JP4936391B2 - セラミックシート - Google Patents
セラミックシート Download PDFInfo
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- JP4936391B2 JP4936391B2 JP2007289817A JP2007289817A JP4936391B2 JP 4936391 B2 JP4936391 B2 JP 4936391B2 JP 2007289817 A JP2007289817 A JP 2007289817A JP 2007289817 A JP2007289817 A JP 2007289817A JP 4936391 B2 JP4936391 B2 JP 4936391B2
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- ceramic
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- 239000000919 ceramic Substances 0.000 title claims description 306
- 239000010410 layer Substances 0.000 claims description 185
- 229910000859 α-Fe Inorganic materials 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- 230000001788 irregular Effects 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 11
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical group N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910017518 Cu Zn Inorganic materials 0.000 claims description 5
- 229910017752 Cu-Zn Inorganic materials 0.000 claims description 5
- 229910017943 Cu—Zn Inorganic materials 0.000 claims description 5
- 229910018605 Ni—Zn Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 229910002113 barium titanate Inorganic materials 0.000 claims description 5
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000012634 fragment Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012762 magnetic filler Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/346—Titania or titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/361—Boron nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/363—Carbon
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/365—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/368—Silicon nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
本発明のセラミックシートは、積層された複数の層を有する構造で、前記複数の層のうち、少なくとも1層は、セラミック材料によって形成されたセラミック層とされ、他の層は、樹脂シート層、又は粘着性材料によって形成された粘着層とされているセラミックシートであって、
前記セラミック層は、薄板状に形成されたセラミック板を曲げて不規則な割れ目を形成することにより、当該割れ目で前記セラミック板を複数のセラミック小片に分割してなる構造とされていることを特徴とする。
セラミック板を割ってから他の層を積層する場合、積層作業に伴ってセラミック小片間の隙間が拡大すると性能低下を招くおそれがある。そのような性能低下を招かないように留意して他の層を積層すると、慎重な作業を強いられる分、生産性の低下を招く恐れがある。しかし、上記構成を採用すれば、過剰に慎重な作業をしなくてもセラミック小片間に隙間ができるのを抑制できるので、生産性を低下させることなくセラミック層の特性を向上させることができる。
セラミック板が他の層とともにロールに通されると、セラミック板には徐々に割れ目が入って、セラミック板がいくつかの断片に分割されてゆく。このとき、比較的小さい断片はそれ以上割れることなくロールを通過するが、過剰に大きい断片はさらに割れて、より小さな断片になる。
[第1実施形態]
図1(a)は、本発明の一実施形態として例示するセラミックシートの斜視図、同図(b)は、同セラミックシートの構造を示す分解図である。
すなわち、まず、本実施形態の場合、薄板状セラミック5bとしては、厚さ0.2mmの薄板状フェライト焼結体を利用し(図3(a)参照)、この薄板状セラミック5bの底面に樹脂シート層3を貼り付けた(図3(b)参照)。
[第2実施形態]
以下、上記第1実施形態とは、別の実施形態について説明する。
[第3実施形態]
図5(a)に示すセラミックシート31は、樹脂シート層3、セラミック層5、および粘着層25が積層された構造を備える点で、先に説明したセラミックシート21(図4参照)と基本的な構造が共通するものであるが、これらに加えて、さらに帯状体37と粘着部38とを備えている点に特徴がある。
[第4実施形態]
