200839973 九、發明說明： 【箱^明所*屬^域^】 發明領域 本發明係有關於電子裝置、安裝有電子裝置之電子機 - 5器、設有電子裝置之物品及電子裝置之製造方法。 【先前技術】 發明背景 迄今廣為人知的是構成為在印刷線路板等基體上搭载 • 電路晶片之電子裝置，此種電子裝置係運用在内建於電子 10機器以控制該電子機器或作成個體與外部機器交換資訊之 用途。已知電子裝置之一例係利用電波以非接觸方式與讀 寫器所代表之外部機器進行資訊交換之各種尺打以射頻識 別，Radio Frequency IDentification)標籤，該RFID標籤之一 種係揭示有構成為於由塑膠或紙等所構成之基片上搭載電 15波通信用之導線(conductor pattern)與1C晶片者（例如參照曰 本專利特開2001 — 156110號公報）。一般認為此種形式之 ® RFID標籤的利用形態係黏貼在物品等並藉由與外部機器交 換有關該物品之資訊而進行物品之識別等。 第1圖係顯示習知技藝之RFID標籤之一例之模式截面 '* 20 圖。 在此所示之RFID標籤90係於可彎折且例如由pet膜等 所構成之基體91上形成由導線所構成之天線92,同時於其 上搭載電路晶片93。該電路晶片93係裝入用以經由天線92 與外部機器間傳達資訊之電路，且該電路晶片93之形成於 5 200839973 其下面之連接端子93a係藉由軟焊等與天線92電連接，更藉 由接著劑94固定於基體91上。又，於RFID標籤90之基體91 上設置有覆蓋電路晶片93之封裝劑95及配置成包圍電路晶 片93之環狀補強體96，再者，構成為組合基體91、天線92 ' 5電路晶片93、封裝劑％及補強體96之標籤本體全體係藉由 覆盍材97來覆蓋。於封裝劑95中，填埋環狀補強體％内側200839973 IX. Description of the invention: [Box ^明所*属^ domain] Field of the Invention The present invention relates to an electronic device, an electronic device mounted with an electronic device, an article provided with the electronic device, and a method of manufacturing the electronic device . [Prior Art] BACKGROUND OF THE INVENTION It is heretofore known that an electronic device is mounted on a substrate such as a printed wiring board, and the electronic device is built in an electronic device to control the electronic device or to create an individual and an external device. The purpose of the machine to exchange information. One example of a known electronic device is a radio frequency identification (Radio Frequency IDentification) tag that uses a radio wave to exchange information with an external device represented by a reader/writer in a non-contact manner, and a type of the RFID tag is disclosed as being composed of A conductor pattern for a 15-wave communication and a 1C chip are mounted on a substrate made of plastic or paper (see, for example, Japanese Patent Laid-Open Publication No. 2001-156110). It is generally considered that the form of use of this type of ® RFID tag is attached to an article or the like and the article is identified by exchanging information about the article with an external device. Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art. The RFID tag 90 shown here is formed by forming an antenna 92 composed of a wire on a base 91 which is bendable and formed, for example, of a PET film, and the like, and a circuit wafer 93 is mounted thereon. The circuit chip 93 is provided with a circuit for transmitting information between the external device via the antenna 92, and the connection terminal 93a of the circuit chip 93 formed at 5 200839973 is electrically connected to the antenna 92 by soldering or the like. It is fixed to the substrate 91 by an adhesive 94. Further, an encapsulant 95 covering the circuit wafer 93 and an annular reinforcing body 96 disposed to surround the circuit wafer 93 are provided on the base 91 of the RFID tag 90, and further, the combined base 91 and the antenna 92' 5 are formed. The encapsulating agent % and the label body of the reinforcing body 96 are covered by the covering material 97. In the encapsulant 95, the inside of the ring-shaped reinforcing body is filled
