JP4959080B2 - 反射マスク基板のコーティング - Google Patents
反射マスク基板のコーティング Download PDFInfo
- Publication number
- JP4959080B2 JP4959080B2 JP2001501941A JP2001501941A JP4959080B2 JP 4959080 B2 JP4959080 B2 JP 4959080B2 JP 2001501941 A JP2001501941 A JP 2001501941A JP 2001501941 A JP2001501941 A JP 2001501941A JP 4959080 B2 JP4959080 B2 JP 4959080B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- silicon
- surface side
- mask substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/46—Antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13815899P | 1999-06-07 | 1999-06-07 | |
| US60/138,158 | 1999-06-07 | ||
| PCT/US2000/015578 WO2000075727A2 (en) | 1999-06-07 | 2000-06-06 | Coatings on reflective mask substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003501823A JP2003501823A (ja) | 2003-01-14 |
| JP2003501823A5 JP2003501823A5 (https=) | 2007-06-07 |
| JP4959080B2 true JP4959080B2 (ja) | 2012-06-20 |
Family
ID=22480708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001501941A Expired - Lifetime JP4959080B2 (ja) | 1999-06-07 | 2000-06-06 | 反射マスク基板のコーティング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6352803B1 (https=) |
| EP (1) | EP1190276A2 (https=) |
| JP (1) | JP4959080B2 (https=) |
| KR (1) | KR100805360B1 (https=) |
| AU (1) | AU5597000A (https=) |
| WO (1) | WO2000075727A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200011859A (ko) * | 2018-07-25 | 2020-02-04 | 주식회사 야스 | 유리 마스크 |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2797060B1 (fr) * | 1999-07-29 | 2001-09-14 | Commissariat Energie Atomique | Structure pour masque de lithographie en reflexion et procede pour sa realisation |
| US6319635B1 (en) * | 1999-12-06 | 2001-11-20 | The Regents Of The University Of California | Mitigation of substrate defects in reticles using multilayer buffer layers |
| US6368942B1 (en) * | 2000-03-31 | 2002-04-09 | Euv Llc | Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer |
| US6524881B1 (en) * | 2000-08-25 | 2003-02-25 | Micron Technology, Inc. | Method and apparatus for marking a bare semiconductor die |
| US6821682B1 (en) * | 2000-09-26 | 2004-11-23 | The Euv Llc | Repair of localized defects in multilayer-coated reticle blanks for extreme ultraviolet lithography |
| US6737201B2 (en) * | 2000-11-22 | 2004-05-18 | Hoya Corporation | Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device |
| JP3939132B2 (ja) * | 2000-11-22 | 2007-07-04 | Hoya株式会社 | 多層膜付き基板、露光用反射型マスクブランク、露光用反射型マスクおよびその製造方法、並びに半導体の製造方法 |
| DE10206143B4 (de) * | 2001-02-14 | 2006-11-16 | Hoya Corp. | Reflektierender Maskenrohling und reflektierende Maske für EUV-Belichtung und Verfahren zum Herstellen der Maske |
| JP2002299228A (ja) * | 2001-04-03 | 2002-10-11 | Nikon Corp | レチクル、それを用いた露光装置及び露光方法 |
| DE10164112A1 (de) * | 2001-12-24 | 2003-07-03 | Inst Oberflaechenmodifizierung | Verfahren zur Defektanalyse an reflektiven Optiken |
| US7169685B2 (en) * | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
| KR100455383B1 (ko) * | 2002-04-18 | 2004-11-06 | 삼성전자주식회사 | 반사 포토마스크, 반사 포토마스크의 제조방법 및 이를이용한 집적회로 제조방법 |
| US6777137B2 (en) * | 2002-07-10 | 2004-08-17 | International Business Machines Corporation | EUVL mask structure and method of formation |
| US7129010B2 (en) * | 2002-08-02 | 2006-10-31 | Schott Ag | Substrates for in particular microlithography |
| US7056627B2 (en) * | 2002-08-23 | 2006-06-06 | Hoya Corporation | Method of manufacturing a reflection type mask blank and method of manufacturing a reflection type mask |
| DE10255605B4 (de) * | 2002-11-28 | 2005-07-07 | Infineon Technologies Ag | Reflektionsmaske zur Projektion einer Struktur auf einen Halbleiterwafer sowie Verfahren zu deren Herstellung |
| DE10302342A1 (de) * | 2003-01-17 | 2004-08-05 | Schott Glas | Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür |
| DE10317792A1 (de) * | 2003-04-16 | 2004-11-11 | Schott Glas | Maskenrohling zur Verwendung in der EUV-Lithographie und Verfahren zu dessen Herstellung |
| JP4232018B2 (ja) * | 2003-07-25 | 2009-03-04 | 信越化学工業株式会社 | フォトマスクブランク用基板の選定方法 |
| US7075103B2 (en) * | 2003-12-19 | 2006-07-11 | General Electric Company | Multilayer device and method of making |
| US20050238922A1 (en) * | 2003-12-25 | 2005-10-27 | Hoya Corporation | Substrate with a multilayer reflection film, reflection type mask blank for exposure, reflection type mask for exposure and methods of manufacturing them |
| JP2005210093A (ja) * | 2003-12-25 | 2005-08-04 | Hoya Corp | 多層反射膜付き基板、露光用反射型マスクブランクス及び露光用反射型マスク、並びにそれらの製造方法 |
| US7198872B2 (en) * | 2004-05-25 | 2007-04-03 | International Business Machines Corporation | Light scattering EUVL mask |
| DE102004031079B4 (de) * | 2004-06-22 | 2008-11-13 | Qimonda Ag | Verfahren zur Herstellung einer Reflexionsmaske |
| US20060008749A1 (en) * | 2004-07-08 | 2006-01-12 | Frank Sobel | Method for manufacturing of a mask blank for EUV photolithography and mask blank |
| US7407729B2 (en) * | 2004-08-05 | 2008-08-05 | Infineon Technologies Ag | EUV magnetic contrast lithography mask and manufacture thereof |
| DE102004038548A1 (de) * | 2004-08-06 | 2006-03-16 | Schott Ag | Verfahren zur Herstellung eines Maskenblank für photolithographische Anwendungen und Maskenblank |
| JP4604140B2 (ja) * | 2004-09-13 | 2010-12-22 | マニー株式会社 | 医療用針又は刃物 |
| JP5042456B2 (ja) * | 2005-03-03 | 2012-10-03 | 凸版印刷株式会社 | ステンシルマスクの製造方法 |
| US20070093038A1 (en) * | 2005-10-26 | 2007-04-26 | Andreas Koenig | Method for making microchips and microchip made according to this method |
| JP5082857B2 (ja) | 2005-12-12 | 2012-11-28 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、および該マスクブランク用の導電膜付基板 |
| US7678511B2 (en) | 2006-01-12 | 2010-03-16 | Asahi Glass Company, Limited | Reflective-type mask blank for EUV lithography |
| KR100755395B1 (ko) | 2006-08-31 | 2007-09-04 | 삼성전자주식회사 | 반사 마스크, 반사 마스크 고정 장치 및 방법 |
| JP4958147B2 (ja) * | 2006-10-18 | 2012-06-20 | Hoya株式会社 | 露光用反射型マスクブランク及び露光用反射型マスク、多層反射膜付き基板、並びに半導体装置の製造方法 |
| WO2008072706A1 (ja) | 2006-12-15 | 2008-06-19 | Asahi Glass Company, Limited | Euvリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板 |
| ATE526679T1 (de) * | 2006-12-27 | 2011-10-15 | Asahi Glass Co Ltd | Reflexionsmaskenrohling für euv-lithographie |
| JP5018789B2 (ja) * | 2007-01-31 | 2012-09-05 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| JP5040996B2 (ja) | 2007-04-17 | 2012-10-03 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| WO2009136564A1 (ja) * | 2008-05-09 | 2009-11-12 | Hoya株式会社 | 反射型マスク、反射型マスクブランク及びその製造方法 |
| JP2010135732A (ja) | 2008-08-01 | 2010-06-17 | Asahi Glass Co Ltd | Euvマスクブランクス用基板 |
| NL2003305A (en) | 2008-08-21 | 2010-03-10 | Asml Holding Nv | Euv reticle substrates with high thermal conductivity. |
| KR20110065439A (ko) | 2008-09-05 | 2011-06-15 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법 |
| JP2010122304A (ja) * | 2008-11-17 | 2010-06-03 | Dainippon Printing Co Ltd | 反射型マスクブランクス、反射型マスク、反射型マスクブランクスの製造方法、および、反射型マスクの製造方法 |
| WO2011004850A1 (ja) | 2009-07-08 | 2011-01-13 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| US8705027B2 (en) | 2009-07-16 | 2014-04-22 | Kla-Tencor Corporation | Optical defect amplification for improved sensitivity on patterned layers |
| TWI467318B (zh) | 2009-12-04 | 2015-01-01 | 旭硝子股份有限公司 | An optical member for EUV microfilm, and a method for manufacturing a substrate with a reflective layer for EUV microfilm |
| WO2011071086A1 (ja) | 2009-12-09 | 2011-06-16 | 旭硝子株式会社 | Euvリソグラフィ用光学部材 |
| TWI464529B (zh) | 2009-12-09 | 2014-12-11 | 旭硝子股份有限公司 | EUV microfilm with anti-reflective substrate, EUV microsurgical reflective mask substrate, EUV microsurgical reflective mask and manufacturing method of the reflective substrate |
| JP5533395B2 (ja) * | 2010-07-26 | 2014-06-25 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクの製造方法 |
| KR20130111524A (ko) | 2010-07-27 | 2013-10-10 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사층 형성 기판, 및 euv 리소그래피용 반사형 마스크 블랭크 |
| US8192901B2 (en) * | 2010-10-21 | 2012-06-05 | Asahi Glass Company, Limited | Glass substrate-holding tool |
| KR101857844B1 (ko) | 2011-02-04 | 2018-05-14 | 아사히 가라스 가부시키가이샤 | 도전막이 형성된 기판, 다층 반사막이 형성된 기판, 및 euv 리소그래피용 반사형 마스크 블랭크 |
| JP2011211250A (ja) * | 2011-07-29 | 2011-10-20 | Toppan Printing Co Ltd | ステンシルマスクブランク、ステンシルマスク、及びその製造方法、並びにパターン露光方法 |
| KR101993322B1 (ko) | 2011-09-28 | 2019-06-26 | 호야 가부시키가이샤 | 마스크블랭크용 유리기판, 다층 반사막 부착 기판, 마스크블랭크 및 마스크, 그리고 그것들의 제조방법 |
| US20140272684A1 (en) | 2013-03-12 | 2014-09-18 | Applied Materials, Inc. | Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor |
| US9354508B2 (en) * | 2013-03-12 | 2016-05-31 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| US9417515B2 (en) * | 2013-03-14 | 2016-08-16 | Applied Materials, Inc. | Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor |
| KR20160140895A (ko) | 2014-04-02 | 2016-12-07 | 지고 코포레이션 | 리소그래피용 포토마스크 |
| US9618836B2 (en) | 2014-04-22 | 2017-04-11 | Asahi Glass Company, Limited | Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production |
| TWI694304B (zh) | 2015-06-08 | 2020-05-21 | 日商Agc股份有限公司 | Euv微影術用反射型光罩基底 |
| KR102380156B1 (ko) * | 2015-06-30 | 2022-03-29 | 삼성디스플레이 주식회사 | 플라즈마 화학 기상 증착 장치 |
| US10539884B2 (en) | 2018-02-22 | 2020-01-21 | International Business Machines Corporation | Post-lithography defect inspection using an e-beam inspection tool |
| US10578981B2 (en) | 2018-07-25 | 2020-03-03 | International Business Machines Corporation | Post-lithography defect inspection using an e-beam inspection tool |
| DE102019100839B4 (de) * | 2019-01-14 | 2024-11-14 | Advanced Mask Technology Center Gmbh & Co. Kg | Fotomaskenanordnung mit reflektierender fotomaske und verfahren zum herstellen einer reflektierenden fotomaske |
| JP7350571B2 (ja) | 2019-08-30 | 2023-09-26 | Hoya株式会社 | 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法 |
| JP7318607B2 (ja) | 2020-07-28 | 2023-08-01 | Agc株式会社 | Euvリソグラフィ用反射型マスクブランク、euvリソグラフィ用反射型マスク、およびそれらの製造方法 |
| KR102645567B1 (ko) | 2021-02-16 | 2024-03-11 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크, euv 리소그래피용 반사형 마스크 및 그것들의 제조 방법 |
| JP7367901B1 (ja) | 2022-04-28 | 2023-10-24 | Agc株式会社 | 反射型マスクブランク、反射型マスクブランクの製造方法、反射型マスク、反射型マスクの製造方法 |
