JP5082671B2 - はんだ修正装置およびはんだ修正方法 - Google Patents
はんだ修正装置およびはんだ修正方法 Download PDFInfo
- Publication number
- JP5082671B2 JP5082671B2 JP2007212278A JP2007212278A JP5082671B2 JP 5082671 B2 JP5082671 B2 JP 5082671B2 JP 2007212278 A JP2007212278 A JP 2007212278A JP 2007212278 A JP2007212278 A JP 2007212278A JP 5082671 B2 JP5082671 B2 JP 5082671B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- partition plate
- reference plane
- stage
- play
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/029—Solder or residue removing devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (5)
- 特定スポット内で少なくとも対象物の特定部位を基準平面上に配置するステージと、前記ステージ上の前記特定スポットに向けて照射源からエネルギビームを照射し、前記対象物の前記特定部位に熱エネルギを付与する加熱ユニットと、前記基準平面に直交する垂直姿勢で前記特定スポットに向かって変位し、はんだに対して低い濡れ性を有する仕切り板と、遊びの範囲内で垂直方向に前記仕切り板の相対変位を許容しつつ前記仕切り板を保持し、前記仕切り板の上下動を引き起こす上下動機構とを備え、前記遊びの下限位置で前記仕切り板と前記基準平面との間にはクリアランスが形成されることを特徴とするはんだ修正装置。
- 請求項1に記載のはんだ修正装置において、前記基準平面に直交する回転軸回りで回転自在に前記仕切り板を支持する仕切り板支持機構をさらに備えることを特徴とするはんだ修正装置。
- プリント基板上で複数の電極パッドに跨るはんだをステージの特定スポット内で所定の基準平面上に配置する工程と、遊びの範囲内で垂直方向に仕切り板の相対変位を許容しつつ前記仕切り板を保持する上下動機構で、前記はんだに対して低い濡れ性を有して前記基準平面に直交する垂直姿勢の前記仕切り板を下降させる工程と、前記仕切り板が固形の前記はんだに接触した後に前記上下動機構の動作を持続し、前記遊び内で前記仕切り板を相対変位させる工程と、前記上下動機構の動作を停止し、固形の前記はんだで前記仕切り板を下支えさせる工程と、前記はんだに向かってエネルギビームを照射し前記はんだを溶融させ、前記遊びの範囲内で前記仕切り板を落下させてはんだを分断する工程とを備えることを特徴とするはんだ修正方法。
- 請求項3に記載のはんだ修正方法において、前記遊びの下限位置で前記仕切り板と前記プリント基板の表面との間にはクリアランスが形成されることを特徴とするはんだ修正方法。
- 請求項3または4に記載のはんだ修正方法において、前記仕切り板は、前記基準平面に
直交する回転軸回りで回転することを特徴とするはんだ修正方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007212278A JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
TW097125524A TWI369930B (en) | 2007-08-16 | 2008-07-07 | Solder repairing apparatus and method of repairing solder |
US12/216,997 US7748594B2 (en) | 2007-08-16 | 2008-07-14 | Solder repairing apparatus and method of repairing solder |
KR1020080070025A KR101030467B1 (ko) | 2007-08-16 | 2008-07-18 | 땜납 수정 장치 및 땜납 수정 방법 |
CN2008101312414A CN101370359B (zh) | 2007-08-16 | 2008-08-01 | 焊料修复设备及修复焊料的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007212278A JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009049102A JP2009049102A (ja) | 2009-03-05 |
JP5082671B2 true JP5082671B2 (ja) | 2012-11-28 |
Family
ID=40362192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007212278A Expired - Fee Related JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7748594B2 (ja) |
JP (1) | JP5082671B2 (ja) |
KR (1) | KR101030467B1 (ja) |
CN (1) | CN101370359B (ja) |
TW (1) | TWI369930B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011211073A (ja) * | 2010-03-30 | 2011-10-20 | Fujitsu Ltd | 電子部品のリペア装置、リペア方法、およびリペア用伝熱キャップ部材 |
CN106465548B (zh) * | 2014-05-13 | 2019-04-02 | 株式会社村田制作所 | 树脂密封型模块 |
WO2016125234A1 (ja) * | 2015-02-02 | 2016-08-11 | 株式会社イクス | 発光装置、校正係数の算出方法及び検査対象物の撮像画像の校正方法 |
DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
CN111515485B (zh) * | 2020-05-18 | 2021-01-12 | 嘉兴宜兼通电器有限公司 | 一种led灯珠的维修安装设备 |
US11317517B2 (en) * | 2020-06-12 | 2022-04-26 | PulseForge Incorporated | Method for connecting surface-mount electronic components to a circuit board |
CN114101835A (zh) * | 2021-11-10 | 2022-03-01 | 新沂市宏祥电子有限公司 | 一种带有收集功能的自动焊锡机 |
CN113873775B (zh) * | 2021-12-01 | 2022-04-01 | 江苏金晓电子信息股份有限公司 | 一种高密距显示屏pcb板维修围挡治具及维修方法 |
DE102022107543B3 (de) * | 2022-03-30 | 2023-08-24 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung, System und Verfahren zur Reparatur einer Prüfkontaktanordnung |
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US4896019A (en) * | 1985-12-09 | 1990-01-23 | Hyun Kim T | Electric soldering iron for simultaneously soldering or desoldering a row of integrated circuit leads |
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JP2707189B2 (ja) * | 1992-08-26 | 1998-01-28 | 株式会社日立製作所 | 電子部品の基板からの取外し方法及び装置 |
JPH06339769A (ja) | 1993-05-29 | 1994-12-13 | Noriyuki Yoshida | 半田ごてのこて先部分の製造方法 |
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-
2007
- 2007-08-16 JP JP2007212278A patent/JP5082671B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125524A patent/TWI369930B/zh not_active IP Right Cessation
- 2008-07-14 US US12/216,997 patent/US7748594B2/en not_active Expired - Fee Related
- 2008-07-18 KR KR1020080070025A patent/KR101030467B1/ko not_active IP Right Cessation
- 2008-08-01 CN CN2008101312414A patent/CN101370359B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090017974A (ko) | 2009-02-19 |
TW200911069A (en) | 2009-03-01 |
KR101030467B1 (ko) | 2011-04-25 |
US7748594B2 (en) | 2010-07-06 |
CN101370359B (zh) | 2012-02-08 |
US20090045245A1 (en) | 2009-02-19 |
JP2009049102A (ja) | 2009-03-05 |
CN101370359A (zh) | 2009-02-18 |
TWI369930B (en) | 2012-08-01 |
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