JP5039495B2 - マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 - Google Patents
マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 Download PDFInfo
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- JP5039495B2 JP5039495B2 JP2007260796A JP2007260796A JP5039495B2 JP 5039495 B2 JP5039495 B2 JP 5039495B2 JP 2007260796 A JP2007260796 A JP 2007260796A JP 2007260796 A JP2007260796 A JP 2007260796A JP 5039495 B2 JP5039495 B2 JP 5039495B2
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- Prior art keywords
- defect
- mask blank
- mask
- light
- reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4704—Angular selective
- G01N2021/4711—Multiangle measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007260796A JP5039495B2 (ja) | 2007-10-04 | 2007-10-04 | マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 |
| US12/241,614 US7911600B2 (en) | 2007-10-04 | 2008-09-30 | Apparatus and a method for inspection of a mask blank, a method for manufacturing a reflective exposure mask, a method for reflective exposure, and a method for manufacturing semiconductor integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007260796A JP5039495B2 (ja) | 2007-10-04 | 2007-10-04 | マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009092407A JP2009092407A (ja) | 2009-04-30 |
| JP2009092407A5 JP2009092407A5 (enExample) | 2010-10-14 |
| JP5039495B2 true JP5039495B2 (ja) | 2012-10-03 |
Family
ID=40522970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007260796A Active JP5039495B2 (ja) | 2007-10-04 | 2007-10-04 | マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7911600B2 (enExample) |
| JP (1) | JP5039495B2 (enExample) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101535230B1 (ko) * | 2009-06-03 | 2015-07-09 | 삼성전자주식회사 | Euv 마스크용 공간 영상 측정 장치 및 방법 |
| US8711346B2 (en) | 2009-06-19 | 2014-04-29 | Kla-Tencor Corporation | Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks |
| EP2443440B1 (en) * | 2009-06-19 | 2019-11-27 | KLA-Tencor Corporation | Euv high throughput inspection system for defect detection on patterned euv masks, mask blanks, and wafers |
| NL2004949A (en) * | 2009-08-21 | 2011-02-22 | Asml Netherlands Bv | Inspection method and apparatus. |
| JP4715955B2 (ja) * | 2009-10-23 | 2011-07-06 | レーザーテック株式会社 | マスク検査方法、マスク検査装置 |
| JP5425593B2 (ja) * | 2009-11-13 | 2014-02-26 | ルネサスエレクトロニクス株式会社 | Euvマスクの欠陥検査方法、euvマスクの製造方法、euvマスク検査装置、および、半導体装置の製造方法 |
| JP2012059984A (ja) * | 2010-09-10 | 2012-03-22 | Nuflare Technology Inc | マスク検査装置及び露光用マスク製造装置 |
| JP2012058206A (ja) * | 2010-09-13 | 2012-03-22 | Toshiba Corp | マスクの欠陥検査方法及び欠陥検査装置 |
| JP4822471B1 (ja) * | 2010-11-30 | 2011-11-24 | レーザーテック株式会社 | Euvマスク検査装置及びeuvマスク検査方法 |
| JP5924267B2 (ja) * | 2010-12-14 | 2016-05-25 | 株式会社ニコン | 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイスの製造方法 |
| JP5537443B2 (ja) * | 2011-01-04 | 2014-07-02 | 株式会社東芝 | Euvマスク用ブランクの良否判定方法及びeuvマスクの製造方法 |
| WO2012114147A1 (en) * | 2011-02-23 | 2012-08-30 | Nano-Uv | Method for detecting defects in a microscopic scale on a surface of a sample, and device implementing this method |
| JP5566928B2 (ja) * | 2011-03-04 | 2014-08-06 | 株式会社東芝 | マスク検査方法およびその装置 |
| KR101904560B1 (ko) * | 2011-03-07 | 2018-10-04 | 에이지씨 가부시키가이샤 | 다층 기판, 다층 기판의 제조 방법, 다층 기판의 품질 관리 방법 |
| JP5814638B2 (ja) * | 2011-06-08 | 2015-11-17 | 株式会社東芝 | マスク基板の欠陥検査方法及び欠陥検査装置、フォトマスクの製造方法及び半導体装置の製造方法 |
| WO2013013246A1 (en) | 2011-07-21 | 2013-01-24 | Brooks Automation, Inc. | Method and device for compensation for dimensional variations in low temperature sample group holders |
| JP5816499B2 (ja) * | 2011-09-12 | 2015-11-18 | ルネサスエレクトロニクス株式会社 | Euvマスクの製造方法 |
| US10197501B2 (en) | 2011-12-12 | 2019-02-05 | Kla-Tencor Corporation | Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors |
| KR101704591B1 (ko) | 2012-02-21 | 2017-02-08 | 에이에스엠엘 네델란즈 비.브이. | 검사 장치 및 방법 |
| JP5126917B1 (ja) * | 2012-03-14 | 2013-01-23 | レーザーテック株式会社 | 欠陥座標測定装置、欠陥座標測定方法、マスクの製造方法、及び基準マスク |
| JP5944189B2 (ja) | 2012-03-15 | 2016-07-05 | 株式会社東芝 | マスク基板の欠陥検査方法及び欠陥検査装置、フォトマスクの製造方法及び半導体装置の製造方法 |
| JP6009787B2 (ja) * | 2012-03-16 | 2016-10-19 | 株式会社東芝 | 最適撮像位置検出方法、最適撮像位置検出装置、フォトマスクの製造方法及び半導体装置の製造方法 |
| US9496425B2 (en) | 2012-04-10 | 2016-11-15 | Kla-Tencor Corporation | Back-illuminated sensor with boron layer |
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| JP6357143B2 (ja) * | 2013-02-22 | 2018-07-11 | Hoya株式会社 | 反射型マスクブランクの製造方法、及び反射型マスクの製造方法 |
| US9632411B2 (en) * | 2013-03-14 | 2017-04-25 | Applied Materials, Inc. | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
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| DE102014211362B4 (de) | 2014-06-13 | 2018-05-09 | Carl Zeiss Smt Gmbh | Verfahren zum Analysieren eines optischen Elements für den EUV-Wellenlängenbereich |
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| US9767986B2 (en) | 2014-08-29 | 2017-09-19 | Kla-Tencor Corporation | Scanning electron microscope and methods of inspecting and reviewing samples |
| KR102299921B1 (ko) * | 2014-10-07 | 2021-09-09 | 삼성전자주식회사 | 광학 장치 |
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2007
- 2007-10-04 JP JP2007260796A patent/JP5039495B2/ja active Active
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2008
- 2008-09-30 US US12/241,614 patent/US7911600B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009092407A (ja) | 2009-04-30 |
| US20090091752A1 (en) | 2009-04-09 |
| US7911600B2 (en) | 2011-03-22 |
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