JP2010009707A - フレキシブル基板の接続構造及び光ピックアップ装置 - Google Patents
フレキシブル基板の接続構造及び光ピックアップ装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 155
- 230000003287 optical effect Effects 0.000 title claims abstract description 80
- 238000007747 plating Methods 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004020 conductor Substances 0.000 abstract description 31
- 239000010408 film Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000013039 cover film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B17/00—Guiding record carriers not specifically of filamentary or web form, or of supports therefor
- G11B17/02—Details
- G11B17/04—Feeding or guiding single record carrier to or from transducer unit
- G11B17/05—Feeding or guiding single record carrier to or from transducer unit specially adapted for discs not contained within cartridges
- G11B17/053—Indirect insertion, i.e. with external loading means
- G11B17/056—Indirect insertion, i.e. with external loading means with sliding loading means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/08—Disposition or mounting of heads or light sources relatively to record carriers
- G11B7/085—Disposition or mounting of heads or light sources relatively to record carriers with provision for moving the light beam into, or out of, its operative position or across tracks, otherwise than during the transducing operation, e.g. for adjustment or preliminary positioning or track change or selection
- G11B7/0857—Arrangements for mechanically moving the whole head
- G11B7/08582—Sled-type positioners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Head (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】 本発明は、光ピックアップ装置本体に固定されている第1のフレキシブル基板とドライブ側のコネクタに挿し込まれる第2のフレキシブル基板の接続において、第1のフレキシブル基板の他端と第2のフレキシブル基板の他端は合わせて重なるように接続され、第1のフレキシブル基板と第2のフレキシブル基板の接続部最外導体パターンには、他端から最も離れた位置に一辺に向けて突き出した突起が形成する。
【選択図】 図3
Description
光ピックアップの厚さの制限から、二つのフレキシブル基板の接続には特許文献3のようなコネクタを用いることはできず、はんだで接続する。図9(a)に示されるようにフレキシブル基板の分割・接続を導入する場合、第1のフレキシブル基板の導体パターンと第2のフレキシブル基板の導体パターンを相対し、重ね合わせると、第2のフレキシブル基板は裏面となり、コネクタ側接点8は逆転してしまう。そこで、図9(b)に示されるように、第1のフレキシブル基板の他端と第2のフレキシブル基板の他端を合わせて重なるように接続し、フレキシブル基板の接続端部を光ピックアップ装置の高さ方向(垂直方向)に90°ないしは、第1のフレキシブル基板の接続端部を固定し、第2のフレキシブル基板の接続端部を180°折り曲げればコネクタ側接点8は上向きとなる。
Claims (12)
- 樹脂製のベースと、
前記ベース上に並べて形成された複数の配線と、
前記配線の前記ベースとは反対側を覆う樹脂製のカバーと、
をそれぞれ有する第一及び第二のフレキシブル基板と、
前記第一のフレキシブル基板の複数の配線と第二のフレキシブル基板の複数の配線とが、前記カバーに覆われていない部分でそれぞれ接続されている接続部とを備えたフレキシブル基板の接続構造において、
前記配線は、前記接続部に、前記カバーにより覆われている部分の当該配線よりも幅が広い幅広部を有し、
前記第一のフレキシブル基板の配線の幅広部と前記第二のフレキシブル基板の配線の幅広部とがはんだにより接続されている幅広接続部を有することを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記並べて形成された配線のうち最外部の配線が、他の配線の位置する側とは反対の側に突出する突出部を有することで、前記幅広部を形成していることを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記第一のフレキシブル基板及び前記第二のフレキシブル基板は、前記接続部に対して前記配線の長さ方向について同じ方向に、他の機器に接続される機器接続部を有することを特徴とするフレキシブル基板の接続構造。 - 請求項3において、
前記第二のフレキシブル基板の機器接続部は、前記第二のフレキシブル基板の厚さ方向について、前記カバー側に設けられたことを特徴とするフレキシブル基板の接続構造。 - 請求項1乃至3のいずれかにおいて、
前記幅広部接続部は、前記接続部の最も前記機器接続部側に設けられていることを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記第一のフレキシブル基板の幅広部にははんだめっきが形成されており、
前記第一のフレキシブル基板の幅広部の幅Aと、前記第二のフレキシブル基板の幅Bとは、A>Bであることを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記第一のフレキシブル基板の幅広部の幅Aと、前記第二のフレキシブル基板の幅Bは、100μm以上であることを特徴とするフレキシブル基板の接続構造。 - 請求項5において、
前記第一のフレキシブル基板の幅広部の長さCと、前記第二のフレキシブル基板の長さDとは、C>Dであることを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記第一のフレキシブル基板の幅広部の長さCと、前記第二のフレキシブル基板の幅広部の長さDは、100μm以上であることを特徴とするフレキシブル基板の接続構造。 - 請求項1において、
前記配線は、前記接続部のほかに、前記配線が前記カバーに覆われておらず、前記カバーにより覆われている部分の前記配線よりも幅が広い幅広部を有するリペア接続部を備えたことを特徴とするフレキシブル基板の接続構造。 - 請求項1に記載のフレキシブル基板の接続構造と、
光ピックアップケースと、
レンズと、ミラーと、発光素子と、受光素子とを備えた光ピックアップ装置において、
前記第一のフレキシブル基板は、光ピックアップケース上に配置されていることを特徴とする光ピックアップ装置。 - 請求項4に記載のフレキシブル基板の接続構造と、
光ピックアップケースと、
前記ピックアップケースの上に設けられた光ピックアップカバーと
レンズと、ミラーと、発光素子と、受光素子とを備えた光ピックアップ装置において、
前記第一のフレキシブル基板は、そのカバーを前記光ピックアップカバー側に向け、当該光ピックアップケースと前記光ピックアップカバーとの間に設けられ、