之内側部分95a係覆蓋電路晶片93上部，且藉由基體91封裝 笔路晶片93。 1 RFID標籤9G係例如裝設、利用在衣服等柔軟材質之物 0⑽上’且有時會承受強大之外力。腿D標籤9()係於電路晶 片93之周邊設置封裝劑95及補強體％並保護電路晶片幻， 因此，即使於基體91之厚度方向承受壓力，亦可防止電路 晶片93本身之破裂。 然而’於RFID_9q巾’若欲賦傾強體96強度以強 化電路晶片93之賴，則會有補纽_邊之部分被破壞 之虞，舉财之，若^應力仙於基_，職力會集 中於天線92自補強體96露出之部分（第1圖中以虛線的圓所 不之部分）而有天線92斷線之虞。 20 又此種因補強體96周邊部分之破壞所造成之問題並 ^艮於RFID標籤，而是在柔軟性屈指可數的基體上搭載有 电路晶片之電子裝置中共同之問題。 t發明内容】 發明之揭示 本發明之目的係提供可降低對電路 有鑑於前述問題 6 200839973 安裝有 電子裝 晶片之彎曲應力且亦可避免導線斷線之電子裝置、 違電子裝置之電子機II、設有該電子裝置之物品及 置之製造方法。 以達成前述目的之本發明之電子裝置包含有· 5 導線’係佈線在前述基體上者；電路晶片，係與前：The inner portion 95a covers the upper portion of the circuit wafer 93, and the pen path wafer 93 is encapsulated by the base 91. 1 The RFID tag 9G is installed, for example, on a soft material such as clothes (10) and may be subjected to strong external forces. The leg D-label 9 () is provided with the encapsulant 95 and the reinforcing body % around the circuit wafer 93 and protects the circuit chip. Therefore, even if the substrate 91 is subjected to pressure in the thickness direction, the circuit wafer 93 itself can be prevented from being broken. However, if 'in the RFID_9q towel' wants to strengthen the strength of the body 96 to strengthen the circuit chip 93, there will be a part of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The antenna 92 is concentrated on the portion where the reinforcing body 96 is exposed (the portion of the dotted circle in Fig. 1) and the antenna 92 is broken. 20 This problem caused by the destruction of the peripheral portion of the reinforcing body 96 is inconsistent with the RFID tag, but is a common problem in an electronic device in which a circuit chip is mounted on a flexible substrate. Disclosure of the Invention The present invention aims to provide an electronic device capable of reducing the bending stress of an electronically mounted wafer and which can also avoid wire breakage, and an electronic device that violates an electronic device, The article and the manufacturing method of the electronic device are provided. The electronic device of the present invention for achieving the above object comprises a wiring of a wire on the substrate; a circuit chip, before and after:
=線電連接者；補強體，係於前述基體上配置成包^述 =路晶片並具有環狀之外形，且具有於預定基材中複數朝 月=基體厚度方向延伸之支柱分散構成的内部結構者；及 1 =裝體’係填埋前述補強體之内側並覆蓋前述電路晶片上 〇 °卩，且於前述基體上封裝該電路晶片者。 由於本發明電子裝置之封裝體係具有填埋環狀補強體 之内侧並覆蓋電路晶片上部且於前述基體上封裳電路晶片 之結構’因此即使基體彎折，應力亦不會作用於電路曰曰曰曰二， 且可防止電路晶片之破裂或剝離。再者，本發明之電子裝 15置係由於配置成包圍電路晶片之補強體具有於預定基财 複數朝前述基體厚度方向延伸之支柱分散構成的内部結構 者因此，對於在基體之厚度方向所承受之力可藉由抑制 變形來保護電路晶片，另一方面，對於使基體彎曲之力則 可柔軟地變形，因此，可抑制導線之斷線。 在此，於前述本發明之電子褒置中，前述基材宜由彈 f生體所構成，且别述支柱宜由金屬材料所構成。 藉由利用金屬材料來構成朝基體之厚度方向延伸之支 柱’可強化對於在基體厚度方向所承受之力的剛性，1另一 方面，對於使基體彎曲之力則可柔軟地變形。 20 200839973 又’前述本發明之前述電子裝置可為RFID標籤，且該 RJFID標籤係使前料線具有作為通信用天狀機能，並使 前述電路晶片經由該導線進行無線通信。 由於在安裝於商品或卡片之狀態下使用之RFID標籤 5琴折之情形乡，因此本發明之電子裝4適合於RFID標籤。 又，用以達成前述目的之本發明之電子機器係具有電 子裝置及安褒有該電子裝置且藉由該電子裝置之動作來驅 動之機器本體部，又，前述電子裝置包含有：基體；導線， 係佈線在前述基體上者；電路晶片，係與前述導線電連接 1〇者；補強體，係於前述基體上配置成包圍前述電路晶片並 具有環狀之外形，且具有於預定基#中複數朝冑述基體厚 度方向延伸之支柱分散構成的内部結構者；及封裝體，係 填埋前述補強體之内侧並覆蓋前述電路晶片上部，且於前 述基體上封裝該電路晶片者。 15 財發明之電子機器中，舉例言之，即使於電子機器 本身彎折或是修理或檢查時電子裝置彎折，亦可抑制導線 之斷線，因此可提升電子機器之可靠性。 又，用以達成前述目的之本發明之設有電子裝置之物 品係由電子裝置及裝設有該電子裝置之被裝設物品所構 2〇成，又，前述電子裝置包含有：基體；導線，係佈線在前 述基體上者；電路晶片，係與前述導線電連接者；補強體， 係於前述基體上配置成包圍前述電路晶片並具有環狀之外 形，且具有於預定基材中複數朝前述基體厚度方向延伸之 支柱分散構成的内部結構者；及封裳體，係填埋前述補強 8 200839973 體之内侧並覆蓋前述電路晶片上部，且於前述基體上封裝 該電路晶片者。 例如裝設有RFm標籤等電子裝置之物品會有連電子 I置-起彎折之情形’然、而’此時亦可抑制電路晶片之破 5 裂或剝離及導線之斷線。 又，用以達成前述目的之本發明之電子裝置之製造方 法包含有：連接程序，係於佈線有導線之基體的該導線上 連接電路晶片者；接著劑塗布程序，係塗布接著劑並覆蓋 前述電路晶片上部者；補強體配置程序，係於前述基體上 10將補強體配置成包圍前述電路晶片並作成前述接著劑至少 填埋該補強體之内侧之狀態，且前述補強體具有基材環狀 之外形，並具有於預定基材中複數朝前述基體厚度方向延 伸之支柱分散構成的内部結構者；及硬化程序，係藉由使 前述接著劑硬化，使該接著劑於前述基體上封裝前述電路 15晶片，同時使前述補強體固定於該基體上者。 在本發明之電子裝置之製造方法中，於前述基體上將 分散有複數朝基體厚度方向延伸之支柱之補強體配置成包 圍電路晶片’並使填埋補強體内侧之狀態之接著劑硬化， 藉此，可製造一種具有對於在基體厚度方向所承受之力的 20 剛性且對於使基體彎曲之力則可柔軟地變形之電子裝置。 如前所述，若依據本發明，則可避免彎曲應力集中於 電路晶片，且亦可避免應力集中於導線。 圖式簡單說明 第1圖係顯示習知技藝之RFID標籤之一例之模式截面 9 200839973 圖。 第2圖係顯示為本發明一實施形態之RFID標籤之截面 圖。 第3圖係顯示為本發明一實施形態之RF ID標籤之平面 5 圖。 第4(a)至4(e)圖係說明第2及3圖所示之RFID標籤之製 造方法圖。 第5(a)至5(c)圖係說明第4圖所示之補強體之製造方法 圖。 0 第6圖係說明裝設有RFID標籤之衣服之製造方法圖。