JP5196703B2 - 接着フィルム - Google Patents

接着フィルム Download PDF

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Publication number
JP5196703B2
JP5196703B2 JP2004007492A JP2004007492A JP5196703B2 JP 5196703 B2 JP5196703 B2 JP 5196703B2 JP 2004007492 A JP2004007492 A JP 2004007492A JP 2004007492 A JP2004007492 A JP 2004007492A JP 5196703 B2 JP5196703 B2 JP 5196703B2
Authority
JP
Japan
Prior art keywords
resin layer
resin
temperature
connection
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004007492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005200521A (ja
JP2005200521A5 (enExample
Inventor
憲明 工藤
恭志 阿久津
秀次 波木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2004007492A priority Critical patent/JP5196703B2/ja
Priority to TW093139608A priority patent/TWI265188B/zh
Priority to KR1020067014078A priority patent/KR101151133B1/ko
Priority to PCT/JP2004/019527 priority patent/WO2005068573A1/ja
Publication of JP2005200521A publication Critical patent/JP2005200521A/ja
Publication of JP2005200521A5 publication Critical patent/JP2005200521A5/ja
Application granted granted Critical
Publication of JP5196703B2 publication Critical patent/JP5196703B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/073—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H10W72/074—
    • H10W72/252—
    • H10W72/322—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2004007492A 2004-01-15 2004-01-15 接着フィルム Expired - Lifetime JP5196703B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004007492A JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム
TW093139608A TWI265188B (en) 2004-01-15 2004-12-20 Adhesive films and method for manufacturing adhesive film
KR1020067014078A KR101151133B1 (ko) 2004-01-15 2004-12-27 접착 필름, 및 접착 필름의 제조 방법
PCT/JP2004/019527 WO2005068573A1 (ja) 2004-01-15 2004-12-27 接着フィルム、接着フィルムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004007492A JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム

Publications (3)

Publication Number Publication Date
JP2005200521A JP2005200521A (ja) 2005-07-28
JP2005200521A5 JP2005200521A5 (enExample) 2006-12-28
JP5196703B2 true JP5196703B2 (ja) 2013-05-15

Family

ID=34792183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004007492A Expired - Lifetime JP5196703B2 (ja) 2004-01-15 2004-01-15 接着フィルム

Country Status (4)

Country Link
JP (1) JP5196703B2 (enExample)
KR (1) KR101151133B1 (enExample)
TW (1) TWI265188B (enExample)
WO (1) WO2005068573A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4735229B2 (ja) * 2005-12-12 2011-07-27 住友ベークライト株式会社 異方導電性フィルム
WO2009001605A1 (ja) * 2007-06-26 2008-12-31 Sony Chemical & Information Device Corporation 異方性導電材料、接続構造体及びその製造方法
JP5093482B2 (ja) * 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
JP5311772B2 (ja) 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP5970814B2 (ja) * 2009-08-05 2016-08-17 味の素株式会社 フィルム
JP5631654B2 (ja) 2010-07-28 2014-11-26 デクセリアルズ株式会社 実装体の製造方法及び接続方法
JP5369163B2 (ja) * 2011-10-19 2013-12-18 三菱電機株式会社 絶縁シートおよび半導体装置
WO2013073846A1 (ko) * 2011-11-14 2013-05-23 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
US9490048B2 (en) * 2012-03-29 2016-11-08 Cam Holding Corporation Electrical contacts in layered structures
EP2851406A4 (en) 2012-05-14 2015-12-23 Lg Chemical Ltd METHOD FOR PRODUCING AN ADHESIVE ARTICLE
JP5880283B2 (ja) * 2012-05-29 2016-03-08 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム
US20150371916A1 (en) * 2014-06-23 2015-12-24 Rohm And Haas Electronic Materials Llc Pre-applied underfill
KR102542797B1 (ko) 2015-01-13 2023-06-14 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
CN107960139B (zh) * 2015-05-27 2019-11-08 迪睿合株式会社 各向异性导电膜和连接结构体
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
CN114196334A (zh) * 2016-01-29 2022-03-18 昭和电工材料株式会社 粘接剂带及其制造方法、以及粘接剂膜用卷轴
JPWO2022158450A1 (enExample) * 2021-01-19 2022-07-28
KR20230056826A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름
KR20230056827A (ko) * 2021-10-20 2023-04-28 에이치엔에스하이텍 (주) 도전입자의 유동성을 제어한 이방도전성 접착필름의 제조방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195179A (ja) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd 異方導電性接着シ−ト
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH079821B2 (ja) * 1993-03-25 1995-02-01 日本黒鉛工業株式会社 三層構造異方性導電膜部材の製造方法
JPH07224252A (ja) * 1994-02-10 1995-08-22 Hitachi Chem Co Ltd 絶縁接着材料シート及び銅箔付き絶縁接着材料シート並びにその製造法とそれを用いた多層配線板の製造法
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
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JPH08279388A (ja) * 1995-04-04 1996-10-22 Idemitsu Kosan Co Ltd 電気回路の接続方法
US6328844B1 (en) * 1996-07-15 2001-12-11 Hitachi Chemical Company, Ltd. Filmy adhesive for connecting circuits and circuit board
US6583834B1 (en) * 1997-02-27 2003-06-24 Seiko Epson Corporation Adhesive, liquid crystal device, process for manufacturing liquid crystal device, and electronic equipment
JP3871082B2 (ja) * 1997-03-28 2007-01-24 日立化成工業株式会社 フィルム状接着剤及び回路板の製造法
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
JP2000290613A (ja) * 1999-04-13 2000-10-17 Hitachi Chem Co Ltd 熱硬化性接着シート
JP2001052778A (ja) * 1999-08-06 2001-02-23 Hitachi Chem Co Ltd 異方導電性接着フィルムおよびその製造方法
JP3372511B2 (ja) * 1999-08-09 2003-02-04 ソニーケミカル株式会社 半導体素子の実装方法及び実装装置
JP4696360B2 (ja) * 2000-12-28 2011-06-08 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2002358825A (ja) * 2001-05-31 2002-12-13 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3912244B2 (ja) * 2002-09-24 2007-05-09 住友電気工業株式会社 異方導電膜
JP2004006417A (ja) * 2003-08-22 2004-01-08 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造

Also Published As

Publication number Publication date
KR20060123491A (ko) 2006-12-01
JP2005200521A (ja) 2005-07-28
WO2005068573A1 (ja) 2005-07-28
TWI265188B (en) 2006-11-01
TW200525004A (en) 2005-08-01
KR101151133B1 (ko) 2012-06-01

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