JP5206769B2 - 接着シート - Google Patents

接着シート Download PDF

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Publication number
JP5206769B2
JP5206769B2 JP2010255353A JP2010255353A JP5206769B2 JP 5206769 B2 JP5206769 B2 JP 5206769B2 JP 2010255353 A JP2010255353 A JP 2010255353A JP 2010255353 A JP2010255353 A JP 2010255353A JP 5206769 B2 JP5206769 B2 JP 5206769B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
adhesive
mpa
semiconductor
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2010255353A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011046963A (ja
Inventor
禎一 稲田
道夫 増野
道生 宇留野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010255353A priority Critical patent/JP5206769B2/ja
Publication of JP2011046963A publication Critical patent/JP2011046963A/ja
Application granted granted Critical
Publication of JP5206769B2 publication Critical patent/JP5206769B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
JP2010255353A 2003-06-06 2010-11-15 接着シート Expired - Lifetime JP5206769B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010255353A JP5206769B2 (ja) 2003-06-06 2010-11-15 接着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003161656 2003-06-06
JP2003161656 2003-06-06
JP2010255353A JP5206769B2 (ja) 2003-06-06 2010-11-15 接着シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004124129A Division JP4770126B2 (ja) 2003-06-06 2004-04-20 接着シート

Publications (2)

Publication Number Publication Date
JP2011046963A JP2011046963A (ja) 2011-03-10
JP5206769B2 true JP5206769B2 (ja) 2013-06-12

Family

ID=36819250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010255353A Expired - Lifetime JP5206769B2 (ja) 2003-06-06 2010-11-15 接着シート

Country Status (2)

Country Link
JP (1) JP5206769B2 (zh)
CN (5) CN101392159B (zh)

Families Citing this family (36)

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JP4791306B2 (ja) * 2006-09-22 2011-10-12 信越半導体株式会社 切断方法
KR101162819B1 (ko) 2007-04-05 2012-07-05 히다치 가세고교 가부시끼가이샤 반도체 칩의 제조방법, 및 반도체용 접착 필름 및 이것을 이용한 복합 시트
EP2139027A4 (en) * 2007-04-06 2012-08-08 Hitachi Chemical Co Ltd SEMICONDUCTOR ADHESIVE FILM, COMPOSITE SHEET, AND PROCESS FOR PRODUCING A SEMICONDUCTOR CHIP USING THE SAME
MY151354A (en) * 2007-10-09 2014-05-15 Hitachi Chemical Co Ltd Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
SG185968A1 (en) * 2007-11-08 2012-12-28 Hitachi Chemical Co Ltd Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
CN101855311A (zh) * 2007-11-15 2010-10-06 古河电气工业株式会社 半导体晶片加工用粘合带
JP2009164556A (ja) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The ウエハ加工用テープ
KR20110010601A (ko) * 2008-03-31 2011-02-01 헨켈 코포레이션 다중층 ｕｖ-경화성 접착 필름
CN105047597B (zh) * 2009-06-15 2018-04-03 日东电工株式会社 半导体背面用切割带集成膜
CN102250555B (zh) * 2010-05-17 2015-04-01 古河电气工业株式会社 晶片加工用带
JP5384443B2 (ja) * 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
KR101856557B1 (ko) 2011-03-16 2018-05-10 후루카와 덴키 고교 가부시키가이샤 고열전도성 필름상 접착제용 조성물, 고열전도성 필름상 접착제, 및 그것을 사용한 반도체 패키지와 그 제조 방법
TWI418274B (zh) * 2011-04-06 2013-12-01 Au Optronics Corp 可撓性電子元件及其製造方法
JP2013010849A (ja) * 2011-06-29 2013-01-17 Hitachi Chemical Co Ltd 半導体用接着部材、それを用いたダイシング・ダイボンディング一体型接着部材及び半導体装置の製造方法
JP5950572B2 (ja) * 2011-12-28 2016-07-13 ニチバン株式会社 打ち抜き・絞り加工用表面保護粘着シート
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
US10008405B2 (en) 2012-12-26 2018-06-26 Hitachi Chemical Company, Ltd Expansion method, method for manufacturing semiconductor device, and semiconductor device
KR101565515B1 (ko) * 2013-02-06 2015-11-03 주식회사 엘지화학 반도체 웨이퍼의 다이싱 방법
US10510578B2 (en) 2014-03-24 2019-12-17 Lintec Corporation Protective film forming film, protective film forming sheet and work product manufacturing method
JP6310748B2 (ja) * 2014-03-31 2018-04-11 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP5863914B1 (ja) * 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
JP6486176B2 (ja) * 2015-04-15 2019-03-20 株式会社ディスコ 被加工物の切削加工方法
JP6588404B2 (ja) * 2015-10-08 2019-10-09 信越化学工業株式会社 仮接着方法及び薄型ウエハの製造方法
WO2017145979A1 (ja) * 2016-02-23 2017-08-31 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法
JP6776081B2 (ja) * 2016-09-28 2020-10-28 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
KR101751972B1 (ko) * 2016-12-26 2017-08-01 (주)이녹스첨단소재 컨트롤러 다이 매립형 fod 접착필름 및 이를 포함하는 반도체 패키지
CN107065656B (zh) * 2017-03-14 2019-04-05 中国农业大学 一种带割胶深度反馈的智能割胶刀
JP6818612B2 (ja) * 2017-03-30 2021-01-20 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
JP6876540B2 (ja) * 2017-06-27 2021-05-26 日東電工株式会社 ダイシングテープ一体型接着性シート
SG11202100176VA (en) * 2018-07-11 2021-04-29 Showa Denko Materials Co Ltd Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film
JP7446887B2 (ja) * 2020-03-30 2024-03-11 リンテック株式会社 フィルム状接着剤
JP7084972B2 (ja) * 2020-10-06 2022-06-15 リンテック株式会社 保護膜形成用複合シート
CN113470536B (zh) * 2021-07-22 2023-06-27 业成科技（成都）有限公司 显示模组及电子设备
CN114458667A (zh) * 2022-01-29 2022-05-10 苏州富润泽激光科技有限公司 工件贴合方法及其电子产品

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JP2001302991A (ja) * 2000-04-20 2001-10-31 Lintec Corp 塗装用粘着テープ
JP2002060716A (ja) * 2000-08-24 2002-02-26 Hitachi Chem Co Ltd 低弾性接着剤、低弾性接着部材、低弾性接着部材を備えた半導体搭載用基板及びこれを用いた半導体装置
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JP4109823B2 (ja) * 2000-10-10 2008-07-02 株式会社東芝 半導体装置の製造方法
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
JP2002256238A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置の製造方法及び半導体装置
JP3724790B2 (ja) * 2001-03-21 2005-12-07 住友ベークライト株式会社 半導体装置及びその製造方法
JP2002327165A (ja) * 2001-04-20 2002-11-15 Three M Innovative Properties Co 熱硬化性の接着剤フィルム及びそれを用いた接着構造
JP4358502B2 (ja) * 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法

Also Published As

Publication number Publication date
CN101471240A (zh) 2009-07-01
CN101447413A (zh) 2009-06-03
CN1799126A (zh) 2006-07-05
CN101362926A (zh) 2009-02-11
CN101471240B (zh) 2011-07-20
CN101392159A (zh) 2009-03-25
CN101362926B (zh) 2012-08-15
CN100454493C (zh) 2009-01-21
CN101392159B (zh) 2012-10-03
JP2011046963A (ja) 2011-03-10
CN101447413B (zh) 2013-03-27

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