a line-connector; a reinforcing body, which is disposed on the base body and has a ring-shaped outer shape, and has a plurality of pillars dispersed in a predetermined base material in a direction of a thickness of the base body; The structure; and 1 = the package body is used to fill the inside of the reinforcing body and cover the circuit chip, and the circuit chip is packaged on the substrate. Since the package system of the electronic device of the present invention has the structure of filling the inner side of the annular reinforcing body and covering the upper portion of the circuit wafer and sealing the circuit chip on the substrate, the stress does not act on the circuit even if the substrate is bent. Second, it can prevent cracking or peeling of the circuit chip. Furthermore, the electronic device 15 of the present invention is configured such that the reinforcing body disposed so as to surround the circuit wafer has an internal structure in which the predetermined base is dispersed in the thickness direction of the base body. Therefore, it is subjected to the thickness direction of the substrate. The force can protect the circuit wafer by suppressing the deformation, and on the other hand, the force for bending the substrate can be softly deformed, so that the wire can be prevented from being broken. Here, in the electronic device of the present invention, the substrate is preferably composed of a bomb, and the other pillar is preferably made of a metal material. The support rods extending in the thickness direction of the base body by the metal material can strengthen the rigidity against the force in the thickness direction of the base body. On the other hand, the force for bending the base body can be softly deformed. Further, the aforementioned electronic device of the present invention may be an RFID tag, and the RJFID tag has a front feed line having a function as a communication antenna, and the aforementioned circuit chip is wirelessly communicated via the wire. The electronic device 4 of the present invention is suitable for an RFID tag because of the situation in which the RFID tag 5 is used in the state of being mounted on a product or a card. Further, an electronic device according to the present invention for achieving the above object includes an electronic device and a device body portion that is mounted with the electronic device and driven by the operation of the electronic device, and the electronic device includes: a base; a wire And a circuit chip electrically connected to the wire; the reinforcing body is disposed on the substrate to surround the circuit chip and has an annular shape, and has a predetermined base The plurality of internal structures are formed by dispersing the pillars extending in the thickness direction of the substrate; and the package is for filling the inside of the reinforcing body and covering the upper portion of the circuit wafer, and packaging the circuit wafer on the substrate. In the electronic device of the invention, for example, even if the electronic device is bent or repaired or inspected, the electronic device is bent, and the disconnection of the wire can be suppressed, thereby improving the reliability of the electronic device. Further, the electronic device-equipped article of the present invention for achieving the above object is composed of an electronic device and an article to be mounted on which the electronic device is mounted, and the electronic device includes: a base; a wire And a circuit chip electrically connected to the wire; the reinforcing body is disposed on the substrate to surround the circuit chip and has an