JP5065888B2 - 発光装置ならびに照明装置 - Google Patents

発光装置ならびに照明装置 Download PDF

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Publication number
JP5065888B2
JP5065888B2 JP2007509332A JP2007509332A JP5065888B2 JP 5065888 B2 JP5065888 B2 JP 5065888B2 JP 2007509332 A JP2007509332 A JP 2007509332A JP 2007509332 A JP2007509332 A JP 2007509332A JP 5065888 B2 JP5065888 B2 JP 5065888B2
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JP
Japan
Prior art keywords
light
light emitting
reflecting member
reflecting
emitting device
Prior art date
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Expired - Fee Related
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JP2007509332A
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English (en)
Japanese (ja)
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JPWO2006101174A1 (ja
Inventor
史明 関根
大輔 作本
裕樹 森
美津夫 柳澤
真吾 松浦
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Kyocera Corp
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Kyocera Corp
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Publication date
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Priority to JP2007509332A priority Critical patent/JP5065888B2/ja
Publication of JPWO2006101174A1 publication Critical patent/JPWO2006101174A1/ja
Application granted granted Critical
Publication of JP5065888B2 publication Critical patent/JP5065888B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Device Packages (AREA)
JP2007509332A 2005-03-24 2006-03-23 発光装置ならびに照明装置 Expired - Fee Related JP5065888B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007509332A JP5065888B2 (ja) 2005-03-24 2006-03-23 発光装置ならびに照明装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005085367 2005-03-24
JP2005085367 2005-03-24
JP2005312710 2005-10-27
JP2005312710 2005-10-27
JP2007509332A JP5065888B2 (ja) 2005-03-24 2006-03-23 発光装置ならびに照明装置
PCT/JP2006/305846 WO2006101174A1 (ja) 2005-03-24 2006-03-23 発光素子収納用パッケージおよび発光装置ならびに照明装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012053568A Division JP5437420B2 (ja) 2005-03-24 2012-03-09 発光素子収納用パッケージおよび発光装置ならびに照明装置

Publications (2)

Publication Number Publication Date
JPWO2006101174A1 JPWO2006101174A1 (ja) 2008-09-04
JP5065888B2 true JP5065888B2 (ja) 2012-11-07

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007509332A Expired - Fee Related JP5065888B2 (ja) 2005-03-24 2006-03-23 発光装置ならびに照明装置
JP2012053568A Expired - Fee Related JP5437420B2 (ja) 2005-03-24 2012-03-09 発光素子収納用パッケージおよび発光装置ならびに照明装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012053568A Expired - Fee Related JP5437420B2 (ja) 2005-03-24 2012-03-09 発光素子収納用パッケージおよび発光装置ならびに照明装置

Country Status (7)

