JP4950892B2 - Uゲートトランジスタ及び製造方法 - Google Patents
Uゲートトランジスタ及び製造方法 Download PDFInfo
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- JP4950892B2 JP4950892B2 JP2007532575A JP2007532575A JP4950892B2 JP 4950892 B2 JP4950892 B2 JP 4950892B2 JP 2007532575 A JP2007532575 A JP 2007532575A JP 2007532575 A JP2007532575 A JP 2007532575A JP 4950892 B2 JP4950892 B2 JP 4950892B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000010410 layer Substances 0.000 claims description 258
- 239000004065 semiconductor Substances 0.000 claims description 95
- 239000011241 protective layer Substances 0.000 claims description 69
- 125000006850 spacer group Chemical group 0.000 claims description 69
- 238000000034 method Methods 0.000 claims description 43
- 238000005530 etching Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 238000002161 passivation Methods 0.000 description 8
- 235000012239 silicon dioxide Nutrition 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UJXZVRRCKFUQKG-UHFFFAOYSA-K indium(3+);phosphate Chemical compound [In+3].[O-]P([O-])([O-])=O UJXZVRRCKFUQKG-UHFFFAOYSA-K 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010955 robust manufacturing process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/7853—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Description
Claims (17)
- 半導体構造を製造する方法であって、
第1の絶縁層上の一部に、上側にマスク層が形成された半導体材料のフィンを形成する工程と、
前記マスク層の2つの外側壁及び前記第1の絶縁層の前記フィンの両側にある部分上に、炭素をドーピングした窒化シリコンを含む保護層を堆積する工程と、
前記保護層上に第2の絶縁層を形成する工程と、
前記第2の絶縁層を形成する工程の後に、前記マスク層を除去する工程と、
前記マスク層を除去する工程の後に、前記保護層に隣接する前記フィン上に窒化シリコンを含むスペーサを形成する工程と、
前記スペーサを形成する工程の後に、前記フィン内に、底面と、向かい合っている内側壁とを有する凹部を形成する工程と
を含む、
半導体構造を製造する方法。 - 前記フィンの上側表面と前記マスク層との間にバッファ層がある、請求項1に記載の半導体構造を製造する方法。
- 前記保護層は前記フィンの2つの外側壁と、前記マスク層の2つの外側壁と、前記第1の絶縁層の前記フィンの両側にある部分とを覆う、請求項2に記載の半導体構造を製造する方法。
- 前記保護層は、前記フィンの前記2つの外側壁、及び前記第1の絶縁層の前記フィンの両側にある前記部分がアンダーカットされるのを防ぐ、請求項3に記載の半導体構造を形成する方法。
- 前記フィン上に前記第2の絶縁層を形成する工程は、該第2の絶縁層の上側表面が前記マスク層の前記上側表面と概ね同一平面を成すように、前記第2の絶縁層を平坦化する工程を含む、請求項3に記載の半導体構造を形成する方法。
- 前記半導体材料の前記フィンを形成する工程は、
基板上にある前記第1の絶縁層上に前記半導体材料の層を堆積する工程と、
該半導体材料の該層上に前記マスク層を堆積する工程と、
該半導体材料の該層上にある前記マスク層をパターニングするとともに、エッチングする工程と、
前記エッチングする工程の後に、前記半導体材料の前記層をエッチングして、前記フィンを形成する工程と
を含む、請求項1から5のいずれか一項に記載の半導体構造を製造する方法。 - 前記フィンの上側表面及び外側壁と、前記フィン内の前記凹部の前記底面及び前記向かい合っている側壁とを覆うゲート誘電体層を形成する工程と、
該ゲート誘電体層上にゲート電極を形成する工程と、
該ゲート電極の両側にある前記フィン内にソース領域及びドレイン領域を形成する工程と
をさらに含む、請求項1から6のいずれか一項に記載の半導体構造を製造する方法。 - 前記スペーサは、前記凹部の前記向かい合っている側壁及び前記底面の厚みを制御する、請求項1から7のいずれか一項に記載の半導体構造を製造する方法。
- 前記マスク層を除去する工程は、前記マスク層をエッチングする工程を含み、
前記マスク層をエッチングする前記工程において、前記保護層のエッチング速度は、前記マスク層のエッチング速度よりも遅い、請求項1から8のいずれか一項に記載の半導体構造を製造する方法。 - 前記スペーサの高さは、前記凹部の前記底面の厚みを制御する、請求項1から9のいずれか一項に記載の半導体構造を製造する方法。
- 前記スペーサのそれぞれの幅は、前記凹部の前記向かい合っている側壁のそれぞれの厚みを決定する、請求項1から10のいずれか一項に記載の半導体構造を製造する方法。
