JP5110066B2 - フィルム状接着剤の調製方法 - Google Patents
フィルム状接着剤の調製方法 Download PDFInfo
- Publication number
- JP5110066B2 JP5110066B2 JP2009240348A JP2009240348A JP5110066B2 JP 5110066 B2 JP5110066 B2 JP 5110066B2 JP 2009240348 A JP2009240348 A JP 2009240348A JP 2009240348 A JP2009240348 A JP 2009240348A JP 5110066 B2 JP5110066 B2 JP 5110066B2
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- Japan
- Prior art keywords
- film
- adhesive
- film adhesive
- polyimide
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- JWKWYRVXHBOBRF-UHFFFAOYSA-N COC(c(cc1)cc(C(O2)=O)c1C2=O)=O Chemical compound COC(c(cc1)cc(C(O2)=O)c1C2=O)=O JWKWYRVXHBOBRF-UHFFFAOYSA-N 0.000 description 2
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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Description
で表される脂肪族エーテルジアミンを全ジアミンの1モル%以上含むジアミンとを反応させて得られるポリイミド樹脂である上記<1>〜<9>のいずれか1項に記載のフィルム状接着剤。
で表されるシロキサンジアミンを全ジアミンの0〜99モル%含むジアミンとを反応させて得られるポリイミド樹脂である上記<1>〜<9>のいずれか1項に記載のフィルム状接着剤。
で表されるノボラック型エポキシ樹脂である上記<2>〜<13>のいずれか1項に記載のフィルム状接着剤。
(2)半導体素子同士、の少なくとも1つが接着された構造を有してなる半導体装置。
上記(A)熱可塑性樹脂は、ポリイミド樹脂、ポリエーテルイミド樹脂、ポリエステルイミド樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリフェニレンサルファイド樹脂、ポリエーテルケトン樹脂、フェノキシ樹脂からなる群から選ばれる少なくとも一つ以上の樹脂であり、中でもポリイミド樹脂、ポリエーテルイミド樹脂が好ましい。
で表されるシロキサンジアミン等が挙げられ、中でも低応力性、低温ラミネート性、低温接着性、レジスト材付き有機基板に対する高接着性を付与できる点、また、熱時の適度な流動性を確保できる点で、上記一般式(I)が好ましい。この場合、全ジアミンの1モル%以上が好ましく、5モル%以上がより好ましく、10モル%以上がさらにより好ましい。1モル%未満では、上記特性の付与ができず、好ましくない。
で表される脂肪族エーテルジアミンがより好ましい。具体的には、ジェファーミンD−230、D−400、D−2000、D−4000、ED−600、ED−900、ED−2001、EDR−148(以上、サン テクノケミカル(株)製 商品名)、ポリエーテルアミンD−230、D−400、D−2000(以上、BASF(製)、商品名)等のポリオキシアルキレンジアミン等の脂肪族ジアミンが挙げられる。
上記のΣΔFは各種原子あるいは各種原子団の25℃におけるモル引力定数の総和、ΣΔυは各種原子あるいは各種原子団のモル体積の総和であり、各種原子あるいは各種原子団のΔF及びΔυの値は、下記表1に記載されているOkitsuの定数(沖津俊直著、「接着」、第40巻8号、p342(1996))を用いた。
本発明に用いる(B)エポキシ樹脂は、特に限定されないが、3官能以上のエポキシ樹脂および/または室温で固体状のエポキシ樹脂を含むことが好ましい。
で表されるノボラック型エポキシ樹脂の他、3官能型(又は4官能型)のグリシジルエーテル、3官能型(又は4官能型)のグリシジルアミン等が挙げられ、上記一般式(VII)で表されるノボラック型エポキシ樹脂としては、クレゾールノボラック樹脂のグリシジルエーテル、フェノールノボラック樹脂のグリシジルエーテル等が挙げられる。中でも、硬化物の架橋密度が高く、フィルムの熱時の接着強度を高くすることができる点で、上記一般式(VII)で表されるノボラック型エポキシ樹脂が好ましい。これらは単独で又は二種類以上を組み合わせて使用することができる。
で表されるビスフェノール型エポキシ樹脂が挙げられる。
み合わせて使用することができる。
弾性率化が図れ、ダイシング性(ダイサー刃による切断性)、ワイヤボンディング性(超音波効率)、熱時の接着強度を有効に向上できるが、必要以上に増量させると、本発明の特徴である低温貼付性及び被着体との界面接着性が損なわれ、耐リフロー性を含む信頼性の低下を招くため好ましくない。求められる特性のバランスをとるべく、最適なフィラー含量を決定する。
する。
(1)V≦10.65×E、
(2)M≦0.22×E、
(3)V≦―0.0043F+11.35、