前記第二のフレキシブル基板は、そのカバーを前記ピックアップカバー側に向けて配置されていることを特徴とする光ピックアップ装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008169802A JP2010009707A (ja) | 2008-06-30 | 2008-06-30 | フレキシブル基板の接続構造及び光ピックアップ装置 |
US12/420,966 US8420944B2 (en) | 2008-06-30 | 2009-04-09 | Connection structure of flexible printed circuits and optical pickup device including the connection structure |
CN200910133141XA CN101621891B (zh) | 2008-06-30 | 2009-04-09 | 挠性基板的连接构造及光拾波器装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008169802A JP2010009707A (ja) | 2008-06-30 | 2008-06-30 | フレキシブル基板の接続構造及び光ピックアップ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010009707A true JP2010009707A (ja) | 2010-01-14 |
Family
ID=41447260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008169802A Pending JP2010009707A (ja) | 2008-06-30 | 2008-06-30 | フレキシブル基板の接続構造及び光ピックアップ装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8420944B2 (ja) |
JP (1) | JP2010009707A (ja) |
CN (1) | CN101621891B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016167485A (ja) * | 2015-03-09 | 2016-09-15 | アルプス電気株式会社 | 配線基板、配線基板の接続構造及び配線基板の接続方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402566B (zh) * | 2008-12-18 | 2013-07-21 | Chunghwa Picture Tubes Ltd | 具有導線圖案之接墊區以及監控膜材貼附偏差之方法 |
JP2011138853A (ja) * | 2009-12-28 | 2011-07-14 | Hitachi Media Electoronics Co Ltd | フレキシブル基板の接続構造及び光ピックアップ装置 |
Citations (4)
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JPS6236569U (ja) * | 1985-08-22 | 1987-03-04 | ||
JP2005183647A (ja) * | 2003-12-19 | 2005-07-07 | Fujikura Ltd | プリント配線板およびその接続方法、並びにリペア方法 |
JP2006202367A (ja) * | 2005-01-18 | 2006-08-03 | Hitachi Media Electoronics Co Ltd | 光ディスクドライブ装置 |
JP2007157295A (ja) * | 2005-12-08 | 2007-06-21 | Hitachi Media Electoronics Co Ltd | 光ディスクドライブ装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6236569A (ja) | 1985-08-09 | 1987-02-17 | Mitsubishi Electric Corp | 電気配線路のインダクタンス値測定方法 |
US5418691A (en) * | 1990-02-07 | 1995-05-23 | Canon Kabushiki Kaisha | Two printed circuit boards superiposed on one another both having position registry marks |
JP4413026B2 (ja) * | 2004-01-30 | 2010-02-10 | 三洋電機株式会社 | 光ディスク装置 |
JP2005276263A (ja) | 2004-03-23 | 2005-10-06 | Mitsumi Electric Co Ltd | 光ピックアップ |
TWI238363B (en) * | 2004-06-28 | 2005-08-21 | Benq Corp | Flexible flat circuit structure for disc drive |
JP4847005B2 (ja) * | 2004-11-30 | 2011-12-28 | 株式会社日立メディアエレクトロニクス | 光ピックアップ |
JP2006245514A (ja) | 2005-03-07 | 2006-09-14 | Hitachi Media Electoronics Co Ltd | フレキシブル基板同士の接続方法 |
JP2006310449A (ja) | 2005-04-27 | 2006-11-09 | Optrex Corp | フレキシブル基板 |
US20070169136A1 (en) | 2005-12-08 | 2007-07-19 | Hiromichi Hiramatsu | Optical disc drive apparatus, flexible printed circuit board joint structure, and joint structure of flexible printed circuit boards for optical pickup |
JP4934325B2 (ja) * | 2006-02-17 | 2012-05-16 | 株式会社フジクラ | プリント配線板の接続構造及びプリント配線板の接続方法 |
-
2008
- 2008-06-30 JP JP2008169802A patent/JP2010009707A/ja active Pending
-
2009
- 2009-04-09 US US12/420,966 patent/US8420944B2/en not_active Expired - Fee Related
- 2009-04-09 CN CN200910133141XA patent/CN101621891B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236569U (ja) * | 1985-08-22 | 1987-03-04 | ||
JP2005183647A (ja) * | 2003-12-19 | 2005-07-07 | Fujikura Ltd | プリント配線板およびその接続方法、並びにリペア方法 |
JP2006202367A (ja) * | 2005-01-18 | 2006-08-03 | Hitachi Media Electoronics Co Ltd | 光ディスクドライブ装置 |
JP2007157295A (ja) * | 2005-12-08 | 2007-06-21 | Hitachi Media Electoronics Co Ltd | 光ディスクドライブ装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016167485A (ja) * | 2015-03-09 | 2016-09-15 | アルプス電気株式会社 | 配線基板、配線基板の接続構造及び配線基板の接続方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101621891A (zh) | 2010-01-06 |
CN101621891B (zh) | 2011-09-07 |
US8420944B2 (en) | 2013-04-16 |
US20090323503A1 (en) | 2009-12-31 |
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