JP4561954B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4561954B2 JP4561954B2 JP2003290676A JP2003290676A JP4561954B2 JP 4561954 B2 JP4561954 B2 JP 4561954B2 JP 2003290676 A JP2003290676 A JP 2003290676A JP 2003290676 A JP2003290676 A JP 2003290676A JP 4561954 B2 JP4561954 B2 JP 4561954B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- substrate
- control body
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
12 発光素子としての発光ダイオード
13 基板
14 実装面
21 制光体
23 接触部
24 収容空間部
25 入射面
26 反射面
27 出射面
29 切欠部
31 放熱ケース
32 基部
33 係合部
41 連結手段
Claims (3)
- 発光素子と;
発光素子の両端がはんだ接続されて実装される実装面を有する基板と;
基板の実装面に接触する接触部、この接触部の内側で発光素子を収容する収容空間部、この収容空間部に臨み発光素子から発光した光が入射する入射面、入射面から入射した光を表面側へ向けて反射させる反射面、入射面から入射した直接光および反射面で反射した反射光を表面側へ出射させる出射面、および基板にはんだ接続される発光素子の両端方向に対応した方向でかつ発光素子から発光した光が向かう発光範囲外に接触部の内側の収納空間部と接触部の外側とを連通して設けられた切欠部を有する制光体と;
を具備していることを特徴とする発光装置。 - 基板に接触する基部、制光体に係合しこの制光体を介して基板を基部に接触させる係合部を有する放熱ケースを備えたことを特徴とする請求項1記載の発光装置。
- 基板と制光体とに互いに連結する連結手段を設けたことを特徴とする請求項1記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003290676A JP4561954B2 (ja) | 2003-08-08 | 2003-08-08 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003290676A JP4561954B2 (ja) | 2003-08-08 | 2003-08-08 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005064145A JP2005064145A (ja) | 2005-03-10 |
JP4561954B2 true JP4561954B2 (ja) | 2010-10-13 |
Family
ID=34368637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003290676A Expired - Fee Related JP4561954B2 (ja) | 2003-08-08 | 2003-08-08 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4561954B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8029152B2 (en) * | 2005-03-24 | 2011-10-04 | Kyocera Corporation | Package for light-emitting device, light-emitting apparatus, and illuminating apparatus |
JP4863203B2 (ja) * | 2006-04-28 | 2012-01-25 | スタンレー電気株式会社 | 半導体発光装置 |
TWI314366B (en) * | 2006-04-28 | 2009-09-01 | Delta Electronics Inc | Light emitting apparatus |
JP2008016565A (ja) * | 2006-07-04 | 2008-01-24 | Shinko Electric Ind Co Ltd | 発光素子収容体及びその製造方法、及び発光装置 |
JP2009176933A (ja) | 2008-01-24 | 2009-08-06 | Toshiba Corp | 発光装置及び照明装置 |
JP2009252898A (ja) | 2008-04-03 | 2009-10-29 | Toyoda Gosei Co Ltd | 光源装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02750U (ja) * | 1987-09-11 | 1990-01-05 | ||
JPH041065A (ja) * | 1990-04-19 | 1992-01-06 | Sanyo Electric Co Ltd | 光プリントヘッド |
JPH0418771A (ja) * | 1990-03-30 | 1992-01-22 | Toshiba Lighting & Technol Corp | 発光ダイオードアレイ装置 |
JPH08107235A (ja) * | 1991-07-19 | 1996-04-23 | Aisensu:Kk | 光電センサーの投光器 |
JPH09297543A (ja) * | 1996-05-07 | 1997-11-18 | Kouha:Kk | 発光表示装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6489377A (en) * | 1987-09-29 | 1989-04-03 | Toshiba Corp | Led array |
-
2003
- 2003-08-08 JP JP2003290676A patent/JP4561954B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02750U (ja) * | 1987-09-11 | 1990-01-05 | ||
JPH0418771A (ja) * | 1990-03-30 | 1992-01-22 | Toshiba Lighting & Technol Corp | 発光ダイオードアレイ装置 |
JPH041065A (ja) * | 1990-04-19 | 1992-01-06 | Sanyo Electric Co Ltd | 光プリントヘッド |
JPH08107235A (ja) * | 1991-07-19 | 1996-04-23 | Aisensu:Kk | 光電センサーの投光器 |
JPH09297543A (ja) * | 1996-05-07 | 1997-11-18 | Kouha:Kk | 発光表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005064145A (ja) | 2005-03-10 |
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