(4)M≦―0.0002F+0.6
の少なくとも1つの条件を満たすことを特徴とする。
ムは、半導体素子を複数重ねる構造の半導体装置にも好適に使用できる。
下記ポリイミドA〜Mを熱可塑性樹脂として用い、下記表2の配合表に示す通り、フィルム塗工ワニスを調合した。
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、1,12−ジアミノドデカン2.10g(0.035モル)、ポリエーテルジアミン(BASF製、ED2000(分子量:1923))17.31g(0.03モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学製、LP−7100)2.61g(0.035モル)及びN−メチル−2−ピロリドン150gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)15.62g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン100gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドA)を得た。(ポリイミドのTg:22℃、重量平均分子量:47000、SP値:10.2)
<ポリイミドA'>
精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)の代わりに、未精製の4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:11.1℃)を用いた他は<ポリイミドA>と同様にしてポリイミド溶液(ポリイミドA')を得た。(ポリイミドのTg:22℃、重量平均分子量:42000、SP値:10.2)
<ポリイミドB>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、2,2−ビス(4−アミノフェノキシフェニル)プロパン8.63g(0.07モル)、ポリエーテルジアミン(BASF製、ED2000(分子量:1923))17.31g(0.03モル)、及びN−メチル−2−ピロリドン166.4gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)7.82g(0.05モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)7.85g(0.05モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン111gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドB)を得た。(ポリイミドのTg:33℃、重量平均分子量:114800、SP値:10.1)
<ポリイミドC>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、4,9−ジオキサデカン−1,12−ジアミン5.81g(0.095モル)、ポリエーテルジアミン(BASF製、ED2000(分子量:1923))2.88g(0.005モル)、及びN−メチル−2−ピロリドン112.36gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)10.94g(0.07モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)4.71g(0.03モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン74.91gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドC)を得た。(ポリイミドのTg:35℃、重量平均分子量:172300、SP値:11.0)
<ポリイミドD>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、4,7,10−トリオキサトリデカン−1,13−ジアミン4.62g(0.07モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学製、LP−7100)2.24g(0.03モル)、及びN−メチル−2−ピロリドン90.00gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)12.50g(0.08モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0)3.14g(0.02モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン60.00gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドD)を得た。(ポリイミドのTg:24℃、重量平均分子量:42800、SP値:11.0)
<ポリイミドE>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、4,9−ジオキサデカン−1,12−ジアミン5.81g(0.095モル)、ポリエーテルジアミン(BASF製、ED2000(分子量:1923))2.88g(0.005モル)、及びN−メチル−2−ピロリドン97.32gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)12.50g(0.08モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)3.14g(0.02モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン64.88gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドE)を得た。(ポリイミドのTg:37℃、重量平均分子量:48500、SP値:10.9)
<ポリイミドF>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、1,12−ジアミノドデカン5.41g(0.045モル)、ポリエーテルジアミン(BASF製、ED2000(分子量:1923))11.54g(0.01モル)、ポリシロキサンジアミン(信越シリコーン製、KF−8010(分子量:900))24.3g(0.045モル)及びN−メチル−2−ピロリドン169gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、4,無水酢酸で再結晶精製した4’−(4,4’−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)31.23g(0.1モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン112.7gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドF)を得た。(ポリイミドのTg:25℃、重量平均分子量:35000、SP値:9.8)
<ポリイミドG>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、2,2−ビス(4−アミノフェノキシフェニル)プロパン6.83g(0.05モル)、4,9−ジオキサデカン−1,12−ジアミン3.40g(0.05モル)、及びN−メチル−2−ピロリドン110.5gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製したデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)17.40g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン74gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドG)を得た。(ポリイミドのTg:73℃、重量平均分子量:84300、SP値:10.9)
<ポリイミドH>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、4,9−ジオキサデカン−1,12−ジアミン4.28g(0.07モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学製、LP−7100)1.87g(0.025モル)、ポリシロキサンジアミン(信越シリコーン製、KF−8010(分子量:900))1.32g(0.005モル)、及びN−メチル−2−ピロリドン72.2gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−オキシジフタル酸二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:3.2℃)7.44g(0.08モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)3.14g(0.02モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン48.13gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドH)を得た。(ポリイミドのTg:40℃、重量平均分子量:91800、SP値:12.3)
<ポリイミドI>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、4,7,10−トリオキサトリデカン−1,13−ジアミン4.62g(0.07モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学製、LP−7100)1.87g(0.025モル)、ポリシロキサンジアミン(信越シリコーン製、KF−8010(分子量:900))1.32g(0.005モル)、及びN−メチル−2−ピロリドン73.56gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4´−オキシジフタル酸二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:3.2℃)7.44g(0.08モル)、及びデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)3.14g(0.02モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン49.04gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドI)を得た。(ポリイミドのTg:37℃、重量平均分子量:35600、SP値:12.4)