annular shape, and has a plurality of shapes in a predetermined substrate The inner structure in which the pillars extending in the thickness direction of the substrate are dispersed; and the body of the sealing body is filled with the inner side of the reinforcing body and covering the upper portion of the circuit wafer, and the circuit chip is packaged on the substrate. For example, an article equipped with an electronic device such as an RFm tag may have a state in which the electrons are placed and bent. However, it is also possible to suppress the breakage or peeling of the circuit chip and the disconnection of the wires. Further, a method of manufacturing an electronic device according to the present invention for achieving the above object includes: a connection program for connecting a circuit wafer to a wire on which a substrate of a wire is wired; and an adhesive application step of applying an adhesive and covering the foregoing In the upper portion of the circuit chip, the reinforcing body arrangement program is configured such that the reinforcing body is disposed so as to surround the circuit wafer, and the adhesive is at least filled in the inner side of the reinforcing body, and the reinforcing body has a substrate ring shape. And having an internal structure in which a plurality of pillars extending in a predetermined thickness direction of the substrate are dispersed in a predetermined base material; and a hardening step of encapsulating the above-mentioned circuit on the substrate by hardening the adhesive 15 wafers, while the aforementioned reinforcing body is fixed to the substrate. In the method of manufacturing an electronic device according to the present invention, the reinforcing body in which a plurality of pillars extending in the thickness direction of the substrate are dispersed on the substrate is disposed so as to surround the circuit wafer and harden the adhesive in the state of the inside of the landfill reinforcing body. Thus, an electronic device having 20 rigidity to the force in the thickness direction of the substrate and softly deforming the force for bending the substrate can be manufactured. As described above, according to the present invention, it is possible to prevent the bending stress from being concentrated on the circuit wafer, and also to avoid stress concentration on the wire. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art 9 200839973. Fig. 2 is a cross-sectional view showing an RFID tag according to an embodiment of the present invention. Fig. 3 is a plan view showing the plane of the RF ID tag according to an embodiment of the present invention. Figures 4(a) through 4(e) are diagrams showing the method of manufacturing the RFID tag shown in Figures 2 and 3. Figures 5(a) to 5(c) are diagrams showing the manufacturing method of the reinforcing body shown in Fig. 4. 0 Fig. 6 is a view showing a manufacturing method of clothes equipped with an RFID tag.
第7圖係顯示作為本發明一實施形態之印刷電路板裝 置及安裝有該印刷電路板裝置之桌上計算器之概略圖。 【實施方式；J 發明之較佳實施形態 5 以下參照圖式說明本發明之實施形態。 第2及3圖係分別顯示為本發明電子裝置之一實施形態 之RFID標籤之截面圖及平面圖。另，於第2圖之截面圖中， 為了使結構清楚易見，相較於第3圖之平面圖而放大顯示 RFID標籤之中央部分。 -0 該第2及3圖所示之RFID標籤10係補強體之結構與第1 圖所示之RFID標籤9〇不同，除了該點以外，其他則與第j 圖所示之RFID標籤9〇相同，即，於可燒性之基體11上形成 天線12同時搭載電路晶片13，且藉由接著劑14固定該電路 晶片13 °又’於基體11上設置有覆蓋電路晶片13上部之封 10 200839973 a 裝劑15及配置成包圍電路晶片13之環狀補強體ι6，再者， 構成為組合基體11、天線12、電路晶片13、封裝劑15及補 強體16之裝置全體係藉由覆蓋材π來覆蓋。另，於第3圖之 平面圖中’為了内部結構之易見度，故省略覆蓋材之圖 5 示0 補強體16係具有圓環狀之外形，且具有於基材16a中複 數朝基體11厚度方向延伸之支柱16b分散構成之内部結 構。基材16a係由橡膠等彈性體所構成，支柱16b則由金屬 Φ 材料所構成且呈針狀，同時朝厚度方向貫通基材16a並延 10 伸。 封裝劑15係劃分成填埋補強體16内側之内側部1及 自外侧包圍補強體16之外側部15b，於封裝劑15中，填埋補 強體16内側之内側部i5a係覆蓋電路晶片13上部，且於基體 11上封裝電路晶片13。 