- 前記凹部の前記底面は、該凹部の前記向かい合っている側壁のそれぞれよりも薄い、請求項1から11のいずれか一項に記載の半導体構造を製造する方法。
- 前記フィン内に前記凹部を形成する工程の後で、前記第2の絶縁層を除去する工程と、
前記第2の絶縁層を除去する工程の後で、前記スペーサ及び前記バッファ層を除去する工程と、
をさらに含む、請求項2から5のいずれか一項に記載の半導体構造を製造する方法。 - 半導体構造であって、
上側表面と側壁とを有する、絶縁層上にある半導体材料のフィンを備え、
前記フィンは、前記上側表面から前記フィンの内側に形成された凹部を有し、
前記凹部は、底面と、前記底面から前記上側表面の方向に伸びる第1の側壁と、前記第1の側壁から前記側壁の方向に伸びる段面と、前記段面から前記上側表面まで伸びる第2の側壁とで形成される、
半導体構造。 - 前記上側表面上、前記第1の側壁上、前記第2の側壁上、前記底面上、前記段面上、前記側壁上にあるゲート誘電体と、
前記ゲート誘電体上に形成されるゲート電極と、
前記ゲート電極の両側に形成されるソース領域及びドレイン領域と
をさらに含む、請求項14に記載の半導体構造。 - 前記凹部の前記底面から前記フィンの裏面までの距離、及び前記凹部の前記第1の側壁から前記側壁までの距離は、完全に空乏したチャネルを形成するほど十分に短い、請求項14または15に記載の半導体構造。
- 前記底面と前記第1の側壁とがなす角、前記第1の側壁と前記段面とがなす角、前記段面と前記第2の側壁とがなす角、前記第2の側壁と前記上側表面とがなす角、及び、前記上側表面と前記側壁とがなす角の少なくとも1つは、直角である、請求項14から16のいずれか一項に記載の半導体構造。
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US10/949,994 | 2004-09-23 | ||
US10/949,994 US7071064B2 (en) | 2004-09-23 | 2004-09-23 | U-gate transistors and methods of fabrication |
PCT/US2005/033439 WO2006036629A1 (en) | 2004-09-23 | 2005-09-16 | U-gate transistors and methods of fabrication |
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JP2011103294A Division JP5299928B2 (ja) | 2004-09-23 | 2011-05-02 | Uゲートトランジスタ製造方法 |
JP2011103293A Division JP5299927B2 (ja) | 2004-09-23 | 2011-05-02 | Uゲートトランジスタ製造方法 |
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JP2008514014A JP2008514014A (ja) | 2008-05-01 |
JP4950892B2 true JP4950892B2 (ja) | 2012-06-13 |
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JP2011103293A Expired - Fee Related JP5299927B2 (ja) | 2004-09-23 | 2011-05-02 | Uゲートトランジスタ製造方法 |
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US (1) | US7071064B2 (ja) |
JP (3) | JP4950892B2 (ja) |
KR (1) | KR100909886B1 (ja) |
CN (1) | CN101366122B (ja) |
DE (2) | DE112005003843B4 (ja) |
GB (1) | GB2430805B (ja) |
WO (1) | WO2006036629A1 (ja) |
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US6960517B2 (en) * | 2003-06-30 | 2005-11-01 | Intel Corporation | N-gate transistor |
US7154118B2 (en) | 2004-03-31 | 2006-12-26 | Intel Corporation | Bulk non-planar transistor having strained enhanced mobility and methods of fabrication |
US7042009B2 (en) | 2004-06-30 | 2006-05-09 | Intel Corporation | High mobility tri-gate devices and methods of fabrication |
US7348284B2 (en) | 2004-08-10 | 2008-03-25 | Intel Corporation | Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow |
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KR100909886B1 (ko) | 2009-07-30 |
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DE112005002280T5 (de) | 2007-08-23 |
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GB2430805A (en) | 2007-04-04 |
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