JP2009049102A - はんだ修正装置およびはんだ修正方法 - Google Patents
はんだ修正装置およびはんだ修正方法 Download PDFInfo
- Publication number
- JP2009049102A JP2009049102A JP2007212278A JP2007212278A JP2009049102A JP 2009049102 A JP2009049102 A JP 2009049102A JP 2007212278 A JP2007212278 A JP 2007212278A JP 2007212278 A JP2007212278 A JP 2007212278A JP 2009049102 A JP2009049102 A JP 2009049102A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- partition plate
- reference plane
- stage
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/029—Solder or residue removing devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】はんだ修正装置ではステージ15、14上の特定スポットにはんだ51aは配置される。熱エネルギの働きではんだ51aは溶融する。このとき、垂直姿勢で仕切り板25が特定スポットに進入すると、仕切り板25ははんだ51aに進入していく。仕切り板25ははんだ51aに対して低い濡れ性を備えることから、仕切り板25ははんだ51aを弾く。こうしてはんだ51aは分断されることができる。こうしたはんだ51aの分断に基づき電子回路のショートは確実に解消されることができる。
【選択図】図7
Description
Claims (6)
- 特定スポット内で少なくとも対象物の特定部位の表面を基準平面に沿って配置するステージと、ステージ上の特定スポットに向けて熱エネルギを付与する加熱ユニットと、基準平面に直交する垂直姿勢で前記特定スポットに進入し、はんだに対して低い濡れ性を有する仕切り板とを備えることを特徴とするはんだ修正装置。
- 請求項1に記載のはんだ修正装置において、前記加熱ユニットは、エネルギビームを照射する照射源を備えることを特徴とするはんだ修正装置。
- 請求項1に記載のはんだ修正装置において、前記基準平面に直交する回転軸回りで回転自在に前記仕切り板を支持する仕切り板支持機構をさらに備えることを特徴とするはんだ修正装置。
- プリント基板上で複数の電極パッドに跨るはんだを所定の基準平面に沿って配置する工程と、はんだに向かって熱エネルギを付与し、はんだを溶融させる工程と、基準平面に直交する垂直姿勢の仕切り板で、溶融したはんだを分断する工程とを備えることを特徴とするはんだ修正方法。
- 請求項4に記載のはんだ修正方法において、前記熱エネルギの付与にあたって照射源からエネルギビームを照射することを特徴とするはんだ修正方法。
- 請求項4に記載のはんだ修正方法において、前記仕切り板は、前記基準平面に直交する回転軸回りで回転することを特徴とするはんだ修正方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007212278A JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
TW097125524A TWI369930B (en) | 2007-08-16 | 2008-07-07 | Solder repairing apparatus and method of repairing solder |
US12/216,997 US7748594B2 (en) | 2007-08-16 | 2008-07-14 | Solder repairing apparatus and method of repairing solder |
KR1020080070025A KR101030467B1 (ko) | 2007-08-16 | 2008-07-18 | 땜납 수정 장치 및 땜납 수정 방법 |
CN2008101312414A CN101370359B (zh) | 2007-08-16 | 2008-08-01 | 焊料修复设备及修复焊料的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007212278A JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009049102A true JP2009049102A (ja) | 2009-03-05 |
JP5082671B2 JP5082671B2 (ja) | 2012-11-28 |
Family
ID=40362192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007212278A Expired - Fee Related JP5082671B2 (ja) | 2007-08-16 | 2007-08-16 | はんだ修正装置およびはんだ修正方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7748594B2 (ja) |
JP (1) | JP5082671B2 (ja) |
KR (1) | KR101030467B1 (ja) |
CN (1) | CN101370359B (ja) |
TW (1) | TWI369930B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015174202A1 (ja) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | 樹脂封止型モジュール |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011211073A (ja) * | 2010-03-30 | 2011-10-20 | Fujitsu Ltd | 電子部品のリペア装置、リペア方法、およびリペア用伝熱キャップ部材 |
WO2016125234A1 (ja) * | 2015-02-02 | 2016-08-11 | 株式会社イクス | 発光装置、校正係数の算出方法及び検査対象物の撮像画像の校正方法 |
DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
CN111515485B (zh) * | 2020-05-18 | 2021-01-12 | 嘉兴宜兼通电器有限公司 | 一种led灯珠的维修安装设备 |
US11317517B2 (en) * | 2020-06-12 | 2022-04-26 | PulseForge Incorporated | Method for connecting surface-mount electronic components to a circuit board |
CN114101835A (zh) * | 2021-11-10 | 2022-03-01 | 新沂市宏祥电子有限公司 | 一种带有收集功能的自动焊锡机 |
CN113873775B (zh) * | 2021-12-01 | 2022-04-01 | 江苏金晓电子信息股份有限公司 | 一种高密距显示屏pcb板维修围挡治具及维修方法 |
DE102022107543B3 (de) * | 2022-03-30 | 2023-08-24 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung, System und Verfahren zur Reparatur einer Prüfkontaktanordnung |
Citations (5)
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JPH02262396A (ja) * | 1989-04-03 | 1990-10-25 | Seiko Instr Inc | はんだ付け機のブリッジ除去装置 |
JPH05152735A (ja) * | 1991-11-28 | 1993-06-18 | Komatsu Giken Kk | 半田ブリツジの修正装置 |
JPH05308187A (ja) * | 1991-11-28 | 1993-11-19 | Komatsu Giken Kk | ハンダ付け検査修正装置 |
JP2005166877A (ja) * | 2003-12-02 | 2005-06-23 | Matsushita Electric Ind Co Ltd | シート拡張装置 |
JP2006303060A (ja) * | 2005-04-19 | 2006-11-02 | Matsushita Electric Ind Co Ltd | ボンディング装置およびボンディングヘッドならびに電子部品のボンディング方法 |
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2007
- 2007-08-16 JP JP2007212278A patent/JP5082671B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125524A patent/TWI369930B/zh not_active IP Right Cessation
- 2008-07-14 US US12/216,997 patent/US7748594B2/en not_active Expired - Fee Related
- 2008-07-18 KR KR1020080070025A patent/KR101030467B1/ko not_active IP Right Cessation
- 2008-08-01 CN CN2008101312414A patent/CN101370359B/zh not_active Expired - Fee Related
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JPH02262396A (ja) * | 1989-04-03 | 1990-10-25 | Seiko Instr Inc | はんだ付け機のブリッジ除去装置 |
JPH05152735A (ja) * | 1991-11-28 | 1993-06-18 | Komatsu Giken Kk | 半田ブリツジの修正装置 |
JPH05308187A (ja) * | 1991-11-28 | 1993-11-19 | Komatsu Giken Kk | ハンダ付け検査修正装置 |
JP2005166877A (ja) * | 2003-12-02 | 2005-06-23 | Matsushita Electric Ind Co Ltd | シート拡張装置 |
JP2006303060A (ja) * | 2005-04-19 | 2006-11-02 | Matsushita Electric Ind Co Ltd | ボンディング装置およびボンディングヘッドならびに電子部品のボンディング方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2015174202A1 (ja) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | 樹脂封止型モジュール |
Also Published As
Publication number | Publication date |
---|---|
TW200911069A (en) | 2009-03-01 |
TWI369930B (en) | 2012-08-01 |
KR101030467B1 (ko) | 2011-04-25 |
CN101370359B (zh) | 2012-02-08 |
KR20090017974A (ko) | 2009-02-19 |
JP5082671B2 (ja) | 2012-11-28 |
US7748594B2 (en) | 2010-07-06 |
CN101370359A (zh) | 2009-02-18 |
US20090045245A1 (en) | 2009-02-19 |
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