15 在此，天線12係相當於本發明中所述之導線之一例， 封裝劑15之内側部15a則相當於本發明中所述之補強體之 囊I 一例。 該RFID標籤1〇係配置成包圍電路晶片之補強體16具 有於基材16a中複數朝基體U厚度方向延伸之支柱鳩分散 20構成之内部結構，因此，補強體丨6對於在基體11之厚度方 向，即，支柱延伸之方向所承受之力可抑制變形並保護電 路晶片13,另-方面，對於使基體u彎曲之力則可柔軟地 &形’因此，可抑制應力集中於天線12自補強體16露出之 4刀，並防止天線12之斷線。又，該RnD標藏1〇係受補強 11 200839973 ^ 體16包圍且電路晶片13之上部藉由填埋補強體16内部之封 裝劑15之内側部15a覆蓋，同時電路晶片13藉由該内侧部 15a與基體11之合作來封裝，因此，亦可防止應力集中於電 路晶片13，且亦可防止電路晶片13之破裂或剝離等。 5 接著，說明RFID標籤之製造方法。 第4圖係說明第2及3圖所示之RFID標籤之製造方法 圖。 第4(a)至4(e)圖係依序地顯示製造RFID標籤之各程序。 _ 為了得到RFID標籤10，首先，於第4(a)圖所示之連接 10程序中，在佈線有天線12之基體11的天線12上連接電路晶 片13。 其次，於第4(b)圖所示之接著劑塗布程序中，塗布由熱 硬化性樹脂所構成之液狀封裝劑15p並覆蓋電路晶片13上 部，又，封裝劑15p亦塗布於電路晶片13之周邊。 15 其次’於第4(c)及4(d)圖所示之補強體配置程序中，將 補強體16定位成包圍電路晶片13並搭載於基體丨丨上。 ^ 在此，暫時參照第5圖說明補強體16之製造方法。 第5圖係說明第4圖所示之補強體之製造方法圖。 製造補強體時’首先，如第5(a)圖所示，朝相同之方向 20配置複數根金屬製之細長棒，且藉由利用彈性體所構成之 基材集結成圓柱狀，其次，如第5(b)圖所示，將集結成圓柱 狀者切片成圓盤狀，其次，如第5(c)圖所示，於切片成圓盤 狀者之中央開孔，藉此，可得到於基材16a中複數支柱16b 为政構成之補強體16。 12 200839973 再度參照第4圖繼續說明，如第4(c)及4(d)圖所示，若 使補強體16配置成沉入封裝劑15p中，則封裝劑15p會被分 成補強體16之内側、補強體Μ之外側二處，然後，如第4(d) 圖所示，利用加熱使封裝劑15p硬化，藉此，可於補強體16 5 之内侧形成内側部15a。 其次，於第4(e)圖所示之覆蓋程序中，藉由覆蓋材17 自表裏面兩側覆蓋基體U，又，覆蓋材17係藉由加熱及加 壓來牷接，若元成覆盖程序，則可得到第2圖所示之rfid 標籤10。 10 接著，前述RnD標籤之應用例係說明為本發明設有電 子裝置之物品之一實施形態的裝設有R n D標籤丨〇之衣服。 第6圖係說明裝設有rFID標籤之衣服之製造方法圖。 舉例言之，如第6圖所示，第2及3圖所示iRFID標籤 10係藉由黏貼等裝設在衣服5之標籤5a，又，於裝設在衣服 15 5之RFID標籤10記憶顯示衣服5之屬性之資訊，舉例言之， 藉由無線通信將JAN編碼等衣服5之屬性資訊自資訊寫入 裝置6送信至RFID標籤1〇，且使電路晶片13(參照第2圖）記 憶該屬性資訊。 於鈾述實施形悲中，電子裝置係說明^^仍標籤之例 20子，然而本發明之電子裝置並不限於RFID標籤，舉例言之， 可適用於在可撓性基體上搭載有電路晶片之印刷電路板裝 置。 第7圖係顯示作為本發明一實施形態之印刷電路板裝 置及安裝有該印刷電路板裝置之桌上計算器之概略圖。 13 200839973 第7圖所示之桌上計算器7包含有計算器本體部71及安 裝於計算器本體部71之印刷電路板裝置75。印刷電路板裝 置75係具有與第2及3圖所示之RFID標籤10相同之結構， 即，於作為基體之撓性印刷電路77(FPC77)上搭載電路晶片 5 76，又，雖然省略圖示，然而，於FPC77上，在基材中複數 朝基體厚度方向延伸之支柱分散構成的補強體係配置成包 圍電路晶片’再者’封裝體係具有填埋補強體之内側並覆 蓋電路晶片上部且藉由FPC77封裝電路晶片76之結構，不 過，印刷電路板裝置75之電路晶片在具有計算器本體部71 10 之控制機能方面，以及於FPC77上佈線有在電路晶片76與計 算器本體部71間傳達信號之佈線型樣以取代天線方面係與 弟2圖所示之RFID標籤1〇不同。於計算器本體部71係具有進 行各種顯示之顯示窗部71a及操作鍵71b，且依據電路晶片 76之動作來驅動，又，安裝有印刷電路板裝置乃之桌上計 15异器7係即使計算器本體部71撓曲，亦可防止於印刷電路板 裝置75中之佈線型樣之斷線。 另，在此說明桌上計算器7之計算器本體部71撓曲之情 形，然而本發明並不限於此，舉例言之，亦可適用於電子 裝置在彎曲狀態下安裝於具有硬殼之機器本體部之電子機 20器，或者因修理或保養而自機器本體部取出電子裝置時電 子裝置容易彎曲之電子機器。又，本發明並不限於桌上計 算器，可適用在安裴有於可撓性基體上搭載電路晶片之電 子裝置的行動電話等各種電子機器。 又’於前述實施形態中說明具有覆蓋材之例子，然而 14 200839973 本發明之電子裝置並不限於此，亦可為未設置有覆蓋材者。 又，於前述實施形態中，補強體之基材材料係說明彈 性體之例子，然而本發明之電子裝置並不限於此，舉例言 之，基材之材料亦可採用壓克力（PMAA)、聚縮醛(p〇M)、 聚苯硫醚(PPS)、聚丙烯(PP)、ABS樹脂(ABS)、聚氯乙烯樹 脂(PVC)等樹脂。 【鬮式簡單說明】 第1圖係顯示習知技藝之RFID標籤之一例之模式截面 圖。 10 15 20 第2圖係顯示為本發明一實施形態之R F j d標籤之戴面 圖。 第3圖係顯示為本發明一實施形態之RFID標籤之平面 圖。 第4(a)至4(e)圖係說明第2及3圖所示之RFID標籤之製 造方法圖。 第5(a)至5(c)圖係說明第4圖所示之補強體之製造方法 圖。 第6圖係說明裝設有RFID標籤之衣服之製造方法圖。 第7圖係顯示作為本發明一實施形態之印刷電路板裝 置及安裝有該印刷電路板裝置之桌上計算器之概略圖。 【主要元件符號說明】 5···衣服 5a…標戴 6···資訊寫入裝置 7…桌上計算器 10，90...RFID標籤 11，91…基體 15 200839973 12，92··.天線 17，97...覆蓋材 13，76，93…電路晶片 71...計算器本體部 14，94...接著劑 71a...顯示窗部 15，15p，95...封裝劑 71b...操作鍵 15a...内側部 75…印刷電路板裝置 15b...外侧部 77...撓性印刷電路 16，96...補強體 93a...連接端子 16a...基材 16b…支柱 95a...内側部分 16Fig. 7 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator to which the printed circuit board device is mounted. [Embodiment] Preferred Embodiment 5 of the Invention Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 2 and 3 are a cross-sectional view and a plan view, respectively, showing an RFID tag according to an embodiment of the electronic device of the present invention. Further, in the cross-sectional view of Fig. 2, in order to make the structure clear and easy to see, the central portion of the RFID tag is enlarged as compared with the plan view of Fig. 3. -0 The structure of the RFID tag 10 reinforced body shown in Figs. 2 and 3 is different from the RFID tag 9 第 shown in Fig. 1, except for this