JP4962563B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP4962563B2 JP4962563B2 JP2009506098A JP2009506098A JP4962563B2 JP 4962563 B2 JP4962563 B2 JP 4962563B2 JP 2009506098 A JP2009506098 A JP 2009506098A JP 2009506098 A JP2009506098 A JP 2009506098A JP 4962563 B2 JP4962563 B2 JP 4962563B2
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- Prior art keywords
- circuit chip
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- ring
- electronic device
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- Prior art date
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- Expired - Fee Related
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- 230000003014 reinforcing effect Effects 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 9
- 238000004070 electrodeposition Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 30
- 239000000463 material Substances 0.000 description 25
- 239000003795 chemical substances by application Substances 0.000 description 18
- 238000004382 potting Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 6
- 208000032837 Ring chromosome 16 syndrome Diseases 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Credit Cards Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Of Aerials (AREA)
Description
上記ベース上に配線された導体パターンと、
上記導体パターンに電気的に接続された回路チップと、
上記ベース上に上記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
上記補強体の内側を埋めて上記回路チップ上部を覆い、この回路チップを上記ベース上で封止した封止体とを備えたことを特徴とする。
上記電子装置が
ベースと、
上記ベース上に配線された導体パターンと、
上記導体パターンに電気的に接続された回路チップと、
上記ベース上に上記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
上記補強体の内側を埋めて上記回路チップ上部を覆い、この回路チップを上記ベース上で封止した封止体とを備えたことを特徴とする。
上記電子装置が
ベースと、
上記ベース上に配線された導体パターンと、
上記導体パターンに電気的に接続された回路チップと、
上記ベース上に上記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
上記補強体の内側を埋めて上記回路チップ上部を覆い、この回路チップを上記ベース上で封止した封止体とを備えたことを特徴とする。
接着剤を上記回路チップ上部を覆って塗布する接着剤塗布工程と、
環状の外形を有し内部構造として複数の環を有する補強体を、上記ベース上に、
この複数の環が互いに同心となるよう、上記回路チップを囲んで配置し、上記接着剤が上記補強体の少なくとも内側を埋めた状態とする補強体配置工程と、
上記接着剤を硬化させることによって、この接着剤に上記回路チップを上記ベース上で封止させるとともに、上記補強体をこのベースに固定させる硬化工程とを有することを特徴とする。
Claims (3)
- ベースと、
前記ベース上に配線された導体パターンと、
前記導体パターンに電気的に接続された回路チップと、
前記ベース上に前記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
前記補強体の内側を埋めて前記回路チップ上部を覆い、該回路チップを前記ベース上で封止した封止体とを備え、
前記補強体は、前記複数の環のうち最外周の環が、残りの環のうち少なくともいずれか1つの環よりも柔らかいものであることを特徴とする電子装置。 - ベースと、
前記ベース上に配線された導体パターンと、
前記導体パターンに電気的に接続された回路チップと、
前記ベース上に前記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
前記補強体の内側を埋めて前記回路チップ上部を覆い、該回路チップを前記ベース上で封止した封止体とを備え、
前記補強体は、前記複数の環のうち最外周の環における、環の径方向の幅が残りの環のうち少なくともいずれか1つの環における幅よりも狭いものであることを特徴とする電子装置。 - ベースと、
前記ベース上に配線された導体パターンと、
前記導体パターンに電気的に接続された回路チップと、
前記ベース上に前記回路チップを囲んで配置された、環状の外形を有する、内部構造として、互いに同心の複数の環を有する補強体と、
前記補強体の内側を埋めて前記回路チップ上部を覆い、該回路チップを前記ベース上で封止した封止体とを備え、
前記補強体は、前記複数の環のうち最外周の環における、前記ベースの厚み方向での厚さが残りの環状補強部の少なくともいずれか1つの環における厚さよりも薄いものであることを特徴とする電子装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/056077 WO2008117382A1 (ja) | 2007-03-23 | 2007-03-23 | 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008117382A1 JPWO2008117382A1 (ja) | 2010-07-08 |
JP4962563B2 true JP4962563B2 (ja) | 2012-06-27 |
Family
ID=39788126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009506098A Expired - Fee Related JP4962563B2 (ja) | 2007-03-23 | 2007-03-23 | 電子装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7982295B2 (ja) |
