JP2006013197A - 発光素子収納用パッケージ、発光装置および照明装置 - Google Patents
発光素子収納用パッケージ、発光装置および照明装置 Download PDFInfo
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- JP2006013197A JP2006013197A JP2004189543A JP2004189543A JP2006013197A JP 2006013197 A JP2006013197 A JP 2006013197A JP 2004189543 A JP2004189543 A JP 2004189543A JP 2004189543 A JP2004189543 A JP 2004189543A JP 2006013197 A JP2006013197 A JP 2006013197A
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- Prior art keywords
- light emitting
- emitting element
- light
- conductor layer
- emitting device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
【解決手段】 発光素子収納用パッケージは、上面の中央部に発光素子5の搭載部1aを有する基体1と、基体1の上面の外周部に搭載部1aを取り囲んで設けられた枠状の光反射部材2と、搭載部1aに形成された、発光素子5が導電性接着材8を介して電気的に接続される導体層7とを具備しており、導体層7は、周囲に下側に向かうに伴って幅が大きくなっている絶縁体から成る凸部が形成されている。
【選択図】 図1
Description
1a:搭載部
2:光反射部材
3:透明部材
5:発光素子
7:導体層
8:導電性接着材
9:凸部
20:発光装置
21:反射治具
22:発光装置駆動回路基板
Claims (4)
- 上面の中央部に発光素子の搭載部を有する基体と、該基体の上面の外周部に前記搭載部を取り囲んで設けられた枠状の光反射部材と、前記搭載部に形成された、前記発光素子が導電性接着材を介して電気的に接続される導体層とを具備しており、該導体層は、周囲に下側に向かうに伴って幅が大きくなっている絶縁体から成る凸部が形成されていることを特徴とする発光素子収納用パッケージ。
- 前記凸部は、その上端が前記発光素子の下面の外周部に位置することを特徴とする請求項1記載の発光素子収納用パッケージ。
- 請求項1または請求項2記載の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記導体層に導電性接着材を介して電気的に接続された前記発光素子と、前記発光素子を覆う透明部材とを具備していることを特徴とする発光装置。
- 請求項3記載の発光装置を所定の配置となるように設置したことを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189543A JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189543A JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013197A true JP2006013197A (ja) | 2006-01-12 |
JP4160935B2 JP4160935B2 (ja) | 2008-10-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004189543A Expired - Fee Related JP4160935B2 (ja) | 2004-06-28 | 2004-06-28 | 発光素子収納用パッケージ、発光装置および照明装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4160935B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016066642A (ja) * | 2014-09-22 | 2016-04-28 | 東芝ライテック株式会社 | 光源装置 |
-
2004
- 2004-06-28 JP JP2004189543A patent/JP4160935B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016066642A (ja) * | 2014-09-22 | 2016-04-28 | 東芝ライテック株式会社 | 光源装置 |
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JP4160935B2 (ja) | 2008-10-08 |
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