TWI369930B - Solder repairing apparatus and method of repairing solder - Google Patents

Solder repairing apparatus and method of repairing solder

Info

Publication number
TWI369930B
TWI369930B TW097125524A TW97125524A TWI369930B TW I369930 B TWI369930 B TW I369930B TW 097125524 A TW097125524 A TW 097125524A TW 97125524 A TW97125524 A TW 97125524A TW I369930 B TWI369930 B TW I369930B
Authority
TW
Taiwan
Prior art keywords
solder
repairing
repairing apparatus
repairing solder
solder repairing
Prior art date
Application number
TW097125524A
Other languages
English (en)
Other versions
TW200911069A (en
Inventor
Keiichi Yamamoto
Toru Okada
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200911069A publication Critical patent/TW200911069A/zh
Application granted granted Critical
Publication of TWI369930B publication Critical patent/TWI369930B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/029—Solder or residue removing devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW097125524A 2007-08-16 2008-07-07 Solder repairing apparatus and method of repairing solder TWI369930B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007212278A JP5082671B2 (ja) 2007-08-16 2007-08-16 はんだ修正装置およびはんだ修正方法

Publications (2)

Publication Number Publication Date
TW200911069A TW200911069A (en) 2009-03-01
TWI369930B true TWI369930B (en) 2012-08-01

Family

ID=40362192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125524A TWI369930B (en) 2007-08-16 2008-07-07 Solder repairing apparatus and method of repairing solder

Country Status (5)

Country Link
US (1) US7748594B2 (zh)
JP (1) JP5082671B2 (zh)
KR (1) KR101030467B1 (zh)
CN (1) CN101370359B (zh)
TW (1) TWI369930B (zh)

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* Cited by examiner, † Cited by third party
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JP2011211073A (ja) 2010-03-30 2011-10-20 Fujitsu Ltd 電子部品のリペア装置、リペア方法、およびリペア用伝熱キャップ部材
JP6354842B2 (ja) * 2014-05-13 2018-07-11 株式会社村田製作所 樹脂封止型モジュール
WO2016125234A1 (ja) * 2015-02-02 2016-08-11 株式会社イクス 発光装置、校正係数の算出方法及び検査対象物の撮像画像の校正方法
DE102015106298B4 (de) * 2015-04-24 2017-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes
CN111515485B (zh) * 2020-05-18 2021-01-12 嘉兴宜兼通电器有限公司 一种led灯珠的维修安装设备
US11317517B2 (en) * 2020-06-12 2022-04-26 PulseForge Incorporated Method for connecting surface-mount electronic components to a circuit board
CN114101835A (zh) * 2021-11-10 2022-03-01 新沂市宏祥电子有限公司 一种带有收集功能的自动焊锡机
CN113873775B (zh) * 2021-12-01 2022-04-01 江苏金晓电子信息股份有限公司 一种高密距显示屏pcb板维修围挡治具及维修方法
DE102022107543B3 (de) * 2022-03-30 2023-08-24 Pac Tech - Packaging Technologies Gmbh Vorrichtung, System und Verfahren zur Reparatur einer Prüfkontaktanordnung
CN116000537A (zh) * 2023-01-12 2023-04-25 中国科学院空天信息创新研究院 适用于行波管波导窗组件焊接的工装和焊接方法

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US4896019A (en) * 1985-12-09 1990-01-23 Hyun Kim T Electric soldering iron for simultaneously soldering or desoldering a row of integrated circuit leads
JPH0746747B2 (ja) * 1986-09-09 1995-05-17 松下電器産業株式会社 半導体レーザのボンディング方法
US4768698A (en) * 1986-10-03 1988-09-06 Pace Incorporated X-Y table with θ rotation
JPS63168277A (ja) * 1986-12-29 1988-07-12 Toshiba Corp 電子部品の実装装置
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JP2006026692A (ja) * 2004-07-16 2006-02-02 Hitachi Global Storage Technologies Netherlands Bv スライダ・パッドから無鉛ハンダを除去する方法および磁気ディスク装置
JP4525439B2 (ja) * 2005-04-19 2010-08-18 パナソニック株式会社 ボンディング装置およびボンディングヘッドならびに電子部品のボンディング方法
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Also Published As

Publication number Publication date
US20090045245A1 (en) 2009-02-19
JP5082671B2 (ja) 2012-11-28
CN101370359A (zh) 2009-02-18
KR101030467B1 (ko) 2011-04-25
US7748594B2 (en) 2010-07-06
JP2009049102A (ja) 2009-03-05
KR20090017974A (ko) 2009-02-19
CN101370359B (zh) 2012-02-08
TW200911069A (en) 2009-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees