CN101861637B - 从晶片台拾取半导体芯片的方法和在基板上安装移除的半导体芯片的方法 - Google Patents

从晶片台拾取半导体芯片的方法和在基板上安装移除的半导体芯片的方法 Download PDF

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Publication number
CN101861637B
CN101861637B CN2008801103578A CN200880110357A CN101861637B CN 101861637 B CN101861637 B CN 101861637B CN 2008801103578 A CN2008801103578 A CN 2008801103578A CN 200880110357 A CN200880110357 A CN 200880110357A CN 101861637 B CN101861637 B CN 101861637B
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camera
coordinate system
image
mark
semiconductor chip
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CN101861637A (zh
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斯特凡·贝勒
帕特里克·布莱辛
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Besi Switzerland AG
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Esec AG
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Priority claimed from PCT/EP2008/063268 external-priority patent/WO2009047214A2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2008801103578A 2007-10-09 2008-10-03 从晶片台拾取半导体芯片的方法和在基板上安装移除的半导体芯片的方法 Active CN101861637B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH1562/07 2007-10-09
CH11362008A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
CH1136/08 2008-07-17
PCT/EP2008/063268 WO2009047214A2 (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Publications (2)

Publication Number Publication Date
CN101861637A CN101861637A (zh) 2010-10-13
CN101861637B true CN101861637B (zh) 2012-07-18

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CN2008801103578A Active CN101861637B (zh) 2007-10-09 2008-10-03 从晶片台拾取半导体芯片的方法和在基板上安装移除的半导体芯片的方法

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JP (1) JP5258068B2 (enrdf_load_stackoverflow)
KR (1) KR101503556B1 (enrdf_load_stackoverflow)
CN (1) CN101861637B (enrdf_load_stackoverflow)
CH (1) CH698334B1 (enrdf_load_stackoverflow)
DE (1) DE112008002467B4 (enrdf_load_stackoverflow)
MY (1) MY155097A (enrdf_load_stackoverflow)
TW (1) TWI464820B (enrdf_load_stackoverflow)

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CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
SG11201610297UA (en) * 2014-06-11 2017-01-27 Universal Instruments Corp Test device for establishing, verifying, and/or managing accuracy
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) * 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
KR102080214B1 (ko) * 2016-02-01 2020-02-24 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
WO2018207462A1 (ja) * 2017-05-11 2018-11-15 村田機械株式会社 搬送システム及び搬送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置

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EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
CN1489433A (zh) * 2002-08-30 2004-04-14 ������������ʽ���� 元件安装方法及其元件安装装置
CN1674240A (zh) * 2004-03-26 2005-09-28 松下电器产业株式会社 电子元件安装装置和电子元件安装方法
CN1988121A (zh) * 2005-12-22 2007-06-27 优利讯国际贸易有限责任公司 用于在基板上安装倒装芯片的方法

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EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
CH696103A5 (de) 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
EP1841570A1 (en) * 2005-01-26 2007-10-10 Abb Ab Device and method for calibrating the center point of tool mounted on a robot by means of a camera
KR20090091341A (ko) * 2006-12-22 2009-08-27 쿨리케 앤드 소파 다이 본딩 게엠베하 위치 설정 공구의 ｘ-ｙ 위치 설정을 보정하는 방법 및 이 위치 설정 공구를 구비한 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
CN1489433A (zh) * 2002-08-30 2004-04-14 ������������ʽ���� 元件安装方法及其元件安装装置
CN1674240A (zh) * 2004-03-26 2005-09-28 松下电器产业株式会社 电子元件安装装置和电子元件安装方法
CN1988121A (zh) * 2005-12-22 2007-06-27 优利讯国际贸易有限责任公司 用于在基板上安装倒装芯片的方法

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JP特开2001-15992A 2001.01.19

Also Published As

Publication number Publication date
JP2010541293A (ja) 2010-12-24
DE112008002467T5 (de) 2010-08-26
TWI464820B (zh) 2014-12-11
CN101861637A (zh) 2010-10-13
TW200929425A (en) 2009-07-01
DE112008002467B4 (de) 2013-08-22
KR101503556B1 (ko) 2015-03-17
CH698334A1 (de) 2009-07-15
JP5258068B2 (ja) 2013-08-07
KR20100085027A (ko) 2010-07-28
HK1144235A1 (en) 2011-02-02
MY155097A (en) 2015-09-15
CH698334B1 (de) 2011-07-29

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