JP2005235150A - Ic tag inclusion body and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To propose an IC tag inclusion body which has a smooth surface where irregularity thereof is hardly felt and is easily recovered, and a manufacturing method therefor. <P>SOLUTION: On the upper surface of the IC tag 1 in which an IC chip 4 is mounted on a wiring board 3 as an antenna 2, a film 5 is attached for sealing. The film 5 has an opening 6 facing the IC chip 4, a sealing material 7 is filled in the opening 6, and the upper surface thereof is flattened out. Thereby, the IC tag 1 with the film is flattened out at its upper and lower surfaces. A mat board 10 has a cutout part 11 of a shape corresponding to the IC tag 1 at its center, and has a thickness equal to that of the IC tag 1. If the IC tag 1 is fitted in the cutout part 11 of the mat board 10, its upper and lower surfaces are flattened out. On the upper and lower surfaces of the mat board 10, two sheets 20, 21 of sealing paper of the same shape are attached for sealing. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC chip with an antenna in which an antenna is incorporated so that wireless communication is possible, that is, an IC tag.

  In recent distribution sites, the use of IC tags instead of slips and bar codes is being considered. That is, the IC tag can exchange data with a distant computer by non-contact wireless communication, and the amount of data that can be managed is extremely large. Therefore, it is expected that the IC tag will become mainstream in the future in logistics management.

  The IC tag is collected and reused after use, and a technique such as Patent Document 1 has been proposed as an IC tag enclosure that enables this.

  JP2002-157567

  In this IC tag enclosure, an IC tag is loaded in a non-adhered state on the inner surface of the base material and the covering material, and the inner surface of the base material and the covering material on the outer periphery is joined by an adhesive layer. However, since the IC tag is non-adhesive for recovery, it can move freely in the loading section. In general, an IC tag having a structure in which an IC chip is mounted on a flexible antenna substrate is simply an IC chip sealed by potting a sealing material. When the stop is made of paper, the sealing part is uneven when touched from the surface, and this part is weakened in strength.

  The present invention has been made in view of the above problems, and proposes an IC tag enclosure and a method for producing the same, which has a flat surface, almost no unevenness, and can be easily collected.

  The manufacturing method of an IC tag enclosure according to the present invention has an opening on the upper surface of an IC tag formed by placing an IC chip on a wiring board serving as an antenna, Production of an IC tag with a film that seals a film having the same shape, encloses a sealing material in the opening of the sealed film, seals the IC chip facing the opening, and flattens the upper surface of the film The IC tag with film is inserted into the cutout portion of the mount having the thickness equivalent to the thickness of the IC tag with film and the shape corresponding to the IC tag, and the IC tag with film is inserted. And a sealing process in which sealing paper is sealed on the upper and lower surfaces of the mount and the IC tag with film is sealed.

  And in this invention, the IC tag enclosure manufactured by such a manufacturing method is also provided. In other words, on the upper surface of an IC tag formed by placing an IC chip on a wiring board serving as an antenna, a film having an opening that can accommodate the IC chip and having the same shape as the IC tag is sealed. An IC tag with a film in which a sealing material is sealed in the opening of the sealed film to seal the IC chip facing the opening and the upper surface of the film is flattened, and a thickness equivalent to the IC tag with the film A cutout portion having a thickness corresponding to that of an IC tag is formed, and a base plate in which the IC tag with a film is fitted into the cutout portion, and the upper and lower surfaces of the mount on which the IC tag with the film is fitted are sealed. There is provided an IC tag enclosing body comprising a sealing paper containing an IC tag with a film.

  As a recovery method for recovering an IC tag from such an IC tag enclosure, in the present invention, the IC tag enclosure is immersed in water and the mount and the sealing paper are peeled off, whereby the IC tag with a film is taken out and collected. We propose a collection method characterized by this.

  According to the manufacturing method of the present invention and the IC tag encapsulant obtained thereby, the upper surface of the IC tag (IC chip) is obtained by sealing the film with an opening to the IC tag and enclosing and filling the opening with a sealing material. The mounting surface is flattened. Then, this is fitted into a cutout portion of a mount having a corresponding thickness, thereby achieving flattening by combining the mount and the IC tag. Therefore, if an appropriate sealing paper is sealed on this surface, an IC tag encapsulating body which is flat and has no unevenness as a whole is formed. Moreover, since the IC tag is fitted and held in a cutout portion having a corresponding shape, it does not move inside.

  Furthermore, since the IC tag is only inserted into the mount and is restrained from above and below by the sealing paper, it can be easily recovered by a simple method that is applied to water.

  FIG. 1 shows an example of an IC tag with a film, and FIG. 2 shows an example of an enclosure in which the IC tag with a film is encapsulated, and an embodiment of the present invention will be described.

  The IC tag 1 is formed by bonding an IC chip 4 on a wiring substrate 3 on which an antenna 2 is printed, and a flattening film 5 is sealed on the upper surface thereof. The film 5 has an opening 6 that allows the IC chip 4 to face, and a sealing material 7 is enclosed in the opening 6 to flatten the upper surface. Thereby, the IC tag with film 1 is flat on both the upper and lower surfaces, and is sufficient for protecting the IC chip 4.

  The mount 10 into which the IC tag with film 1 is fitted has a cutout portion 11 having a shape corresponding to the IC tag 1 at the center, and the thickness thereof is equal to the thickness of the IC tag with film 1. Therefore, when the IC tag with film 1 is fitted into the cutout portion 11 of the mount 10, the upper and lower surfaces thereof become flat, and a surface having substantially no unevenness is formed. At this time, an adhesive or the like is not used, and the IC tag with film 1 is merely fitted into the mount 10.

  After the IC tag with film 1 is fitted into the mount 10, sealing papers 20 and 21 having the same shape as the mount 10 are sealed on the upper and lower surfaces in this example. These sealing papers 20 and 21 are adhered to the contact surface with the mount 10 by applying an adhesive, and nothing is attached to the portion of the IC tag with film 1. As a result, the IC tag with film 1 is sealed so as not to move by being sandwiched between the mount 10 and the sealing papers 20 and 21 in the non-adhesive state.

  In order to recover the IC tag 1 from such an IC tag enclosure, the IC tag with film 1 is not adhered, and the mount 10 and the sealing papers 20 and 21 are attached, for example, by applying the whole to water or a solvent. Since both are made of paper, they can be easily peeled off and only the IC tag with film 1 can be taken out and collected.

  FIG. 1 shows an IC tag with film according to the present invention.   FIG. 2 is a view showing an IC tag enclosure according to the present invention in which the film-attached IC tag of FIG. 1 is enclosed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC tag with film 2 Antenna 3 Wiring board 4 IC chip 5 Film 6 Opening 7 Sealing material 10 Mount 11 Cutout part 20 and 21 Sealing paper

Claims (4)

On the upper surface of an IC tag formed by placing an IC chip on a wiring board serving as an antenna, a film having an opening capable of accommodating the IC chip and having the same shape as the IC tag is sealed. A process for producing an IC tag with a film that encapsulates a sealing material in the opening of the sealed film and seals the IC chip facing the opening, and flattens the top surface of the film;
The IC tag with film was fitted into the cutout portion of the mount having a thickness equivalent to the thickness of the IC tag with film and having a shape corresponding to the IC tag, and the IC tag with film was fitted. And a sealing process in which sealing paper is sealed on the upper and lower surfaces of the mount and the IC tag with film is sealed.   An IC tag enclosure produced by the production method according to claim 1. On the upper surface of an IC tag formed by placing an IC chip on a wiring board serving as an antenna, a film having an opening capable of accommodating the IC chip and having the same shape as the IC tag is sealed. An IC tag with a film formed by sealing a sealing material in the opening of the sealed film to seal the IC chip facing the opening and flattening the upper surface of the film;
A cutout portion having a thickness corresponding to the thickness of the IC tag with film and having a shape corresponding to the IC tag, and a mount on which the IC tag with film is fitted in the cutout portion;
An IC tag enclosure comprising: a sealing paper which is sealed on the upper and lower surfaces of a mount on which the IC tag with a film is fitted and encloses the IC tag with a film.   A recovery method for recovering an IC tag with a film from the IC tag enclosure according to claim 2 or claim 3, wherein the film is obtained by immersing the IC tag enclosure in water and peeling the mount and the sealing paper. A collecting method, wherein the attached IC tag is taken out and collected.

Images