JP5125060B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5125060B2
JP5125060B2 JP2006298982A JP2006298982A JP5125060B2 JP 5125060 B2 JP5125060 B2 JP 5125060B2 JP 2006298982 A JP2006298982 A JP 2006298982A JP 2006298982 A JP2006298982 A JP 2006298982A JP 5125060 B2 JP5125060 B2 JP 5125060B2
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JP
Japan
Prior art keywords
light emitting
emitting element
light
emitting device
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006298982A
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English (en)
Japanese (ja)
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JP2008117900A (ja
JP2008117900A5 (enExample
Inventor
永子 東
忠雄 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006298982A priority Critical patent/JP5125060B2/ja
Publication of JP2008117900A publication Critical patent/JP2008117900A/ja
Publication of JP2008117900A5 publication Critical patent/JP2008117900A5/ja
Application granted granted Critical
Publication of JP5125060B2 publication Critical patent/JP5125060B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006298982A 2006-11-02 2006-11-02 発光装置 Active JP5125060B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006298982A JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006298982A JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

Publications (3)

Publication Number Publication Date
JP2008117900A JP2008117900A (ja) 2008-05-22
JP2008117900A5 JP2008117900A5 (enExample) 2009-11-19
JP5125060B2 true JP5125060B2 (ja) 2013-01-23

Family

ID=39503614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006298982A Active JP5125060B2 (ja) 2006-11-02 2006-11-02 発光装置

Country Status (1)

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JP (1) JP5125060B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013041931A (ja) * 2011-08-12 2013-02-28 Ricoh Co Ltd 光学素子パッケージ、面発光レーザモジュール、光走査装置及び画像形成装置
JP6079223B2 (ja) * 2011-12-28 2017-02-15 日亜化学工業株式会社 発光装置用パッケージ成形体
US9093621B2 (en) 2011-12-28 2015-07-28 Nichia Corporation Molded package for light emitting device
JP6191308B2 (ja) 2012-07-27 2017-09-06 日亜化学工業株式会社 ライン光源用発光装置
US9627591B2 (en) 2015-02-25 2017-04-18 Nichia Corporation Mounting substrate and electronic device including the same
JP6582827B2 (ja) * 2015-09-30 2019-10-02 日亜化学工業株式会社 基板及び発光装置、並びに発光装置の製造方法
JP7064324B2 (ja) * 2017-12-18 2022-05-10 スタンレー電気株式会社 半導体発光装置、および、それを用いた半導体発光装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470363A (ja) * 1990-07-02 1992-03-05 Alps Electric Co Ltd 光書き込みヘッド
JP2985830B2 (ja) * 1997-05-19 1999-12-06 日本電気株式会社 光モジュール及びその製造方法
JPH11161197A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd 画像表示装置
JP4114364B2 (ja) * 2001-11-08 2008-07-09 日亜化学工業株式会社 発光装置およびその製造方法
JP3924481B2 (ja) * 2002-03-08 2007-06-06 ローム株式会社 半導体チップを使用した半導体装置
JP2005038970A (ja) * 2003-07-17 2005-02-10 Ricoh Co Ltd サブマウントおよび半導体レーザ装置
JP4632690B2 (ja) * 2004-05-11 2011-02-16 スタンレー電気株式会社 半導体発光装置とその製造方法
JP4384073B2 (ja) * 2005-03-17 2009-12-16 第一電子工業株式会社 電子部品の製造方法

Also Published As

Publication number Publication date
JP2008117900A (ja) 2008-05-22

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