JP4884725B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP4884725B2
JP4884725B2 JP2005249046A JP2005249046A JP4884725B2 JP 4884725 B2 JP4884725 B2 JP 4884725B2 JP 2005249046 A JP2005249046 A JP 2005249046A JP 2005249046 A JP2005249046 A JP 2005249046A JP 4884725 B2 JP4884725 B2 JP 4884725B2
Authority
JP
Japan
Prior art keywords
polishing pad
polishing
molecular weight
polyurethane resin
resin foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005249046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007061928A (ja
Inventor
一幸 小川
良之 中井
哲生 下村
雅彦 中森
孝敏 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tire Corp
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Priority to JP2005249046A priority Critical patent/JP4884725B2/ja
Priority to TW095127529A priority patent/TW200709896A/zh
Priority to PCT/JP2006/316372 priority patent/WO2007026569A1/ja
Priority to US12/065,219 priority patent/US8309466B2/en
Priority to KR1020087004863A priority patent/KR100949561B1/ko
Priority to CN2006800321010A priority patent/CN101253022B/zh
Publication of JP2007061928A publication Critical patent/JP2007061928A/ja
Application granted granted Critical
Publication of JP4884725B2 publication Critical patent/JP4884725B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2101/00—Manufacture of cellular products
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2005249046A 2005-08-30 2005-08-30 研磨パッド Expired - Fee Related JP4884725B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005249046A JP4884725B2 (ja) 2005-08-30 2005-08-30 研磨パッド
TW095127529A TW200709896A (en) 2005-08-30 2006-07-27 Polishing pad
PCT/JP2006/316372 WO2007026569A1 (ja) 2005-08-30 2006-08-22 研磨パッド
US12/065,219 US8309466B2 (en) 2005-08-30 2006-08-22 Polishing pad
KR1020087004863A KR100949561B1 (ko) 2005-08-30 2006-08-22 연마 패드
CN2006800321010A CN101253022B (zh) 2005-08-30 2006-08-22 研磨垫

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005249046A JP4884725B2 (ja) 2005-08-30 2005-08-30 研磨パッド

Publications (2)

Publication Number Publication Date
JP2007061928A JP2007061928A (ja) 2007-03-15
JP4884725B2 true JP4884725B2 (ja) 2012-02-29

Family

ID=37808668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005249046A Expired - Fee Related JP4884725B2 (ja) 2005-08-30 2005-08-30 研磨パッド

Country Status (6)

Country Link
US (1) US8309466B2 (enExample)
JP (1) JP4884725B2 (enExample)
KR (1) KR100949561B1 (enExample)
CN (1) CN101253022B (enExample)
TW (1) TW200709896A (enExample)
WO (1) WO2007026569A1 (enExample)

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JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
WO2008026451A1 (fr) 2006-08-28 2008-03-06 Toyo Tire & Rubber Co., Ltd. Tampon de polissage
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5590779B2 (ja) * 2008-06-20 2014-09-17 ダンロップスポーツ株式会社 ゴルフボール
JP5393434B2 (ja) * 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP5634903B2 (ja) 2010-02-25 2014-12-03 東洋ゴム工業株式会社 研磨パッド
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JP2014111296A (ja) * 2012-11-05 2014-06-19 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
JP6155019B2 (ja) * 2012-12-10 2017-06-28 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド
JP5661129B2 (ja) 2013-01-29 2015-01-28 東洋ゴム工業株式会社 研磨パッド
CN103862364A (zh) * 2014-03-24 2014-06-18 上海华力微电子有限公司 研磨垫、研磨机台及研磨方法
US11717932B2 (en) * 2018-12-14 2023-08-08 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Polyurethane polishing pad and composition for manufacturing the same
KR102202076B1 (ko) * 2018-12-26 2021-01-12 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
CN113896856B (zh) * 2020-06-19 2023-05-12 中国科学院微电子研究所 一种抛光垫材料及抛光垫
CN116766049A (zh) * 2023-07-31 2023-09-19 长鑫科技集团股份有限公司 一种研磨垫的制作方法

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JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド

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US20090104850A1 (en) 2009-04-23
US8309466B2 (en) 2012-11-13
WO2007026569A1 (ja) 2007-03-08
KR20080031486A (ko) 2008-04-08
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JP2007061928A (ja) 2007-03-15
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