point, the other is the RFID tag 9 shown in Fig. Similarly, the antenna 12 is formed on the smolderable substrate 11 while the circuit chip 13 is mounted, and the circuit wafer 13 is fixed by the adhesive 14 and the substrate 11 is provided with a cover 10 covering the upper portion of the circuit chip 13 200839973 a charging agent 15 and an annular reinforcing body ι6 arranged to surround the circuit chip 13, and further comprising a device for combining the substrate 11, the antenna 12, the circuit wafer 13, the encapsulant 15 and the reinforcing body 16 by a covering material π To cover. In addition, in the plan view of Fig. 3, 'for the visibility of the internal structure, the omitting the covering material is shown in Fig. 5. The reinforcing body 16 has an annular outer shape and has a plurality of thicknesses in the base material 16a toward the base 11 The struts 16b extending in the direction are dispersed to constitute the internal structure. The base material 16a is made of an elastic body such as rubber, and the support 16b is made of a metal Φ material and has a needle shape, and penetrates the base material 16a in the thickness direction and extends. The encapsulant 15 is divided into an inner portion 1 inside the buried reinforcing body 16 and an outer portion 15b surrounding the reinforcing body 16 from the outer side. In the encapsulant 15, the inner portion i5a inside the filling reinforcing body 16 covers the upper portion of the circuit chip 13. And the circuit wafer 13 is packaged on the substrate 11. Here, the antenna 12 corresponds to an example of the wire described in the present invention, and the inner portion 15a of the encapsulant 15 corresponds to an example of the capsule I of the reinforcing body described in the present invention. The RFID tag 1 is configured such that the reinforcing body 16 surrounding the circuit wafer has an internal structure composed of a plurality of pillars 20 dispersed in the thickness direction of the substrate U in the substrate 16a. Therefore, the reinforcing body 6 is thicker for the substrate 11. The direction, that is, the force with which the direction in which the pillar extends is suppressed, suppresses deformation and protects the circuit wafer 13, and on the other hand, the force for bending the base u can be softly &formed, thereby suppressing stress concentration on the antenna 12 The reinforcing body 16 is exposed to 4 knives and prevents the antenna 12 from being broken. Moreover, the RnD is surrounded by a body 11 and the upper portion of the circuit chip 13 is covered by the inner portion 15a of the encapsulant 15 inside the landfill 16 while the circuit chip 13 is covered by the inner portion. The 15a is packaged in cooperation with the substrate 11, and therefore, stress can be prevented from being concentrated on the circuit wafer 13, and cracking or peeling of the circuit wafer 13 can be prevented. 5 Next, a method of manufacturing an RFID tag will be described. Fig. 4 is a view showing a method of manufacturing the RFID tag shown in Figs. 2 and 3. Figures 4(a) through 4(e) show the procedures for manufacturing RFID tags in sequence. In order to obtain the RFID tag 10, first, in the connection 10 procedure shown in Fig. 4(a), the circuit chip 13 is connected to the antenna 12 on which the base 11 of the antenna 12 is wired. Next, in the adhesive application procedure shown in Fig. 4(b), a liquid encapsulant 15p composed of a thermosetting resin is applied to cover the upper portion of the circuit wafer 13, and the encapsulant 15p is also applied to the circuit wafer 13. Surroundings. 