Country Link
US (1) US8029152B2 (OSRAM)
JP (2) JP5065888B2 (OSRAM)
KR (1) KR100924474B1 (OSRAM)
CN (1) CN101147270B (OSRAM)
DE (1) DE112006000694B4 (OSRAM)
TW (1) TW200644190A (OSRAM)
WO (1) WO2006101174A1 (OSRAM)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277607A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 発光装置、線状発光装置、面状発光装置、液晶表示装置および電子機器
JP5178349B2 (ja) * 2008-06-26 2013-04-10 京セラ株式会社 発光装置および照明ユニット
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
JP2010123746A (ja) * 2008-11-19 2010-06-03 Toshiba Corp 光半導体装置と、照明装置および表示装置
JP5368809B2 (ja) * 2009-01-19 2013-12-18 ローム株式会社 Ｌｅｄモジュールの製造方法およびｌｅｄモジュール
KR101037789B1 (ko) * 2009-04-22 2011-05-27 주식회사 엠디티 도전부재가 도포되어 일체화된 절연재와 금속 하우징을 구비하는 발광다이오드 장착용 패키지
DE102009022611B4 (de) 2009-05-26 2012-03-08 Instrument Systems Optische Messtechnik Gmbh Kalibrierstrahlungsquelle
WO2011024502A1 (ja) * 2009-08-28 2011-03-03 京セラ株式会社 発光装置
DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
JP4991834B2 (ja) 2009-12-17 2012-08-01 シャープ株式会社 車両用前照灯
KR101047647B1 (ko) * 2010-01-15 2011-07-07 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법
JP5232815B2 (ja) 2010-02-10 2013-07-10 シャープ株式会社 車両用前照灯
US8469555B2 (en) * 2010-03-30 2013-06-25 Cooper Technologies Company Multi-reflector optical system
DE202010000518U1 (de) * 2010-03-31 2011-08-09 Turck Holding Gmbh Lampe mit einer in einem hermetisch verschlossenen Gehäuse angeordneten LED
DE102010015068A1 (de) * 2010-04-15 2011-10-20 Paul Voinea Lichtleitsystem
US8733996B2 (en) 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device, illuminating device, and vehicle headlamp
JP5255018B2 (ja) * 2010-05-17 2013-08-07 シャープ株式会社 レーザダウンライト及びレーザダウンライトシステム
CN101867008B (zh) * 2010-05-17 2012-11-21 中山大学佛山研究院 一种可自释放应力的led封装模块
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
JP5701523B2 (ja) 2010-06-22 2015-04-15 日東電工株式会社 半導体発光装置
JP5662064B2 (ja) * 2010-06-25 2015-01-28 パナソニックＩｐマネジメント株式会社 発光装置
JP2012023184A (ja) * 2010-07-14 2012-02-02 Sharp Corp 発光装置
US9816677B2 (en) 2010-10-29 2017-11-14 Sharp Kabushiki Kaisha Light emitting device, vehicle headlamp, illumination device, and laser element
JP2016086191A (ja) * 2010-11-05 2016-05-19 ローム株式会社 半導体発光装置
JP2014038876A (ja) * 2010-12-15 2014-02-27 Panasonic Corp 半導体発光装置
US8901578B2 (en) * 2011-05-10 2014-12-02 Rohm Co., Ltd. LED module having LED chips as light source
KR101262541B1 (ko) * 2011-07-18 2013-05-08 엘지이노텍 주식회사 표시장치
KR101219106B1 (ko) * 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
KR101241447B1 (ko) * 2011-08-03 2013-03-11 장종진 발광 다이오드 패키지 및 그의 제조 방법
EP2782150B1 (en) 2011-11-17 2018-08-15 Lumens Co., Ltd. Light emitting device package and backlight including same
KR101293934B1 (ko) * 2012-02-29 2013-08-16 (주) 아모엘이디 엘이디 패키지용 리플렉터 및 이를 포함하는 엘이디 패키지
US8931922B2 (en) * 2012-03-22 2015-01-13 Osram Sylvania Inc. Ceramic wavelength-conversion plates and light sources including the same
CN103367599A (zh) * 2012-04-03 2013-10-23 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
CN103489984B (zh) * 2012-06-13 2017-09-12 亿光电子工业股份有限公司 发光二极管封装结构及其制作方法
JP6099901B2 (ja) * 2012-08-23 2017-03-22 スタンレー電気株式会社 発光装置
JP2014060328A (ja) * 2012-09-19 2014-04-03 Nichia Chem Ind Ltd 発光装置
DE102012110957A1 (de) * 2012-11-14 2014-05-28 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement zur Emission von mischfarbiger Strahlung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
US9004727B2 (en) * 2013-01-15 2015-04-14 Snap-On Incorporated Interchangeable reflectors for light devices
EP2948709B1 (en) 2013-01-25 2016-10-05 Koninklijke Philips N.V. Lighting assembly and method for manufacturing a lighting assembly
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
JP6135032B2 (ja) * 2013-02-19 2017-05-31 スタンレー電気株式会社 発光装置、車両用灯具及び応力逃がし部成型方法
JP6172796B2 (ja) * 2013-06-07 2017-08-02 シチズン電子株式会社 Ｌｅｄ発光装置
KR101592649B1 (ko) * 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
CN105874615B (zh) * 2014-01-09 2020-01-03 亮锐控股有限公司 具有反射性侧壁的发光器件
EP2919284B1 (en) * 2014-03-14 2019-07-03 Citizen Electronics Co., Ltd. Light emitting apparatus
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
JP6582382B2 (ja) 2014-09-26 2019-10-02 日亜化学工業株式会社 発光装置の製造方法
JP6908859B2 (ja) * 2014-12-25 2021-07-28 日亜化学工業株式会社 半導体装置および半導体装置の製造方法
JP6065135B2 (ja) * 2015-04-02 2017-01-25 日亜化学工業株式会社 発光装置
EP3244459B1 (en) 2015-04-02 2020-10-14 Nichia Corporation Light emitting device