<ポリイミドJ>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、2,2−ビス(4−アミノフェノキシフェニル)プロパン6.17g(0.05モル)、ポリシロキサンジアミン(信越シリコーン製、KF−8010(分子量:900))13.20g(0.05モル)、及びN−メチル−2−ピロリドン140.24gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製したデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)15.69g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン93.49gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドJ)を得た。(ポリイミドのTg:30℃、重量平均分子量:45600、SP値:9.9)
<ポリイミドK>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、1,12−ジアミノドデカン2.71g(0.045モル)、ポリエーテルジアミン(BASF製、ポリエーテルジアミン2000(分子量:1923))5.77g(0.01モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学製、LP−7100)3.35g(0.045モル)及びN−メチル−2−ピロリドン113gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸を用いて再結晶精製した4,4´−(4,4´−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(DSCによる発熱開始温度と発熱ピーク温度の差:2.5℃)15.62g(0.1モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン75.5gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドK)を得た。(ポリイミドのTg:53℃、重量平均分子量:58000、SP値:10.3)
<ポリイミドL>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、2,2−ビス(4−アミノフェノキシフェニル)プロパン13.67g(0.10モル)、及びN−メチル−2−ピロリドン124gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸を用いて再結晶精製したデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)17.40g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン83gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドL)を得た。(ポリイミドのTg:120℃、重量平均分子量:121000、SP値:10.8)
<ポリイミドM>
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、2,2−ビス(4−アミノフェノキシフェニル)プロパン2.73g(0.02モル)、ポリシロキサンジアミン(信越シリコーン製KF−8010(分子量:900))24.00g(0.08モル)、及びN−メチル−2−ピロリドン176.5gを仕込み攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸を用いて再結晶精製したデカメチレンビストリメリテート二無水物(DSCによる発熱開始温度と発熱ピーク温度の差:5.0℃)17.40g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン117.7gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去し、ポリイミド溶液(ポリイミドM)を得た。(ポリイミドのTg:40℃、重量平均分子量:19700、SP値:9.7)
略号
エポキシ樹脂
ESCN−195:住友化学、クレゾールノボラック型固体状エポキシ樹脂(エポキシ当量200、分子量:778)、
BEO−60E:新日本理化学、エチレンオキシド6モル付加体ビスフェノールA型液状エポキシ樹脂(エポキシ当量:373、分子量:746)、
BPO−20E:新日本理化学、プロピレンオキシド6モル付加体ビスフェノールA型液状エポキシ樹脂(エポキシ当量:314、分子量:628)、
XB−4122:旭チバ、アルキレンオキシド付加体ビスフェノールA型液状エポキシ樹脂(エポキシ当量:336、分子量:672)、
N−730:大日本インキ化学、フェノールノボラック型液状エポキシ樹脂(エポキシ当量:175、分子量:600〜800)、
EXA830CRP:大日本化学、ビスフェノールF型液状エポキシ樹脂(エポキシ当量:160、分子量:320)、
