JP5125060B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5125060B2
JP5125060B2 JP2006298982A JP2006298982A JP5125060B2 JP 5125060 B2 JP5125060 B2 JP 5125060B2 JP 2006298982 A JP2006298982 A JP 2006298982A JP 2006298982 A JP2006298982 A JP 2006298982A JP 5125060 B2 JP5125060 B2 JP 5125060B2
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Japan
Prior art keywords
light emitting
emitting element
light
emitting device
metal film
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JP2006298982A
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English (en)
Japanese (ja)
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JP2008117900A5 (https=
JP2008117900A (ja
Inventor
永子 東
忠雄 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006298982A priority Critical patent/JP5125060B2/ja
Publication of JP2008117900A publication Critical patent/JP2008117900A/ja
Publication of JP2008117900A5 publication Critical patent/JP2008117900A5/ja
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Publication of JP5125060B2 publication Critical patent/JP5125060B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006298982A 2006-11-02 2006-11-02 発光装置 Active JP5125060B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006298982A JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006298982A JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

Publications (3)

Publication Number Publication Date
JP2008117900A JP2008117900A (ja) 2008-05-22
JP2008117900A5 JP2008117900A5 (https=) 2009-11-19
JP5125060B2 true JP5125060B2 (ja) 2013-01-23

Family

ID=39503614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006298982A Active JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

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JP (1) JP5125060B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013041931A (ja) * 2011-08-12 2013-02-28 Ricoh Co Ltd 光学素子パッケージ、面発光レーザモジュール、光走査装置及び画像形成装置
JP6079223B2 (ja) * 2011-12-28 2017-02-15 日亜化学工業株式会社 発光装置用パッケージ成形体
US9093621B2 (en) 2011-12-28 2015-07-28 Nichia Corporation Molded package for light emitting device
JP6191308B2 (ja) 2012-07-27 2017-09-06 日亜化学工業株式会社 ライン光源用発光装置
US9627591B2 (en) 2015-02-25 2017-04-18 Nichia Corporation Mounting substrate and electronic device including the same
JP6582827B2 (ja) * 2015-09-30 2019-10-02 日亜化学工業株式会社 基板及び発光装置、並びに発光装置の製造方法
JP7064324B2 (ja) * 2017-12-18 2022-05-10 スタンレー電気株式会社 半導体発光装置、および、それを用いた半導体発光装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470363A (ja) * 1990-07-02 1992-03-05 Alps Electric Co Ltd 光書き込みヘッド
JP2985830B2 (ja) * 1997-05-19 1999-12-06 日本電気株式会社 光モジュール及びその製造方法
JPH11161197A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd 画像表示装置
JP4114364B2 (ja) * 2001-11-08 2008-07-09 日亜化学工業株式会社 発光装置およびその製造方法
JP3924481B2 (ja) * 2002-03-08 2007-06-06 ローム株式会社 半導体チップを使用した半導体装置
JP2005038970A (ja) * 2003-07-17 2005-02-10 Ricoh Co Ltd サブマウントおよび半導体レーザ装置
JP4632690B2 (ja) * 2004-05-11 2011-02-16 スタンレー電気株式会社 半導体発光装置とその製造方法
JP4384073B2 (ja) * 2005-03-17 2009-12-16 第一電子工業株式会社 電子部品の製造方法

Also Published As

Publication number Publication date
JP2008117900A (ja) 2008-05-22

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