US10374134B2 (en) 2015-05-29 2019-08-06 Nichia Corporation Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
JP6183486B2 (ja) * 2015-05-29 2017-08-23 日亜化学工業株式会社 発光装置、被覆部材の製造方法及び発光装置の製造方法
JP6537136B2 (ja) * 2015-06-16 2019-07-03 大口マテリアル株式会社 Ｌｅｄパッケージ及び多列型ｌｅｄ用リードフレーム、並びにそれらの製造方法
US9966514B2 (en) * 2015-07-02 2018-05-08 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode package structure and fabrication method
JP6337859B2 (ja) * 2015-09-08 2018-06-06 日亜化学工業株式会社 発光装置
RU2018140496A (ru) * 2016-04-18 2020-05-19 Киосера Корпорейшн Корпус светоизлучающего элемента, массив и светоизлучающее устройство
EP3499559B1 (en) 2016-08-10 2023-11-22 Kyocera Corporation Package for mounting electrical element, array package and electrical device
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
TWI669029B (zh) * 2016-11-11 2019-08-11 日商京瓷股份有限公司 Package for mounting an electric component, array package, and electrical device
KR102680862B1 (ko) * 2016-12-16 2024-07-03 삼성전자주식회사 반도체 발광장치
DE202017103633U1 (de) * 2017-06-20 2018-09-24 Tridonic Jennersdorf Gmbh LED Modul mit Reflektor und integrierten Farbkonversionsmitteln
KR102631105B1 (ko) * 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
DE102017124155A1 (de) * 2017-10-17 2019-04-18 Osram Opto Semiconductors Gmbh Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
CN110176529B (zh) 2018-02-20 2022-03-08 晶元光电股份有限公司 发光元件及其制作方法
FR3082354B1 (fr) * 2018-06-08 2020-07-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Puce photonique traversee par un via
JP7266387B2 (ja) * 2018-11-12 2023-04-28 株式会社ジャパンディスプレイ 表示装置
JP6753452B2 (ja) * 2018-11-30 2020-09-09 日亜化学工業株式会社 発光モジュール
US11681090B2 (en) * 2019-05-30 2023-06-20 Nichia Corporation Light emitting module and method of manufacturing same
CN112305809B (zh) * 2019-07-24 2022-04-19 佛山市国星光电股份有限公司 Led线背光源液晶显示屏
DE102020114952B4 (de) * 2020-06-05 2024-07-18 Schott Ag Hermetisch dichtes optoelektronisches Modul mit erhöhter Auskopplung von elektromagnetischer Strahlung
CN114520281B (zh) 2020-11-20 2024-07-16 隆达电子股份有限公司 发光装置、背光板及显示面板
JP7566132B2 (ja) * 2021-03-15 2024-10-11 京セラ株式会社 発光装置および表示装置
DE102022205566A1 (de) * 2022-06-01 2023-12-07 Continental Automotive Technologies GmbH Anzeigevorrichtung und Fortbewegungsmittel
WO2024157784A1 (ja) * 2023-01-26 2024-08-02 住友電気工業株式会社 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2003532299A (ja) * 2000-04-26 2003-10-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ルミネセンス変換エレメントを備えた光放出半導体素子
JP2004207258A (ja) * 2002-10-28 2004-07-22 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005039194A (ja) * 2003-06-26 2005-02-10 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19536454B4 (de) 1995-09-29 2006-03-09 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
JP3065258B2 (ja) 1996-09-30 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JP2000156528A (ja) * 1998-11-19 2000-06-06 Sharp Corp 発光素子
DE10026435A1 (de) * 2000-05-29 2002-04-18 Osram Opto Semiconductors Gmbh Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED
JP2004103775A (ja) * 2002-09-09 2004-04-02 Eeshikku Kk チップｌｅｄ発光体の製造方法およびチップｌｅｄ発光体
US7112916B2 (en) * 2002-10-09 2006-09-26 Kee Siang Goh Light emitting diode based light source emitting collimated light
JP2004207672A (ja) 2002-10-28 2004-07-22 Kyocera Corp 発光素子収納用パッケージおよび発光装置
EP1605524B1 (en) * 2003-03-18 2010-06-30 Sumitomo Electric Industries, Ltd. Light emitting element mounting member, and semiconductor device using the same
JP4561954B2 (ja) * 2003-08-08 2010-10-13 東芝ライテック株式会社 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003532299A (ja) * 2000-04-26 2003-10-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ルミネセンス変換エレメントを備えた光放出半導体素子
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2004207258A (ja) * 2002-10-28 2004-07-22 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005039194A (ja) * 2003-06-26 2005-02-10 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置

Also Published As

Publication number Publication date
US20090296367A1 (en) 2009-12-03
KR100924474B1 (ko) 2009-11-03
TWI311803B (OSRAM) 2009-07-01
US8029152B2 (en) 2011-10-04
JP2012114468A (ja) 2012-06-14
WO2006101174A1 (ja) 2006-09-28
JP5437420B2 (ja) 2014-03-12
CN101147270A (zh) 2008-03-19
JPWO2006101174A1 (ja) 2008-09-04
KR20070117684A (ko) 2007-12-12
DE112006000694B4 (de) 2013-10-17
CN101147270B (zh) 2010-05-26
DE112006000694T5 (de) 2008-02-07
TW200644190A (en) 2006-12-16

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