ESLV−80DE:新日本理化学、フェニルエーテル型固体状エポキシ樹脂(エポキシ当量:174、分子量:348)
その他の成分
H−1:明和化成、フェノールノボラック(OH当量:106、分子量:653)、
NH−7000:日本化薬、ナフトールノボラック(OH当量:140、分子量:420)、
XL−225、三井東圧化学、キシリレン変性フェノールノボラック(OH当量:175、分子量:420)、
NH−7000:日本化薬、ナフトールノボラック(OH当量:175、分子量:420)、
TrisP−PA:本州化学、トリスフェノールノボラック(OH当量:141、分子量:424)、
TPPK:東京化成、テトラフェニルホスホニウムテトラフェニルボラート、2PZ−CN:四国化成工業、1−シアノエチル−2−フェニルイミダゾール、
NMP:関東化学、N−メチル−2−ピロリドン、
HP−P1:水島合金鉄、窒化ホウ素(平均粒子径:1.0μm、最大粒子径:5.1μm)、
E−03:東海ミネラル、シリカ(平均粒子径:4.0μm、最大粒子径:11.4μm)、
SE−1:トクヤマ、シリカ(平均粒子径:0.8μm、最大粒子径:3.1μm)
これらワニスを40μmの厚さに、それぞれ基材(剥離剤処理PET)上に塗布し、オーブン中で80℃30分、続いて150℃30分加熱し、その後、室温で基材から剥がして、フィルム状接着剤を得た。
フィルム状接着剤又はレジスト材付き有機基板を両面接着テープでスライドグラスに貼り付けて固定し、上記フィルム状接着剤又はレジスト材付き有機基板の表面をヘキサンで洗浄し、窒素パージ処理したのち、60℃30分の条件で乾燥した試料を用い、水及びヨウ化メチレンに対する接触角を協和表面科学製(Model CA−D)を用いて、室温で測定した。フィルム状接着剤については、フィルム塗工時の基材側を測定面とした。
10mm×10mm×40μm厚サイズのフィルム状接着剤(未硬化フィルム)をサンプルとし、上記サンプルの上に10mm×10mm×50μm厚サイズのユーピレックスフィルムを重ね合わせ、2枚のスライドグラス(MATSUNAMI製、76mm×26mm×1.0〜1.2mm厚)の間に挟み、180℃の熱盤上で100kgf/cm2の荷重をかけ、120sec加熱圧着した後の上記ユーピレックスフィルムからのはみ出し量を、目盛り付き光学顕微鏡で観測したときの最大値をフロー量とした。
20mm×20mm×40μm厚サイズのフィルム状接着剤(180℃5hの条件で加熱硬化したフィルム)をサンプルとし、サンプルを真空乾燥機中で、120℃3h乾燥させ、デシケータ中で放冷後、乾燥重量をM1とし、乾燥後のサンプルをイオン交換水に室温で24時間浸漬してから取り出し、サンプル表面をろ紙でふきとり、すばやく秤量して、M2とする。[(M2−M1)/M1]×100=吸水率(wt%)として、吸水率を算出した。
180℃5hの条件で加熱硬化したフィルム状接着剤について、レオメトリックス製粘弾性アナライザーRSA−2を用いて、フィルムサイズ35mm×10mm×40μm厚、昇温速度5℃/min、周波数1Hz、測定温度−100〜300℃の条件で測定し、260℃における貯蔵弾性率、及びTg付近のtanδピーク温度を見積もった。
ウェハに対するピール剥離力(対ウェハ):調製後の40μm厚のフィルム状接着剤(未硬化フィルム)1をシリコンウェハ3の裏面に、図2に示されるロール2と、支持台4とを有する装置を用いてラミネートした。その際、装置のロール温度:80℃、線圧:4kgf/cm、送り速度:0.5m/minの条件で、5inch、300μm厚のシリコンウェハ3の裏面に上記フィルム状接着剤1をラミネートした。その後、図3に示す方法でフィルム状接着剤1(1cm幅)を90°方向に引き剥がしたときのピール剥離力を、ウェハに対するピール剥離力とした(測定速度:100mm/min)。
上記の条件で、5inch、400μm厚のシリコンウェハ裏面にフィルム状接着剤をラミネートし(ラミネート温度:80℃)、続いて上記のダイシングテープを上記と同様の条件でラミネートし、その後、ダイサーを用いて、ダイシング速度10mm/sec、回転数30000rpmの条件で、5mm×5mmサイズにダイシングしたときのチップ飛びの有無を観測し、上記チップ飛びが10%以下のときをチップ飛びなしとした。尚、ウェハ端部のチップ切り出し残部の飛びは評価の対象外とした。
△:ピックアップ可能なチップが50%以上90%未満
×:ピックアップ可能なチップが50%未満
<耐発泡性>
表面に厚さ15μmのソルダーレジスト層が付いた厚さ0.1mmの有機基板に5mm×5mm×0.55mm厚のガラスチップを5mm×5mm×40μm厚のフィルム状接着剤でフィルムのTg(ここではtanδピーク温度)+100℃×500gf/chip×3secの条件でダイボンディングした後、180℃×5kgf/chip×90secの条件で加熱圧着し、上記フィルム状接着剤を180℃、5hの条件で加熱硬化したのち、85℃85%RHの条件で15時間吸湿処理した後、260℃の熱盤上で30秒加熱したときのサンプルを、光学顕微鏡(×20倍)を用いて評価した。評価基準は以下のとおりである。
△:発泡がフィルム全体の10%以上50%未満
×:発泡がフィルム全体の50%以上
<せん断接着強度>
