JP4847005B2 - 光ピックアップ - Google Patents
光ピックアップ Download PDFInfo
- Publication number
- JP4847005B2 JP4847005B2 JP2004345122A JP2004345122A JP4847005B2 JP 4847005 B2 JP4847005 B2 JP 4847005B2 JP 2004345122 A JP2004345122 A JP 2004345122A JP 2004345122 A JP2004345122 A JP 2004345122A JP 4847005 B2 JP4847005 B2 JP 4847005B2
- Authority
- JP
- Japan
- Prior art keywords
- laser driver
- circuit board
- flexible printed
- pattern
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/08—Disposition or mounting of heads or light sources relatively to record carriers
- G11B7/09—Disposition or mounting of heads or light sources relatively to record carriers with provision for moving the light beam or focus plane for the purpose of maintaining alignment of the light beam relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
- G11B7/0925—Electromechanical actuators for lens positioning
- G11B7/0935—Details of the moving parts
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Head (AREA)
- Structure Of Printed Boards (AREA)
Description
レーザドライバIC72は、フレキシブルプリント基板75の、図1での紙面表側に、はんだ79を用いて実装される。レーザドライバIC72には、内部のチップの発熱を拡散させるためにヒートスプレッダ72aが取付けられている。本実施例では、ヒートスプレッダ72aとフレキシブルプリント基板75のグラウンド配線パターン75aとを、はんだ79を用いて電気的、熱的に接続している。これにより、レーザドライバIC72とフレキシブルプリント基板75のグラウンド配線パターン75aとの間の熱抵抗を低減できることに加えて、レーザドライバIC72のグラウンド強化が図れ、電気特性を良好に保つことができる。
レーザドライバIC72は、フレキシブルプリント基板75の、図4での紙面裏側に、はんだ79を用いて実装される。レーザドライバIC72には、内部のチップの発熱を拡散させるためにヒートスプレッダ72aが取付けられている。本実施例では、ヒートスプレッダ72aとフレキシブルプリント基板75のグラウンド配線パターン75aとを、はんだ79を用いて電気的、熱的に接続している。これにより、レーザドライバIC72とフレキシブルプリント基板75のグラウンド配線パターン75aとの間の熱抵抗を低減できることに加えて、レーザドライバIC72のグラウンド強化が図れ、電気特性を良好に保つことができる。
このように、本実施例では部品点数を増やすことなく、また、金属パターン75bのずれがないので、作業効率を落とすことがない。
2 トップケース
3 フロントパネル
4 ディスクトレイ
5 スピンドルモータ
6 ユニットメカ
7 光ピックアップ
8 アンダーカバー
9 回路基板
10 ボトムケース
70 ピックアップ筺体
71 半導体レーザ
72 レーザドライバIC
72a ヒートスプレッダ
73 光検出器
74 対物レンズ駆動装置
75 フレキシブルプリント基板
75a グラウンド配線パターン
75b グラウンド配線パターンを延長した金属パターン
75c コネクタ端子部とレーザドライバIC72実装部との間に設けた金属パターン
75d コネクタ端子部
75e 配線パターン
75f スルーホール
75g 銅箔パターン
76a 第一の上カバー
76b 第二の上カバー
76c 下カバー
76d ピックアップカバー
77 金属部材
78 シリコーン樹脂
79 はんだ
Claims (1)
- ディスクの情報の再生あるいは記録をするためのレーザ光を射出する半導体レーザと、前記半導体レーザを駆動するレーザドライバICと、前記半導体レーザとレーザドライバICを外部の回路基板と電気的に接続する配線パターンを有するフレキシブルプリント基板と、をピックアップ筐体に搭載した光ピックアップにおいて、
前記フレキシブルプリント基板上の、コネクタ端子部とレーザドライバIC実装部の間に前記レーザドライバICの外形よりも広い面積を有した、前記配線パターンと同一の材質からなる金属パターンを設け、前記フレキシブルプリント基板の前記レーザドライバICを実装した面とは反対の面と、前記金属パターンが、向かい合って重なるように前記フレキシブルプリント基板のレーザドライバIC実装部分を折り曲げたことを特徴とする光ピックアップ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345122A JP4847005B2 (ja) | 2004-11-30 | 2004-11-30 | 光ピックアップ |
US11/191,939 US8589964B2 (en) | 2004-11-30 | 2005-07-29 | Cooling arrangement for an optical pick-up |
CNB200510087690XA CN100354955C (zh) | 2004-11-30 | 2005-07-29 | 光拾取器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004345122A JP4847005B2 (ja) | 2004-11-30 | 2004-11-30 | 光ピックアップ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006155757A JP2006155757A (ja) | 2006-06-15 |
JP4847005B2 true JP4847005B2 (ja) | 2011-12-28 |
Family
ID=36568617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004345122A Expired - Fee Related JP4847005B2 (ja) | 2004-11-30 | 2004-11-30 | 光ピックアップ |
Country Status (3)
Country | Link |
---|---|
US (1) | US8589964B2 (ja) |
JP (1) | JP4847005B2 (ja) |
CN (1) | CN100354955C (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4384606B2 (ja) * | 2005-01-18 | 2009-12-16 | 株式会社日立メディアエレクトロニクス | 光ディスクドライブ装置 |
JP3981839B2 (ja) * | 2005-01-25 | 2007-09-26 | 船井電機株式会社 | 光ピックアップ |
EP2004892B9 (en) * | 2005-10-17 | 2014-06-18 | Welspun India Limited | Hygro materials for use in making yarns and fabrics |
