223A (en) * 1991-07-25 1993-03-02 Tokin Corp Soldering method
JP4003367B2 (en) * 2000-02-17 2007-11-07 株式会社村田製作所 Coil manufacturing equipment
JP4458068B2 (en) * 2006-05-23 2010-04-28 Ｔｄｋ株式会社 External electrode formation method

Also Published As

Publication number Publication date
WO2010103861A1 (en) 2010-09-16
JPWO2010103861A1 (en) 2012-09-13
CN102349123B (en) 2014-05-28
CN102349123A (en) 2012-02-08
JP5278531B2 (en) 2013-09-04

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