JP4867548B2 - 塗布装置、実装装置及び電子部品の製造方法 - Google Patents

塗布装置、実装装置及び電子部品の製造方法 Download PDF

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Publication number
JP4867548B2
JP4867548B2 JP2006257124A JP2006257124A JP4867548B2 JP 4867548 B2 JP4867548 B2 JP 4867548B2 JP 2006257124 A JP2006257124 A JP 2006257124A JP 2006257124 A JP2006257124 A JP 2006257124A JP 4867548 B2 JP4867548 B2 JP 4867548B2
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plate
flux
electronic component
pressing member
film forming
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JP2006257124A
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Japanese (ja)
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JP2008073633A (ja
JP2008073633A5 (enExample
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勝彦 大野
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Sony Corp
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Sony Corp
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Priority to JP2006257124A priority Critical patent/JP4867548B2/ja
Priority to CN200710161811.XA priority patent/CN101164705B/zh
Publication of JP2008073633A publication Critical patent/JP2008073633A/ja
Publication of JP2008073633A5 publication Critical patent/JP2008073633A5/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
JP2006257124A 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法 Active JP4867548B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006257124A JP4867548B2 (ja) 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法
CN200710161811.XA CN101164705B (zh) 2006-09-22 2007-09-24 涂敷装置、安装装置、涂敷方法、电子零件的制造方法及电子零件

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JP2006257124A JP4867548B2 (ja) 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法

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JP2008073633A JP2008073633A (ja) 2008-04-03
JP2008073633A5 JP2008073633A5 (enExample) 2009-11-05
JP4867548B2 true JP4867548B2 (ja) 2012-02-01

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JP (1) JP4867548B2 (enExample)
CN (1) CN101164705B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082358B2 (ja) * 2006-09-22 2012-11-28 ソニー株式会社 塗布装置、実装装置及び電子部品の製造方法
KR101352573B1 (ko) * 2008-08-18 2014-01-17 삼성테크윈 주식회사 플럭스 디핑장치
KR101352574B1 (ko) * 2008-08-18 2014-01-17 삼성테크윈 주식회사 감지부재를 갖는 플럭스 디핑장치
CN102698938B (zh) * 2012-06-07 2015-03-11 珠海格力电器股份有限公司 稳压块涂覆散热膏用盛放设备
CN102784745B (zh) * 2012-08-06 2015-08-19 昆山微容电子企业有限公司 自动涂装机的溢粉回收系统
JP5785576B2 (ja) * 2013-03-11 2015-09-30 株式会社東芝 ペースト供給ユニット
JP5360323B1 (ja) * 2013-04-26 2013-12-04 富士ゼロックス株式会社 粘性剤厚調整装置、搭載装置、基板装置の製造方法
JP6171613B2 (ja) * 2013-06-21 2017-08-02 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP6322807B2 (ja) * 2013-12-12 2018-05-16 パナソニックＩｐマネジメント株式会社 ペースト転写装置及び電子部品実装機
JP6375628B2 (ja) * 2014-01-27 2018-08-22 三菱電機株式会社 樹脂供給装置
CN205877793U (zh) * 2014-09-28 2017-01-11 嘉兴山蒲照明电器有限公司 Led直管灯
EP3413337B1 (en) * 2016-02-03 2020-02-26 FUJIFILM Corporation Method of manufacturing organic semiconductor film
JP6683820B2 (ja) * 2016-09-27 2020-04-22 富士フイルム株式会社 膜の製造方法
JP7343982B2 (ja) * 2019-01-29 2023-09-13 株式会社Fuji 成膜装置
KR102225058B1 (ko) * 2020-11-27 2021-03-09 주식회사 에스에프이 솔더볼 플럭스 도포 장치
KR102302956B1 (ko) 2021-06-01 2021-09-16 주식회사 에스에프이 플럭스 도포 장치
JP7607131B2 (ja) 2021-07-15 2024-12-26 株式会社Fuji 粘性流体供給装置
CN115213057B (zh) * 2022-07-25 2023-12-22 加百裕(南通)电子有限公司 一种电子元器件高效涂胶装置
CN116967559B (zh) * 2023-09-21 2023-12-08 微网优联科技(成都)有限公司 一种在摄像头用pcb板上快速精密焊接接线头的装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031376A (ja) * 1983-07-29 1985-02-18 Sony Corp 映像信号再生装置
SE447545B (sv) * 1985-06-12 1986-11-24 Inventing Ab Sett och anordning vid bladbestrykning av en lopande materialbana
JPS63164222A (ja) * 1986-12-25 1988-07-07 Hitachi Electronics Eng Co Ltd Ｃｖｄ装置用ガスヘツド
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
JPH0819752A (ja) * 1994-07-08 1996-01-23 Matsushita Electric Ind Co Ltd 薄膜形成装置
JPH10209208A (ja) * 1997-01-23 1998-08-07 Hitachi Ltd 半導体製造方法および装置
JP2001345543A (ja) * 2000-05-31 2001-12-14 Sanyo Electric Co Ltd フラックス転写装置
JP4263347B2 (ja) * 2000-11-02 2009-05-13 パナソニック株式会社 電子部品実装装置におけるペースト供給装置

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Publication number Publication date
CN101164705B (zh) 2014-07-30
JP2008073633A (ja) 2008-04-03
CN101164705A (zh) 2008-04-23

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