JP4160935B2 - 発光素子収納用パッケージ、発光装置および照明装置 - Google Patents
発光素子収納用パッケージ、発光装置および照明装置 Download PDFInfo
- Publication number
- JP4160935B2 JP4160935B2 JP2004189543A JP2004189543A JP4160935B2 JP 4160935 B2 JP4160935 B2 JP 4160935B2 JP 2004189543 A JP2004189543 A JP 2004189543A JP 2004189543 A JP2004189543 A JP 2004189543A JP 4160935 B2 JP4160935 B2 JP 4160935B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- conductor layer
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
1a:搭載部
2:光反射部材
3:透明部材
5:発光素子
7:導体層
8:導電性接着材
9:凸部
20:発光装置
21:反射治具
22:発光装置駆動回路基板
Claims (5)
- 発光素子の搭載部を有する基体と、
前記搭載部を囲んで前記基体上に設けられた枠状の光反射部材と、
前記搭載部に設けられた導体層と、
前記導体層の周囲に設けられているとともに、内側に凹んだ曲面形状の下端部を含む側面を有しており、下側に向かうに伴って幅が大きくなっている絶縁体からなる凸部と、
を備えた発光素子収納用パッケージ。 - 発光素子の搭載部を有する基体と、
前記搭載部を囲んで前記基体上に設けられた枠状の光反射部材と、
前記搭載部に設けられた導体層と、
前記導体層の周囲に設けられているとともに、前記導体層側の側面と下面との間の傾斜角度が前記導体層と反対側の側面と前記下面との傾斜角度より大きくなっており、下側に向かうに伴って幅が大きくなっている絶縁体からなる凸部と、
を備えた発光素子収納用パッケージ。 - 発光素子の搭載部を有する基体と、
前記搭載部を囲んで前記基体上に設けられた枠状の光反射部材と、
前記搭載部に設けられた導体層と、
前記導体層の周囲に設けられており、前記導体層側の側面が前記基体の上面に対して垂直であるとともに、前記導体層と反対側の側面が外側に広がるように傾斜しており、下側に向かうに伴って幅が大きくなっている絶縁体からなる凸部と、
を備えた発光素子収納用パッケージ。 - 請求項1乃至請求項3のいずれかに記載された発光素子収納用パッケージと、
導電性接着剤を介して前記導体層に電気的に接続されており、前記搭載部に搭載された発光素子と、
を備えた発光装置。 - 請求項4に記載の発光装置を備えた照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189543A JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189543A JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013197A JP2006013197A (ja) | 2006-01-12 |
JP4160935B2 true JP4160935B2 (ja) | 2008-10-08 |
Family
ID=35780062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004189543A Expired - Fee Related JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4160935B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6507543B2 (ja) * | 2014-09-22 | 2019-05-08 | 東芝ライテック株式会社 | 光源装置 |
-
2004
- 2004-06-28 JP JP2004189543A patent/JP4160935B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006013197A (ja) | 2006-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3898721B2 (ja) | 発光装置および照明装置 | |
JP4143043B2 (ja) | 発光装置および照明装置 | |
JP2006049814A (ja) | 発光装置および照明装置 | |
JP4948818B2 (ja) | 発光装置および照明装置 | |
JP2006210627A (ja) | 発光素子収納用パッケージおよび発光装置ならびに照明装置 | |
JP3921474B2 (ja) | 発光装置および照明装置 | |
JP4948841B2 (ja) | 発光装置および照明装置 | |
JP2005210042A (ja) | 発光装置および照明装置 | |
JP2005159262A (ja) | 発光素子収納用パッケージおよび発光装置ならびに照明装置 | |
JP2006093399A (ja) | 発光装置およびその製造方法ならびに照明装置 | |
JP2005277331A (ja) | 発光装置および照明装置 | |
JP2006295230A (ja) | 発光装置および照明装置 | |
JP2006066657A (ja) | 発光装置および照明装置 | |
JP4845370B2 (ja) | 発光装置および照明装置 | |
JP4091926B2 (ja) | 発光装置および照明装置 | |
JP4557613B2 (ja) | 発光素子収納用パッケージ、発光装置および照明装置 | |
JP4417757B2 (ja) | 発光装置およびその製造方法ならびに照明装置 | |
JP2005310911A (ja) | 発光素子収納用パッケージおよび発光装置ならびに照明装置 | |
JP4511238B2 (ja) | 発光素子収納用パッケージおよび発光装置ならびに照明装置 | |
JP4593974B2 (ja) | 発光装置および照明装置 | |
JP4637623B2 (ja) | 発光装置および照明装置 | |
JP2007208292A (ja) | 発光装置 | |
JP4601404B2 (ja) | 発光装置および照明装置 | |
JP4160935B2 (ja) | 発光素子収納用パッケージ、発光装置および照明装置 | |
JP2006128322A (ja) | 発光装置および照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080129 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080328 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080624 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080718 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110725 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120725 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120725 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130725 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |