JP5186550B2 - 電気的相互接続構造体及びその形成方法 - Google Patents

電気的相互接続構造体及びその形成方法 Download PDF

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Publication number
JP5186550B2
JP5186550B2 JP2010502479A JP2010502479A JP5186550B2 JP 5186550 B2 JP5186550 B2 JP 5186550B2 JP 2010502479 A JP2010502479 A JP 2010502479A JP 2010502479 A JP2010502479 A JP 2010502479A JP 5186550 B2 JP5186550 B2 JP 5186550B2
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JP
Japan
Prior art keywords
solder
metal core
solderless
solderless metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010502479A
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English (en)
Japanese (ja)
Other versions
JP2010525558A5 (OSRAM
JP2010525558A (ja
Inventor
ブックウォルター、ステファン、レスリー
ファーマン、ブルース、ケネス
グルーバー、ピーター、アルフレッド
ナ、ジェウーン
シー、ダユアン
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International Business Machines Corp
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International Business Machines Corp
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Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2010525558A publication Critical patent/JP2010525558A/ja
Publication of JP2010525558A5 publication Critical patent/JP2010525558A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H10W74/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W74/012—
    • H10P72/50—
    • H10P72/74—
    • H10W20/40—
    • H10W72/0198—
    • H10W72/20—
    • H10W72/30—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H10P72/7438—
    • H10W72/01204—
    • H10W72/01215—
    • H10W72/01223—
    • H10W72/01225—
    • H10W72/01231—
    • H10W72/01251—
    • H10W72/01331—
    • H10W72/072—
    • H10W72/07234—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/07253—
    • H10W72/07255—
    • H10W72/222—
    • H10W72/223—
    • H10W72/237—
    • H10W72/241—
    • H10W72/252—
    • H10W72/255—
    • H10W72/257—
    • H10W72/322—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/942—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2010502479A 2007-04-11 2008-03-26 電気的相互接続構造体及びその形成方法 Expired - Fee Related JP5186550B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/733,840 2007-04-11
US11/733,840 US7786001B2 (en) 2007-04-11 2007-04-11 Electrical interconnect structure and method
PCT/EP2008/053527 WO2008125440A1 (en) 2007-04-11 2008-03-26 Electrical interconnect structure and method of forming the same

Publications (3)

Publication Number Publication Date
JP2010525558A JP2010525558A (ja) 2010-07-22
JP2010525558A5 JP2010525558A5 (OSRAM) 2012-08-16
JP5186550B2 true JP5186550B2 (ja) 2013-04-17

Family

ID=39554841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010502479A Expired - Fee Related JP5186550B2 (ja) 2007-04-11 2008-03-26 電気的相互接続構造体及びその形成方法

Country Status (8)

Country Link
US (4) US7786001B2 (OSRAM)
EP (1) EP2156465B1 (OSRAM)
JP (1) JP5186550B2 (OSRAM)
KR (1) KR20090103886A (OSRAM)
CN (1) CN101652847B (OSRAM)
AT (1) ATE528796T1 (OSRAM)
TW (1) TWI459505B (OSRAM)
WO (1) WO2008125440A1 (OSRAM)

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US7868457B2 (en) * 2007-09-14 2011-01-11 International Business Machines Corporation Thermo-compression bonded electrical interconnect structure and method
JP5045688B2 (ja) * 2009-01-29 2012-10-10 日立金属株式会社 半導体装置
JP5214554B2 (ja) * 2009-07-30 2013-06-19 ラピスセミコンダクタ株式会社 半導体チップ内蔵パッケージ及びその製造方法、並びに、パッケージ・オン・パッケージ型半導体装置及びその製造方法
US8728873B2 (en) * 2010-09-10 2014-05-20 Infineon Technologies Ag Methods for filling a contact hole in a chip package arrangement and chip package arrangements
US8969176B2 (en) * 2010-12-03 2015-03-03 Raytheon Company Laminated transferable interconnect for microelectronic package
US8936967B2 (en) * 2011-03-23 2015-01-20 Intel Corporation Solder in cavity interconnection structures
JP2013074169A (ja) * 2011-09-28 2013-04-22 Kyocera Corp 薄膜配線基板
US9978656B2 (en) * 2011-11-22 2018-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming fine-pitch copper bump structures
US9128289B2 (en) 2012-12-28 2015-09-08 Pixtronix, Inc. Display apparatus incorporating high-aspect ratio electrical interconnects
US8497579B1 (en) * 2012-02-16 2013-07-30 Chipbond Technology Corporation Semiconductor packaging method and structure thereof
US8809123B2 (en) * 2012-06-05 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
US9082754B2 (en) 2012-08-03 2015-07-14 International Business Machines Corporation Metal cored solder decal structure and process
US20140071142A1 (en) * 2012-09-13 2014-03-13 Pixtronix, Inc. Display apparatus incorporating vertically oriented electrical interconnects
TWI468086B (zh) * 2012-11-07 2015-01-01 環旭電子股份有限公司 電子裝置、系統級封裝模組及系統級封裝模組的製造方法
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CN109121319A (zh) * 2018-08-21 2019-01-01 北京无线电测量研究所 微波子阵三维堆叠的焊球塌陷控制方法、设备和存储介质
JP7251951B2 (ja) * 2018-11-13 2023-04-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
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Also Published As

Publication number Publication date
EP2156465B1 (en) 2011-10-12
ATE528796T1 (de) 2011-10-15
EP2156465A1 (en) 2010-02-24
TW200849470A (en) 2008-12-16
KR20090103886A (ko) 2009-10-01
JP2010525558A (ja) 2010-07-22
US20100230474A1 (en) 2010-09-16
US8242010B2 (en) 2012-08-14
US8541299B2 (en) 2013-09-24
WO2008125440A1 (en) 2008-10-23
US20100230143A1 (en) 2010-09-16
US20100230475A1 (en) 2010-09-16
US7786001B2 (en) 2010-08-31
CN101652847A (zh) 2010-02-17
TWI459505B (zh) 2014-11-01
US8476773B2 (en) 2013-07-02
CN101652847B (zh) 2011-11-02
US20080251281A1 (en) 2008-10-16

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