EP (1) | EP2131392A4 (ja) |
JP (1) | JP4962563B2 (ja) |
KR (1) | KR101032069B1 (ja) |
CN (1) | CN101663750B (ja) |
WO (1) | WO2008117382A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9741633B2 (en) | 2015-06-02 | 2017-08-22 | Samsung Electronics Co., Ltd. | Semiconductor package including barrier members and method of manufacturing the same |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI421982B (zh) * | 2008-11-21 | 2014-01-01 | Advanpack Solutions Pte Ltd | 半導體導線元件及其製造方法 |
JP5358489B2 (ja) * | 2010-03-11 | 2013-12-04 | 株式会社日立製作所 | Rfidタグ及びその製造方法 |
US8671772B2 (en) * | 2011-09-22 | 2014-03-18 | Hana Micron America, Inc. | Quality assurance and reliability testing apparatus for RFID tags |
KR101326194B1 (ko) * | 2012-10-19 | 2013-11-20 | 이진재 | Rfid 태그 조립체 및 이를 구비한 전자 보호대 |
CN204650569U (zh) * | 2014-04-22 | 2015-09-16 | 株式会社村田制作所 | 无线通信标签 |
CN109637934B (zh) * | 2014-10-11 | 2023-12-22 | 意法半导体有限公司 | 电子器件及制造电子器件的方法 |
CN104916593A (zh) * | 2015-06-02 | 2015-09-16 | 三星半导体(中国)研究开发有限公司 | 封装件和制造封装件的方法 |
JP7534969B2 (ja) | 2021-01-20 | 2024-08-15 | Nok株式会社 | Icタグ |
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JPS59152741A (ja) * | 1983-02-18 | 1984-08-31 | Nec Corp | 光インタフエ−ス装置 |
JP2001202490A (ja) * | 2000-01-20 | 2001-07-27 | Denso Corp | Icカード及びその製造方法 |
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JP2005100114A (ja) * | 2003-09-25 | 2005-04-14 | Toppan Printing Co Ltd | 床面設置用icタグ |
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EP2131312A4 (en) * | 2007-03-23 | 2011-08-24 | Fujitsu Ltd | ELECTRONIC ARRANGEMENT, ELECTRONIC EQUIPMENT, INCLUDING AN ELECTRONIC ARRANGEMENT, ARTICLE TO WHICH AN ELECTRONIC ARRANGEMENT IS PLACED, AND METHOD FOR PRODUCING AN ELECTRONIC ARRANGEMENT |
-
2007
- 2007-03-23 JP JP2009506098A patent/JP4962563B2/ja not_active Expired - Fee Related
- 2007-03-23 KR KR1020097019373A patent/KR101032069B1/ko not_active IP Right Cessation
- 2007-03-23 EP EP07739518A patent/EP2131392A4/en not_active Withdrawn
- 2007-03-23 CN CN2007800522391A patent/CN101663750B/zh not_active Expired - Fee Related
- 2007-03-23 WO PCT/JP2007/056077 patent/WO2008117382A1/ja active Application Filing
-
2009
- 2009-09-14 US US12/559,234 patent/US7982295B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59152741A (ja) * | 1983-02-18 | 1984-08-31 | Nec Corp | 光インタフエ−ス装置 |
JP2001202490A (ja) * | 2000-01-20 | 2001-07-27 | Denso Corp | Icカード及びその製造方法 |
JP2003288568A (ja) * | 2002-03-27 | 2003-10-10 | Toppan Forms Co Ltd | 非接触型icラベル |
JP2005100114A (ja) * | 2003-09-25 | 2005-04-14 | Toppan Printing Co Ltd | 床面設置用icタグ |
Cited By (1)
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US9741633B2 (en) | 2015-06-02 | 2017-08-22 | Samsung Electronics Co., Ltd. | Semiconductor package including barrier members and method of manufacturing the same |
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US7982295B2 (en) | 2011-07-19 |
WO2008117382A1 (ja) | 2008-10-02 |
US20100001388A1 (en) | 2010-01-07 |
EP2131392A1 (en) | 2009-12-09 |
KR20100005029A (ko) | 2010-01-13 |
JPWO2008117382A1 (ja) | 2010-07-08 |
CN101663750B (zh) | 2011-06-29 |
KR101032069B1 (ko) | 2011-05-02 |
CN101663750A (zh) | 2010-03-03 |
EP2131392A4 (en) | 2011-08-24 |
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