15 Next, in the reinforcing body arrangement program shown in Figs. 4(c) and 4(d), the reinforcing body 16 is positioned to surround the circuit wafer 13 and mounted on the base member. ^ Here, a method of manufacturing the reinforcing body 16 will be described with reference to Fig. 5 for the time being. Fig. 5 is a view showing a manufacturing method of the reinforcing body shown in Fig. 4. When manufacturing a reinforcing body, first, as shown in Fig. 5(a), a plurality of elongated rods made of a plurality of metals are arranged in the same direction 20, and the base material composed of the elastic body is assembled into a cylindrical shape, and secondly, As shown in Fig. 5(b), the one formed into a column shape is sliced into a disk shape, and secondly, as shown in Fig. 5(c), the hole is formed in the center of the sliced disk, thereby obtaining In the substrate 16a, the plurality of pillars 16b are reinforcing members 16 of a political structure. 12 200839973 Referring again to FIG. 4, as shown in FIGS. 4(c) and 4(d), if the reinforcing body 16 is disposed to sink into the encapsulant 15p, the encapsulant 15p is divided into the reinforcing body 16 The inner side and the outer side of the reinforcing body are two, and then, as shown in Fig. 4(d), the encapsulating agent 15p is cured by heating, whereby the inner portion 15a can be formed inside the reinforcing body 16 5 . Next, in the covering procedure shown in Fig. 4(e), the covering material 17 covers the base U from both sides of the front and back, and the covering material 17 is spliced by heating and pressurization. Program, you can get the rfid tag 10 shown in Figure 2. 10 Next, an application example of the above-described RnD tag will be described as an embodiment in which an object of an electronic device is provided with an R n D tag 实施. Fig. 6 is a view showing a manufacturing method of a garment equipped with an rFID label. For example, as shown in FIG. 6, the iRFID tag 10 shown in FIGS. 2 and 3 is attached to the label 5a of the garment 5 by pasting or the like, and is also displayed in the RFID tag 10 mounted on the garment 15 5 . For example, the information of the attribute of the clothes 5 is, for example, the attribute information of the clothing 5 such as the JAN code is sent from the information writing device 6 to the RFID tag 1 by wireless communication, and the circuit chip 13 (refer to FIG. 2) is used to memorize the information. Property information. In the implementation of the uranium description, the electronic device is described as the example 20 of the label. However, the electronic device of the present invention is not limited to the RFID tag. For example, it can be applied to a circuit chip mounted on a flexible substrate. Printed circuit board device. Fig. 7 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator to which the printed circuit board device is mounted. 13 200839973 The desk calculator 7 shown in Fig. 7 includes a calculator body portion 71 and a printed circuit board device 75 mounted on the calculator body portion 71. The printed circuit board device 75 has the same configuration as the RFID tag 10 shown in FIGS. 2 and 3, that is, the circuit chip 564 is mounted on the flexible printed circuit 77 (FPC77) as a substrate, and the illustration is omitted. However, on the FPC77, a reinforcing system in which a plurality of pillars extending in the thickness direction of the substrate are dispersed in the substrate is disposed to surround the circuit wafer, and the package system has an inner side of the