JP2010009707A (ja) * | 2008-06-30 | 2010-01-14 | Hitachi Media Electoronics Co Ltd | フレキシブル基板の接続構造及び光ピックアップ装置 |
JP2012038894A (ja) * | 2010-08-06 | 2012-02-23 | Sumitomo Electric Ind Ltd | 発熱源実装用基板モジュール、照明装置 |
US9489971B1 (en) * | 2015-01-29 | 2016-11-08 | Seagate Technology Llc | Flexible circuit for concurrently active recording heads |
CN116349415A (zh) * | 2020-10-01 | 2023-06-27 | 昕诺飞控股有限公司 | 具有电气部件的多层组件 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0731436Y2 (ja) * | 1987-12-01 | 1995-07-19 | ティアツク株式会社 | 光学式ピックアップ装置 |
IT1266944B1 (it) * | 1994-09-29 | 1997-01-21 | Cselt Centro Studi Lab Telecom | Modulo trasmettitore per interconnessioni ottiche. |
US5917795A (en) * | 1995-04-28 | 1999-06-29 | Mitsumi Electric Co., Ltd. | Disk device having a drive unit and a cam plate which moves up and down relative to a disk holder for providing a thin structure |
US5620928A (en) * | 1995-05-11 | 1997-04-15 | National Semiconductor Corporation | Ultra thin ball grid array using a flex tape or printed wiring board substrate and method |
DE69626598T2 (de) * | 1995-11-02 | 2004-03-25 | Fujitsu Ltd., Kawasaki | Trägerstruktur für Plattenspeicher |
JPH1069674A (ja) * | 1996-08-27 | 1998-03-10 | Sony Corp | 光学ピックアップ装置 |
JP3201968B2 (ja) * | 1997-02-28 | 2001-08-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Fpcケーブルおよびキャリッジユニットならびにディスク装置 |
FI103747B (fi) * | 1998-01-29 | 1999-08-31 | Emf Acoustics Oy Ltd | Värähtelymuunninyksikkö |
JP3623650B2 (ja) * | 1998-03-20 | 2005-02-23 | 富士通株式会社 | 記憶装置 |
WO2001033562A1 (fr) | 1999-10-29 | 2001-05-10 | Matsushita Electric Industrial Co., Ltd. | Tete optique et dispositif d'alimentation electrique d'une tete optique |
US6534860B2 (en) * | 1999-12-06 | 2003-03-18 | Intel Corporation | Thermal transfer plate |
JP2001326484A (ja) * | 2000-05-12 | 2001-11-22 | Sigma Corp | 放熱パターンを有するプリント基板 |
JP2002009229A (ja) * | 2000-06-20 | 2002-01-11 | Seiko Epson Corp | 半導体装置 |
TW497371B (en) * | 2000-10-05 | 2002-08-01 | Sanyo Electric Co | Semiconductor device and semiconductor module |
JP3989179B2 (ja) * | 2001-02-22 | 2007-10-10 | 三洋電機株式会社 | 光学ヘッドにおけるレーザードライバー放熱装置 |
JP2002304758A (ja) * | 2001-04-10 | 2002-10-18 | Matsushita Electric Ind Co Ltd | 光ヘッド装置 |
US6931650B2 (en) * | 2001-12-27 | 2005-08-16 | Matsushita Electric Industrial Co., Ltd. | Pickup device and disk drive |
US6996035B2 (en) * | 2002-04-26 | 2006-02-07 | Sanyo Electric Co., Ltd. | Optical pickup device |
JP2004128418A (ja) * | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2004145921A (ja) * | 2002-10-22 | 2004-05-20 | Hitachi Ltd | 光ピックアップおよびこれを用いたディスク装置 |
JP2004178749A (ja) * | 2002-11-28 | 2004-06-24 | Hitachi Ltd | 光ヘッド |
JP2004273968A (ja) * | 2003-03-12 | 2004-09-30 | Fujitsu Ltd | 記録ディスク駆動装置およびフレキシブルプリント基板ユニット |
JP2004310965A (ja) * | 2003-04-10 | 2004-11-04 | Sony Corp | ディスクドライブ装置 |
JP4831959B2 (ja) * | 2004-04-09 | 2011-12-07 | 三洋電機株式会社 | ピックアップならびにノート型パーソナルコンピュータ用ピックアップ |
TWI307154B (en) * | 2005-09-30 | 2009-03-01 | Advanced Semiconductor Eng | Package method and structure for preventing chips from being interfered |
-
2004
- 2004-11-30 JP JP2004345122A patent/JP4847005B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-29 CN CNB200510087690XA patent/CN100354955C/zh not_active Expired - Fee Related
- 2005-07-29 US US11/191,939 patent/US8589964B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100354955C (zh) | 2007-12-12 |
JP2006155757A (ja) | 2006-06-15 |
US8589964B2 (en) | 2013-11-19 |
US20060117332A1 (en) | 2006-06-01 |
CN1783257A (zh) | 2006-06-07 |
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