上記と同様の有機基板に3.2mm×3.2mm×0.4mm厚のシリコンチップを3.2mm×3.2mm×40μm厚のフィルム状接着剤でフィルムのTg+100℃×500gf/chip×3secの条件でダイボンディングした後、180℃×5kgf/chip×90secの条件で加熱圧着し、上記フィルム状接着剤を180℃5hの条件で加熱硬化したのち、85℃60%RHの条件で168時間吸湿処理した後、260℃の熱盤上で30秒加熱した後、Dage製BT2400を用い、測定速度:500μm/sec、測定ギャップ:50μmの条件でせん断接着強度を測定した。
上記と同様の有機基板に5mm×5mm×0.4mm厚のシリコンチップを5mm×5mm×40μm厚のフィルム状接着剤でフィルムのTg+100℃×500gf/chip×3secの条件でダイボンディングした後、180℃×5kgf/chip×90secの条件で加熱圧着し、上記フィルム状接着剤を180℃5hの条件で加熱硬化したのち、260℃の熱盤上で30秒加熱した後、図10に示す接着力評価装置を用い、測定速度:0.5mm/secの条件でピール強度を測定した。
表面に厚さ15μmのソルダーレジスト層が付いた、銅配線(配線高さ12μm)付きの厚さ0.1mmの有機基板に、6.5mm×6.5mm×280μm厚のシリコンチップを6.5mm×6.5mm×40μm厚のフィルム状接着剤で、フィルムのTg(ここではtanδピーク温度)+100℃×500gf/chip×3secの条件でダイボンディングした後、170℃3minの条件でワイヤボンディング相当の熱履歴をかけ、その後、トランスファモールドを行い(金型温度:180℃、キュアタイム:2min)、封止材をオーブン中で180℃5hの条件で加熱硬化して半導体パッケージを得た(CSP96pin、封止領域:10mm×10mm、厚み:0.8mm)。このパッケージを恒温恒湿器中で30℃60%RH192h吸湿処理した後、TAMURA製IRリフロー装置(パッケージ表面ピーク温度:265℃、温度プロファイル:パッケージ表面温度を基準にし、JEDEC規格に沿って調整)に3回繰り返し投入し、日立製作所製超音波探査映像装置HYE−FOUCUSを用いて、ダイボンディング層の剥離、及び破壊の有無を調べた。その後、パッケージの中心部を切断し、切断面を研磨した後、オリンパス製金属顕微鏡を用いて、パッケージの断面を観察し、ダイボンディング層の剥離、及び破壊の有無を調べた。これらの剥離、及び破壊が認められないことを耐リフロー性の評価基準とした。
耐湿性評価は、上記パッケージを温度121℃、湿度100%、2.03×105Paの雰囲気(プレッシャークッカ−テスト:PCT処理)で72時間処理後に、上記の方法で剥離を観察することにより行った。評価基準は以下のとおりである。
Claims (18)
- テトラカルボン酸二無水物と、下記一般式(I)で表される脂肪族エーテルジアミンおよび/または下記一般式(III)で表されるシロキサンジアミンを含むジアミンと、を反応させることにより、SP値が10.0〜11.0(cal/cm 3 ) 1/2 であり、かつ、Tgが−20〜60℃であるポリイミド樹脂であって、テトラカルボン酸二無水物として再結晶精製したテトラカルボン酸二無水物を用いて得られるポリイミド樹脂を、全ポリイミド樹脂の50重量%以上含有する(A)ポリイミド樹脂を得る工程、
(A)ポリイミド樹脂、(B)3官能以上のエポキシ樹脂および/または室温で固体状のエポキシ樹脂を含むエポキシ樹脂、(C)エポキシ樹脂硬化剤、並びに(D)フィラーを混合し、組成物を得る工程、および
前記組成物を用いて、tanδピーク温度が−20〜60℃であり、かつ、フロー量が100〜1500μmである接着剤層を形成する工程、
を有する、前記接着剤層を少なくとも備えたフィルム状接着剤の製造方法。
なお、前記SP値は、以下の式により算出された値であり、
SP値(δ)=ΣΔF/ΣΔυ
(ΣΔFは各種原子あるいは各種原子団の25℃におけるモル引力定数の総和、ΣΔυは各種原子あるいは各種原子団のモル体積の総和である。)
前記tanδピーク温度は、加熱硬化した後の接着剤層について動的粘弾性測定を行うことにより得られるTg付近のtanδピーク温度であり、
前記フロー量は、加熱硬化する前の接着剤層と他のフィルムとを、温度180℃、荷重100kgf/cm 2 で加熱圧着した際の、他のフィルムからの接着剤層のはみ出し量である。 - 前記(B)エポキシ樹脂は、3官能以上のエポキシ樹脂10〜90重量%、かつ室温で液状のエポキシ樹脂10〜90重量%を含む請求項1に記載のフィルム状接着剤の製造方法。
- 前記(A)ポリイミド樹脂100重量部に対して、前記(B)エポキシ樹脂が1〜50重量部含まれる請求項1または2に記載のフィルム状接着剤の製造方法。
- 前記(C)エポキシ樹脂硬化剤は、分子内に水酸基を2個以上有し、数平均分子量が400〜1500であるフェノール系化合物である請求項1〜3のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(C)エポキシ樹脂硬化剤は、分子内に芳香環を3個以上有するナフトール系化合物、又は、トリスフェノール系化合物である請求項1〜4のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(B)エポキシ樹脂のエポキシ当量と、前記(C)エポキシ樹脂硬化剤のOH当量の当量比が、0.95〜1.05:0.95〜1.05である請求項1〜5のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(A)ポリイミド樹脂が、テトラカルボン酸二無水物と下記一般式(I)