buried reinforcing body and covers the upper portion of the circuit wafer by The FPC 77 encapsulates the structure of the circuit wafer 76. However, the circuit chip of the printed circuit board device 75 has a control function with the calculator body portion 71 10 and a signal transmitted between the circuit chip 76 and the calculator body portion 71 on the FPC 77. The wiring pattern is different from the RFID tag shown in the figure 2 in place of the antenna. The calculator main body unit 71 has display window portions 71a and operation keys 71b for performing various types of display, and is driven in accordance with the operation of the circuit chip 76, and is mounted with a printed circuit board device. The calculator main body portion 71 is flexed to prevent disconnection of the wiring pattern in the printed circuit board device 75. In addition, the case where the calculator main body portion 71 of the desktop calculator 7 is deflected is described here, but the present invention is not limited thereto, and may be applied to the electronic device in a bent state to be mounted on a machine having a hard case. The electronic device of the main body, or an electronic device in which the electronic device is easily bent when the electronic device is taken out from the main body of the machine due to repair or maintenance. Further, the present invention is not limited to a desktop calculator, and can be applied to various electronic devices such as mobile phones that mount an electronic device in which a circuit chip is mounted on a flexible substrate. Further, in the above embodiment, an example having a covering material will be described. However, the electronic device of the present invention is not limited thereto, and may be a member not provided with a covering material. Further, in the above embodiment, the base material of the reinforcing body is an example of the elastic body. However, the electronic device of the present invention is not limited thereto. For example, the material of the substrate may be acrylic (PMAA). Resin (p〇M), polyphenylene sulfide (PPS), polypropylene (PP), ABS resin (ABS), polyvinyl chloride resin (PVC) and other resins. [Simplified Explanation of the Type] Fig. 1 is a schematic cross-sectional view showing an example of an RFID tag of the prior art. 10 15 20 Fig. 2 is a perspective view showing the R F j d label according to an embodiment of the present invention. Fig. 3 is a plan view showing an RFID tag according to an embodiment of the present invention. Figures 4(a) through 4(e) are diagrams showing the method of manufacturing the RFID tag shown in Figures 2 and 3. Figures 5(a) to 5(c) are diagrams showing the manufacturing method of the reinforcing body shown in Fig. 4. Fig. 6 is a view showing a manufacturing method of clothes equipped with an RFID tag. Fig. 7 is a schematic view showing a printed circuit board device according to an embodiment of the present invention and a desktop calculator to which the printed circuit board device is mounted. [Description of main component symbols] 5···Clothes 5a...Standards 6···Information writing device 7...Tabletop calculator 10,90...RFID tag 11,91...Base 15 200839973 12,92··. Antenna 17,97...covering material 13,76,93...circuit wafer 71...calculator body portion 14,94...adhesive 71a...display window portion 15,15p,95...encapsulant 71b...operation key 15a...inner side 75...printed circuit board device 15b...outer side 77...flexible printed circuit 16,96...reinforcing body 93a...connection terminal 16a... Substrate 16b...pillar 95a...inner portion 16