ATE528796T1 - Elektrische verbindungsstruktur und verfahren zu ihrer bildung - Google Patents

Elektrische verbindungsstruktur und verfahren zu ihrer bildung

Info

Publication number
ATE528796T1
ATE528796T1 AT08718206T AT08718206T ATE528796T1 AT E528796 T1 ATE528796 T1 AT E528796T1 AT 08718206 T AT08718206 T AT 08718206T AT 08718206 T AT08718206 T AT 08718206T AT E528796 T1 ATE528796 T1 AT E528796T1
Authority
AT
Austria
Prior art keywords
solder
conductive pad
electrically conductive
electrically
forming
Prior art date
Application number
AT08718206T
Other languages
German (de)
English (en)
Inventor
Stephen Buchwalter
Bruce Furman
Peter Gruber
Jae-Woong Nah
Da-Yuan Shih
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE528796T1 publication Critical patent/ATE528796T1/de

Links

Classifications

    • H10W74/012—
    • H10W74/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10P72/50—
    • H10P72/74—
    • H10W20/40—
    • H10W72/0198—
    • H10W72/20—
    • H10W72/30—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H10P72/7438—
    • H10W72/01204—
    • H10W72/01215—
    • H10W72/01223—
    • H10W72/01225—
    • H10W72/01231—
    • H10W72/01251—
    • H10W72/01331—
    • H10W72/072—
    • H10W72/07234—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/07253—
    • H10W72/07255—
    • H10W72/222—
    • H10W72/223—
    • H10W72/237—
    • H10W72/241—
    • H10W72/252—
    • H10W72/255—
    • H10W72/257—
    • H10W72/322—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/942—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AT08718206T 2007-04-11 2008-03-26 Elektrische verbindungsstruktur und verfahren zu ihrer bildung ATE528796T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/733,840 US7786001B2 (en) 2007-04-11 2007-04-11 Electrical interconnect structure and method
PCT/EP2008/053527 WO2008125440A1 (en) 2007-04-11 2008-03-26 Electrical interconnect structure and method of forming the same

Publications (1)

Publication Number Publication Date
ATE528796T1 true ATE528796T1 (de) 2011-10-15

Family

ID=39554841

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08718206T ATE528796T1 (de) 2007-04-11 2008-03-26 Elektrische verbindungsstruktur und verfahren zu ihrer bildung

Country Status (8)

Country Link
US (4) US7786001B2 (OSRAM)
EP (1) EP2156465B1 (OSRAM)
JP (1) JP5186550B2 (OSRAM)
KR (1) KR20090103886A (OSRAM)
CN (1) CN101652847B (OSRAM)
AT (1) ATE528796T1 (OSRAM)
TW (1) TWI459505B (OSRAM)
WO (1) WO2008125440A1 (OSRAM)

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US7786001B2 (en) * 2007-04-11 2010-08-31 International Business Machines Corporation Electrical interconnect structure and method
US8043893B2 (en) * 2007-09-14 2011-10-25 International Business Machines Corporation Thermo-compression bonded electrical interconnect structure and method
US7868457B2 (en) * 2007-09-14 2011-01-11 International Business Machines Corporation Thermo-compression bonded electrical interconnect structure and method
JP5045688B2 (ja) * 2009-01-29 2012-10-10 日立金属株式会社 半導体装置
JP5214554B2 (ja) * 2009-07-30 2013-06-19 ラピスセミコンダクタ株式会社 半導体チップ内蔵パッケージ及びその製造方法、並びに、パッケージ・オン・パッケージ型半導体装置及びその製造方法
US8728873B2 (en) * 2010-09-10 2014-05-20 Infineon Technologies Ag Methods for filling a contact hole in a chip package arrangement and chip package arrangements
US8969176B2 (en) * 2010-12-03 2015-03-03 Raytheon Company Laminated transferable interconnect for microelectronic package
US8936967B2 (en) * 2011-03-23 2015-01-20 Intel Corporation Solder in cavity interconnection structures
JP2013074169A (ja) * 2011-09-28 2013-04-22 Kyocera Corp 薄膜配線基板
US9978656B2 (en) * 2011-11-22 2018-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming fine-pitch copper bump structures
US9128289B2 (en) 2012-12-28 2015-09-08 Pixtronix, Inc. Display apparatus incorporating high-aspect ratio electrical interconnects
US8497579B1 (en) * 2012-02-16 2013-07-30 Chipbond Technology Corporation Semiconductor packaging method and structure thereof
US8809123B2 (en) * 2012-06-05 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
US9082754B2 (en) 2012-08-03 2015-07-14 International Business Machines Corporation Metal cored solder decal structure and process
US20140071142A1 (en) * 2012-09-13 2014-03-13 Pixtronix, Inc. Display apparatus incorporating vertically oriented electrical interconnects
TWI468086B (zh) * 2012-11-07 2015-01-01 環旭電子股份有限公司 電子裝置、系統級封裝模組及系統級封裝模組的製造方法
US10020275B2 (en) * 2013-12-26 2018-07-10 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductive packaging device and manufacturing method thereof
JP6303535B2 (ja) * 2014-01-27 2018-04-04 富士通株式会社 電子部品の製造方法及び電子装置の製造方法
US10170444B2 (en) 2015-06-30 2019-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US9953908B2 (en) * 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer
US9793232B1 (en) * 2016-01-05 2017-10-17 International Business Machines Corporation All intermetallic compound with stand off feature and method to make
KR102420126B1 (ko) 2016-02-01 2022-07-12 삼성전자주식회사 반도체 소자
US10177099B2 (en) * 2016-04-07 2019-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor package structure, package on package structure and packaging method
US10297575B2 (en) 2016-05-06 2019-05-21 Amkor Technology, Inc. Semiconductor device utilizing an adhesive to attach an upper package to a lower die
CN109121319A (zh) * 2018-08-21 2019-01-01 北京无线电测量研究所 微波子阵三维堆叠的焊球塌陷控制方法、设备和存储介质
JP7251951B2 (ja) * 2018-11-13 2023-04-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
CN112885802A (zh) * 2019-11-29 2021-06-01 长鑫存储技术有限公司 半导体结构及其制造方法
US12107065B2 (en) 2020-07-17 2024-10-01 International Business Machines Corporation Uniform chip gaps via injection-molded solder pillars
US20250014975A1 (en) * 2023-07-06 2025-01-09 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices and methods of manufacturing electronic devices

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Also Published As

Publication number Publication date
EP2156465B1 (en) 2011-10-12
EP2156465A1 (en) 2010-02-24
TW200849470A (en) 2008-12-16
KR20090103886A (ko) 2009-10-01
JP2010525558A (ja) 2010-07-22
US20100230474A1 (en) 2010-09-16
US8242010B2 (en) 2012-08-14
US8541299B2 (en) 2013-09-24
WO2008125440A1 (en) 2008-10-23
JP5186550B2 (ja) 2013-04-17
US20100230143A1 (en) 2010-09-16
US20100230475A1 (en) 2010-09-16
US7786001B2 (en) 2010-08-31
CN101652847A (zh) 2010-02-17
TWI459505B (zh) 2014-11-01
US8476773B2 (en) 2013-07-02
CN101652847B (zh) 2011-11-02
US20080251281A1 (en) 2008-10-16

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