で表される脂肪族エーテルジアミンを全ジアミンの1〜90モル%、下記一般式(II)
で表される脂肪族ジアミンを全ジアミンの0〜99モル%、及び下記一般式(III)
で表されるシロキサンジアミンを全ジアミンの0〜99モル%含むジアミンとを反応させて得られるポリイミド樹脂である請求項1〜7のいずれか1項に記載のフィルム状接着剤の製造方法。 - 前記(A)ポリイミド樹脂が、エステル結合を含有しないテトラカルボン酸二無水物を全テトラカルボン酸二無水物の50モル%以上含むテトラカルボン酸二無水物と、ジアミンとを反応させて得られるポリイミド樹脂である請求項1〜8のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(D)フィラーが絶縁性のフィラーである請求項1〜11のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(D)フィラーの平均粒子径が10μm以下、最大粒子径が25μm以下である請求項1〜12のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記(D)フィラーの含量が1〜50体積%である請求項1〜13のいずれか1項に記載のフィルム状接着剤の製造方法。
- 前記フィルム状接着剤の表面エネルギーと、ソルダーレジスト材が付いた有機基板の表面エネルギーの差が10mN/m以内である請求項1〜14のいずれか1項に記載のフィルム状接着剤の製造方法。
- シリコンウェハに80℃でラミネートした段階で、前記シリコンウェハに対する25℃での90°ピール剥離力が5N/m以上である請求項1〜15のいずれか1項に記載のフィルム状接着剤の製造方法。
- 請求項1〜16いずれか1項に記載のフィルム状接着剤の製造方法によりフィルム状接着剤を得る工程、および
基材層、粘着剤層、および前記フィルム状接着剤をこの順に積層する工程
を有する、接着シートの製造方法。 - 前記粘着剤層が、放射線硬化型粘着剤層である請求項17に記載の接着シートの製造方法。
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2004
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- 2004-06-09 TW TW093116503A patent/TWI304835B/zh not_active IP Right Cessation
- 2004-06-10 US US10/560,073 patent/US20070098995A1/en not_active Abandoned
- 2004-06-10 KR KR1020057023276A patent/KR101094589B1/ko not_active IP Right Cessation
- 2004-06-10 KR KR1020117008895A patent/KR101148426B1/ko not_active IP Right Cessation
- 2004-06-10 WO PCT/JP2004/008472 patent/WO2004111148A1/ja active Application Filing
- 2004-06-10 CN CN2008100952377A patent/CN101266925B/zh not_active Expired - Fee Related
- 2004-06-10 JP JP2005506989A patent/JPWO2004111148A1/ja active Pending
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MY142246A (en) | 2010-11-15 |
JP2013010961A (ja) | 2013-01-17 |
KR101094589B1 (ko) | 2011-12-15 |
US20070098995A1 (en) | 2007-05-03 |
TW200513509A (en) | 2005-04-16 |
TWI304835B (en) | 2009-01-01 |
KR20110044931A (ko) | 2011-05-02 |
WO2004111148A1 (ja) | 2004-12-23 |
CN1802421A (zh) | 2006-07-12 |
CN100393835C (zh) | 2008-06-11 |
JPWO2004111148A1 (ja) | 2006-07-20 |
KR20060018876A (ko) | 2006-03-02 |
JP5533957B2 (ja) | 2014-06-25 |
US20110193244A1 (en) | 2011-08-11 |
KR101148426B1 (ko) | 2012-05-25 |
JP2010018814A (ja) | 2010-01-28 |
CN101266925B (zh) | 2010-07-07 |
CN101266925A (zh) | 2008-09-17 |
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