JP5258068B2 - 半導体チップをウエハテーブルから取り上げて、取り外された半導体チップを基板上に実装するための方法 - Google Patents

半導体チップをウエハテーブルから取り上げて、取り外された半導体チップを基板上に実装するための方法 Download PDF

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JP5258068B2
JP5258068B2 JP2010528368A JP2010528368A JP5258068B2 JP 5258068 B2 JP5258068 B2 JP 5258068B2 JP 2010528368 A JP2010528368 A JP 2010528368A JP 2010528368 A JP2010528368 A JP 2010528368A JP 5258068 B2 JP5258068 B2 JP 5258068B2
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camera
coordinate system
marking
semiconductor chip
image
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JP2010541293A (ja
JP2010541293A5 (enrdf_load_stackoverflow
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べヒラー，ステファン
ブレッシング，パトリック
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エセック エージー
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Priority claimed from PCT/EP2008/063268 external-priority patent/WO2009047214A2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010528368A 2007-10-09 2008-10-03 半導体チップをウエハテーブルから取り上げて、取り外された半導体チップを基板上に実装するための方法 Active JP5258068B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH1562/07 2007-10-09
CH11362008A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
CH1136/08 2008-07-17
PCT/EP2008/063268 WO2009047214A2 (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Publications (3)

Publication Number Publication Date
JP2010541293A JP2010541293A (ja) 2010-12-24
JP2010541293A5 JP2010541293A5 (enrdf_load_stackoverflow) 2012-10-11
JP5258068B2 true JP5258068B2 (ja) 2013-08-07

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JP2010528368A Active JP5258068B2 (ja) 2007-10-09 2008-10-03 半導体チップをウエハテーブルから取り上げて、取り外された半導体チップを基板上に実装するための方法

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JP (1) JP5258068B2 (enrdf_load_stackoverflow)
KR (1) KR101503556B1 (enrdf_load_stackoverflow)
CN (1) CN101861637B (enrdf_load_stackoverflow)
CH (1) CH698334B1 (enrdf_load_stackoverflow)
DE (1) DE112008002467B4 (enrdf_load_stackoverflow)
MY (1) MY155097A (enrdf_load_stackoverflow)
TW (1) TWI464820B (enrdf_load_stackoverflow)

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CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
SG11201610297UA (en) * 2014-06-11 2017-01-27 Universal Instruments Corp Test device for establishing, verifying, and/or managing accuracy
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) * 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
KR102080214B1 (ko) * 2016-02-01 2020-02-24 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
WO2018207462A1 (ja) * 2017-05-11 2018-11-15 村田機械株式会社 搬送システム及び搬送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置

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DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
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JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
EP1841570A1 (en) * 2005-01-26 2007-10-10 Abb Ab Device and method for calibrating the center point of tool mounted on a robot by means of a camera
JP2007173801A (ja) 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法
KR20090091341A (ko) * 2006-12-22 2009-08-27 쿨리케 앤드 소파 다이 본딩 게엠베하 위치 설정 공구의 ｘ-ｙ 위치 설정을 보정하는 방법 및 이 위치 설정 공구를 구비한 장치

Also Published As

Publication number Publication date
JP2010541293A (ja) 2010-12-24
DE112008002467T5 (de) 2010-08-26
TWI464820B (zh) 2014-12-11
CN101861637A (zh) 2010-10-13
TW200929425A (en) 2009-07-01
DE112008002467B4 (de) 2013-08-22
KR101503556B1 (ko) 2015-03-17
CH698334A1 (de) 2009-07-15
CN101861637B (zh) 2012-07-18
KR20100085027A (ko) 2010-07-28
HK1144235A1 (en) 2011-02-02
MY155097A (en) 2015-09-15
CH698334B1 (de) 2011-07-29

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