図6(a)に示すセラミックシート41は、粘着層45、セラミック層5、粘着層48、帯状体37が積層された積層体構造になっている。このセラミックシート41は、帯状体37を備える点で、先に説明したセラミックシート31(図5(a)参照)に類似する構造となっている。ただし、セラミックシート31が、樹脂シート層3、セラミック層5、および粘着層25の積層体を1組備えていたのに対し、セラミックシート41は、粘着層45、セラミック層5の積層体を2組備えている。
[第5実施形態]
図7(a)および同図(b)に示すセラミックシート51は、RFIDアンテナ基板55に対して貼り付けられたもので、樹脂シート層3、セラミック層5、および粘着層25が積層された構造になっている点で、先に説明したセラミックシート21(図4参照)と同等な構造になっている。
[第6実施形態]
図8(a)に示すアンテナ61は、磁心62の外周に銅線65がコイル状に巻かれた構造になっている。磁心62は、短冊形状に切断した5枚のセラミックシート1が積層された構造となっている。
[第7実施形態]
図8(b)に示すアンテナ71は、上記のアンテナ61と同様に磁心72の外周に銅線65がコイル状に巻かれた構造になっている。磁心72は、1枚のセラミックシート1を筒状に丸め、セラミックシート1の端面同士が接合された筒状の構造となっている。
[その他の実施形態]
以上、本発明の実施形態について説明したが、本発明は上記の具体的な一実施形態に限定されず、この他にも種々の形態で実施することができる。
Claims (8)
- 積層された複数の層を有する構造で、前記複数の層のうち、少なくとも1層は、セラミック材料によって形成されたセラミック層とされ、他の層は、樹脂シート層、又は粘着性材料によって形成された粘着層とされているセラミックシートであって、
前記セラミック層は、薄板状に形成されたセラミック板を曲げて不規則な割れ目を形成することにより、当該割れ目で前記セラミック板を複数のセラミック小片に分割してなる構造とされている
ことを特徴とするセラミックシート。 - 前記セラミック層は、前記セラミック板を前記他の層に挟み込むか前記他の層に貼り付けてから、曲げて前記不規則な割れ目を形成したものである
ことを特徴とする請求項1に記載のセラミックシート。 - 前記セラミック層は、前記セラミック板が前記他の層とともにロールに通されて、前記ロールに沿う形状に曲げられることによって割られたものである
ことを特徴とする請求項1または請求項2に記載のセラミックシート。 - 前記セラミック層は、前記セラミック板が前記他の層とともに複数回にわたって前記ロールに通されて割られたものであり、前記複数回それぞれで前記ロールに通す方向が変えられている
ことを特徴とする請求項3に記載のセラミックシート - 前記セラミック材料は、Ni−Zn系フェライト、Mn−Zn系フェライト、Mg−Zn系フェライト、Ba系フェライト、フェロックスプレーナ系フェライト、Cu−Zn系フェライト、アルミナ、炭化ケイ素、チタン酸バリウム、窒化アルミ、窒化ホウ素、窒化ケイ素、マグネシア、または黒鉛である
ことを特徴とする請求項1〜請求項4のいずれかに記載のセラミックシート。 - 前記他の層は、少なくとも1層が前記粘着層とされている
ことを特徴とする請求項1〜請求項5のいずれかに記載のセラミックシート - 前記他の層は、少なくとも1層が導電性材料によって形成された導電層とされている
ことを特徴とする請求項1〜請求項6のいずれかに記載のセラミックシート。 - 前記他の層は、少なくとも1層が熱伝導性材料によって形成された熱伝導層とされている
ことを特徴とする請求項1〜請求項7のいずれかに記載のセラミックシート。
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JP2007289817A JP4936391B2 (ja) | 2007-11-07 | 2007-11-07 | セラミックシート |
US12/266,166 US20090117328A1 (en) | 2007-11-07 | 2008-11-06 | Ceramic sheet and producing method thereof |
EP08019481A EP2058119A3 (en) | 2007-11-07 | 2008-11-07 | Ceramic sheet and producing method thereof |
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JP2007289817A JP4936391B2 (ja) | 2007-11-07 | 2007-11-07 | セラミックシート |
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US (1) | US20090117328A1 (ja) |
EP (1) | EP2058119A3 (ja) |
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JP5685827B2 (ja) * | 2010-03-29 | 2015-03-18 | ソニー株式会社 | 磁性シート、アンテナモジュール及び電子機器 |
KR101178209B1 (ko) | 2010-07-16 | 2012-08-29 | 주식회사 이엠따블유 | 페라이트 시트 복합체 및 그 제조방법 |
JP5555725B2 (ja) | 2012-01-13 | 2014-07-23 | 本田技研工業株式会社 | 電気負荷制御装置 |
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KR101505017B1 (ko) * | 2012-10-11 | 2015-03-24 | 주식회사 아모텍 | 안테나용 전자파 차폐 시트 및 그 제조방법과, 이를 포함하는 안테나 및 안테나를 구비하는 휴대 단말용 배터리 팩 |
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US20090117328A1 (en) | 2009-05-07 |
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EP2058119A2 (en) | 2009-05-13 |
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