| JP2024142243A (ja) | 2023-03-29 | 2024-10-10 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、および半導体装置の製造方法 |
| WO2025226454A1 (en) * | 2024-04-26 | 2025-10-30 | Lam Research Corporation | Methods to enhance glass substrate handling in semiconductor processing |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154452A (ja) * | 1983-02-21 | 1984-09-03 | Dainippon Printing Co Ltd | 軟x線転写用マスク及びその製造法 |
| JPS61116358A (ja) * | 1984-11-09 | 1986-06-03 | Mitsubishi Electric Corp | フオトマスク材料 |
| US4868093A (en) * | 1987-05-01 | 1989-09-19 | American Telephone And Telegraph Company, At&T Bell Laboratories | Device fabrication by X-ray lithography utilizing stable boron nitride mask |
| JP2779221B2 (ja) * | 1989-08-25 | 1998-07-23 | 沖電気工業株式会社 | 位相差レチクルを用いた露光及び検査方法 |
| JP2751981B2 (ja) * | 1992-07-22 | 1998-05-18 | 株式会社日立製作所 | 電子線描画装置 |
| US5500312A (en) * | 1994-10-11 | 1996-03-19 | At&T Corp. | Masks with low stress multilayer films and a process for controlling the stress of multilayer films |
| US5521031A (en) * | 1994-10-20 | 1996-05-28 | At&T Corp. | Pattern delineating apparatus for use in the EUV spectrum |
| JP3578872B2 (ja) * | 1995-10-26 | 2004-10-20 | 三菱電機株式会社 | X線マスクの製造方法および加熱装置 |
| JPH09232216A (ja) * | 1996-02-27 | 1997-09-05 | Fujitsu Ltd | X線マスクの製造方法及び製造装置 |
| KR100223023B1 (ko) * | 1996-08-21 | 1999-10-01 | 정선종 | X-선 마스크 |
| US6027815A (en) * | 1996-11-06 | 2000-02-22 | Taiwan Semiconductor Manufacturing Company | Non-absorbing anti-reflective coated (ARC) reticle using thin dielectric films and method of forming reticle |
| JP3437389B2 (ja) * | 1996-11-08 | 2003-08-18 | 信越化学工業株式会社 | 電子線およびx線リソグラフィ用マスクメンブレン |
| JPH10177943A (ja) * | 1996-12-18 | 1998-06-30 | Hitachi Ltd | 投影露光方法 |
| US6042995A (en) * | 1997-12-09 | 2000-03-28 | Lucent Technologies Inc. | Lithographic process for device fabrication using a multilayer mask which has been previously inspected |
| US5958629A (en) * | 1997-12-22 | 1999-09-28 | Intel Corporation | Using thin films as etch stop in EUV mask fabrication process |
| US6048652A (en) * | 1998-12-04 | 2000-04-11 | Advanced Micro Devices, Inc. | Backside polish EUV mask and method of manufacture |
| US6159643A (en) * | 1999-03-01 | 2000-12-12 | Advanced Micro Devices, Inc. | Extreme ultraviolet lithography reflective mask |
-
2000
- 2000-06-06 AU AU55970/00A patent/AU5597000A/en not_active Abandoned
- 2000-06-06 JP JP2001501941A patent/JP4959080B2/ja not_active Expired - Lifetime
- 2000-06-06 WO PCT/US2000/015578 patent/WO2000075727A2/en not_active Ceased
- 2000-06-06 EP EP00941241A patent/EP1190276A2/en not_active Withdrawn
- 2000-06-06 US US09/587,836 patent/US6352803B1/en not_active Expired - Lifetime
- 2000-06-06 KR KR1020017014245A patent/KR100805360B1/ko not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200011859A (ko) * | 2018-07-25 | 2020-02-04 | 주식회사 야스 | 유리 마스크 |
| KR102146162B1 (ko) * | 2018-07-25 | 2020-08-19 | 주식회사 야스 | 유리 마스크 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1190276A2 (en) | 2002-03-27 |
| WO2000075727A3 (en) | 2001-05-17 |
| KR20020010912A (ko) | 2002-02-06 |
| WO2000075727A2 (en) | 2000-12-14 |
| AU5597000A (en) | 2000-12-28 |
| US6352803B1 (en) | 2002-03-05 |
| KR100805360B1 (ko) | 2008-02-20 |
| JP2003501823A (ja) | 2003-01-14 |
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