JP4960783B2 - 直下方式バックライト装置 - Google Patents

直下方式バックライト装置 Download PDF

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Publication number
JP4960783B2
JP4960783B2 JP2007177181A JP2007177181A JP4960783B2 JP 4960783 B2 JP4960783 B2 JP 4960783B2 JP 2007177181 A JP2007177181 A JP 2007177181A JP 2007177181 A JP2007177181 A JP 2007177181A JP 4960783 B2 JP4960783 B2 JP 4960783B2
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JP
Japan
Prior art keywords
light emitting
backlight device
emitting element
substrate
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007177181A
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English (en)
Japanese (ja)
Other versions
JP2008021650A (ja
Inventor
ジュン リー、ウォン
テ イョオ、イン
ジョー ハン、フン
サム パク、ヤン
テグ ハン、キュン
シク アン、ホ
ホ ソン、チャン
Original Assignee
サムソン エルイーディー カンパニーリミテッド．
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Publication of JP2008021650A publication Critical patent/JP2008021650A/ja
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Publication of JP4960783B2 publication Critical patent/JP4960783B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
JP2007177181A 2006-07-10 2007-07-05 直下方式バックライト装置 Expired - Fee Related JP4960783B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060064543A KR100809263B1 (ko) 2006-07-10 2006-07-10 직하 방식 백라이트 장치
KR10-2006-0064543 2006-07-10

Publications (2)

Publication Number Publication Date
JP2008021650A JP2008021650A (ja) 2008-01-31
JP4960783B2 true JP4960783B2 (ja) 2012-06-27

Family

ID=38918955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007177181A Expired - Fee Related JP4960783B2 (ja) 2006-07-10 2007-07-05 直下方式バックライト装置

Country Status (5)

Country Link
US (1) US7887225B2 (ko)
JP (1) JP4960783B2 (ko)
KR (1) KR100809263B1 (ko)
CN (1) CN100529912C (ko)
TW (1) TWI366722B (ko)

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DE102008006990A1 (de) * 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Hintergrundbeleuchtungseinheit für eine Hintergrundbeleuchtung eines Bildschirms und Bildschirmeinheit des Bildschirms
CN102047452B (zh) * 2008-05-30 2013-03-20 夏普株式会社 发光装置、面光源、液晶显示装置和制造发光装置的方法
TWI449221B (zh) * 2009-01-16 2014-08-11 Everlight Electronics Co Ltd 發光二極體封裝結構及其製造方法
JP5061139B2 (ja) * 2009-02-12 2012-10-31 株式会社住田光学ガラス 発光装置の製造方法
JP2010218847A (ja) * 2009-03-16 2010-09-30 Showa Denko Kk 照明装置
KR100959675B1 (ko) 2009-04-17 2010-06-01 (주)디딤라이트 일체형 발광다이오드
US20120105739A1 (en) * 2009-07-21 2012-05-03 Sharp Kabushiki Kaisha Lens unit, light emitting-module, illumination device, display device and television receiver
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
WO2011114608A1 (ja) * 2010-03-15 2011-09-22 パナソニック株式会社 発光装置、面光源および液晶ディスプレイ装置
TW201135980A (en) * 2010-04-02 2011-10-16 Icp Technology Co Ltd Light-emitting diode with substrate having surrounding wall and manufacturing method thereof
WO2011146677A2 (en) * 2010-05-20 2011-11-24 Light Prescriptions Innovators, Llc Led light bulb with translucent spherical diffuser and remote phosphor thereupon
JP2012009530A (ja) * 2010-06-23 2012-01-12 Hiroshi Ninomiya ベアチップ実装面発光体及びその製造方法
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
JP5841325B2 (ja) * 2010-11-19 2016-01-13 宏 二宮 ベアチップ実装面発光体
JP2013004815A (ja) 2011-06-17 2013-01-07 Sony Corp 光源回路ユニットおよび照明装置、並びに表示装置
US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
TW201304212A (zh) * 2011-07-01 2013-01-16 Gio Optoelectronics Corp 發光裝置及其製造方法
DE102011115150A1 (de) * 2011-09-27 2013-03-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung mindestens eines strahlungsemittierenden und/oder -empfangenden Halbleiterbauteils und Halbleiterbauteil
US20130200414A1 (en) 2011-10-26 2013-08-08 Epistar Corporation Light-emitting diode device
JP2013149637A (ja) * 2012-01-17 2013-08-01 Asahi Glass Co Ltd 発光装置および発光装置の製造方法
JP2014135471A (ja) * 2012-12-10 2014-07-24 Nitto Denko Corp 発光装置、発光装置集合体および電極付基板
KR101823570B1 (ko) * 2012-10-22 2018-01-30 센서 일렉트로닉 테크놀로지, 인크 2 단자 패키징
KR101453041B1 (ko) * 2013-01-09 2014-10-23 우리이앤엘 주식회사 발광 장치
TWI626769B (zh) * 2013-01-29 2018-06-11 晶元光電股份有限公司 發光元件之封裝結構
CN104415542A (zh) * 2013-09-05 2015-03-18 美泰有限公司 发光玩偶
JP6372257B2 (ja) * 2014-08-29 2018-08-15 東芝ライテック株式会社 車両用発光モジュール、車両用照明装置、および車両用灯具
CN105990492A (zh) * 2015-02-12 2016-10-05 展晶科技(深圳)有限公司 发光二极管封装体及其制造方法
CN105372872A (zh) * 2015-09-30 2016-03-02 宁波付世光电科技股份有限公司 一种直下式正三角阵列led背光模组
DE102016116298A1 (de) 2016-09-01 2018-03-01 Osram Opto Semiconductors Gmbh Anordnung mit Träger und optoelektronischem Bauelement
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JP7054018B2 (ja) * 2020-04-22 2022-04-13 日亜化学工業株式会社 発光装置
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Also Published As

Publication number Publication date
JP2008021650A (ja) 2008-01-31
TW200813568A (en) 2008-03-16
US20080007939A1 (en) 2008-01-10
TWI366722B (en) 2012-06-21
US7887225B2 (en) 2011-02-15
KR20080005774A (ko) 2008-01-15
CN100529912C (zh) 2009-08-19
CN101105604A (zh) 2008-01-16
KR100809263B1 (ko) 2008-02-29

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