JP5078672B2 - 粘着テープの貼着装置及び貼着方法 - Google Patents

粘着テープの貼着装置及び貼着方法 Download PDF

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Publication number
JP5078672B2
JP5078672B2 JP2008050474A JP2008050474A JP5078672B2 JP 5078672 B2 JP5078672 B2 JP 5078672B2 JP 2008050474 A JP2008050474 A JP 2008050474A JP 2008050474 A JP2008050474 A JP 2008050474A JP 5078672 B2 JP5078672 B2 JP 5078672B2
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JP
Japan
Prior art keywords
adhesive tape
tape
release
cutter
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008050474A
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English (en)
Japanese (ja)
Other versions
JP2009154284A5 (ko
JP2009154284A (ja
Inventor
悦郎 南浜
治雄 森
圭剛 広瀬
和仁 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2008050474A priority Critical patent/JP5078672B2/ja
Priority to CN2008801185224A priority patent/CN101883729B/zh
Priority to PCT/JP2008/070610 priority patent/WO2009072377A1/ja
Priority to KR1020107014951A priority patent/KR101184132B1/ko
Priority to TW097144843A priority patent/TWI462815B/zh
Publication of JP2009154284A publication Critical patent/JP2009154284A/ja
Publication of JP2009154284A5 publication Critical patent/JP2009154284A5/ja
Application granted granted Critical
Publication of JP5078672B2 publication Critical patent/JP5078672B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
JP2008050474A 2007-12-06 2008-02-29 粘着テープの貼着装置及び貼着方法 Active JP5078672B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008050474A JP5078672B2 (ja) 2007-12-06 2008-02-29 粘着テープの貼着装置及び貼着方法
CN2008801185224A CN101883729B (zh) 2007-12-06 2008-11-12 粘着带的粘贴装置及粘贴方法
PCT/JP2008/070610 WO2009072377A1 (ja) 2007-12-06 2008-11-12 粘着テープの切断装置及び切断方法、粘着テープの貼着装置及び貼着方法
KR1020107014951A KR101184132B1 (ko) 2007-12-06 2008-11-12 점착 테이프의 접착 장치 및 접착 방법
TW097144843A TWI462815B (zh) 2007-12-06 2008-11-20 Adhesive tape is attached to the device and close to the method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007316051 2007-12-06
JP2007316051 2007-12-06
JP2008050474A JP5078672B2 (ja) 2007-12-06 2008-02-29 粘着テープの貼着装置及び貼着方法

Publications (3)

Publication Number Publication Date
JP2009154284A JP2009154284A (ja) 2009-07-16
JP2009154284A5 JP2009154284A5 (ko) 2010-07-01
JP5078672B2 true JP5078672B2 (ja) 2012-11-21

Family

ID=40958845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008050474A Active JP5078672B2 (ja) 2007-12-06 2008-02-29 粘着テープの貼着装置及び貼着方法

Country Status (5)

Country Link
JP (1) JP5078672B2 (ko)
KR (1) KR101184132B1 (ko)
CN (1) CN101883729B (ko)
TW (1) TWI462815B (ko)
WO (1) WO2009072377A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037506B4 (de) * 2009-08-17 2011-09-15 Karl Eugen Fischer Gmbh Schneideinrichtung zum Schneiden eines dünnen und klebrigen Bandes, insbesondere eines Cordbandes
CN102172918A (zh) * 2011-01-06 2011-09-07 硕方科技（北京）有限公司 半切控制设备及方法
JP5408177B2 (ja) * 2011-04-18 2014-02-05 パナソニック株式会社 Ａｃｆ貼着装置
TWI618131B (zh) * 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
JP6431256B2 (ja) * 2013-10-11 2018-11-28 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
JP6086883B2 (ja) * 2014-09-01 2017-03-01 株式会社シーティーケイ 長尺材料切断装置
JP6622461B2 (ja) * 2015-02-05 2019-12-18 リンテック株式会社 シート製造装置
JP6463160B2 (ja) * 2015-02-05 2019-01-30 リンテック株式会社 シート製造装置
CN106477377B (zh) * 2016-12-12 2018-05-11 深圳市欣中大自动化技术有限公司 一种覆盖膜半切装置
JP2018104152A (ja) * 2016-12-27 2018-07-05 スリーエム イノベイティブ プロパティズ カンパニー テープ切断装置
EP3351361A1 (en) * 2017-01-19 2018-07-25 3M Innovative Properties Company Apparatus for scoring a layer adhesively placed on a substrate and method of separating such a layer
JP6901122B2 (ja) * 2017-05-11 2021-07-14 マルゴ工業株式会社 テープ貼付ユニット及びテープ貼付装置
DE102017011506B4 (de) 2017-12-13 2021-01-28 Lts Lohmann Therapie-Systeme Ag Trennvorrichtung und Trennverfahren für klebstoffhaltiges Verbundmaterial
CN110682336A (zh) * 2019-09-19 2020-01-14 无锡先导智能装备股份有限公司 一种贴胶装置及其切胶机构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08133560A (ja) * 1994-11-09 1996-05-28 Toshiba Corp 粘着性テープ片の貼着装置および貼着方法
JPH11160695A (ja) * 1997-11-28 1999-06-18 Optrex Corp 偏光膜剥離方法およびその装置
JP4230120B2 (ja) * 2001-02-28 2009-02-25 キヤノンファインテック株式会社 印字テープの半切り装置
JP4080187B2 (ja) * 2001-08-02 2008-04-23 芝浦メカトロニクス株式会社 テープ部材貼着装置
JP4461753B2 (ja) * 2003-09-24 2010-05-12 セイコーエプソン株式会社 液晶装置及び電子機器
JP2006121035A (ja) * 2004-09-27 2006-05-11 Ngk Spark Plug Co Ltd フィルム剥離装置、配線基板の製造方法
JP5076292B2 (ja) * 2005-08-08 2012-11-21 パナソニック株式会社 異方導電膜貼付装置及び方法
JP4417893B2 (ja) * 2005-08-10 2010-02-17 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法

Also Published As

Publication number Publication date
CN101883729A (zh) 2010-11-10
KR20100090303A (ko) 2010-08-13
KR101184132B1 (ko) 2012-09-18
TW200934631A (en) 2009-08-16
CN101883729B (zh) 2013-06-12
WO2009072377A1 (ja) 2009-06-11
JP2009154284A (ja) 2009-07-16
TWI462815B (zh) 2014-12-01

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