JP4798848B2 - 特別な性質の組合せを有する硬化性組成物 - Google Patents
特別な性質の組合せを有する硬化性組成物 Download PDFInfo
- Publication number
- JP4798848B2 JP4798848B2 JP2000605676A JP2000605676A JP4798848B2 JP 4798848 B2 JP4798848 B2 JP 4798848B2 JP 2000605676 A JP2000605676 A JP 2000605676A JP 2000605676 A JP2000605676 A JP 2000605676A JP 4798848 B2 JP4798848 B2 JP 4798848B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- composition according
- filler
- fillers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH48599 | 1999-03-16 | ||
| CH485/99 | 1999-03-16 | ||
| PCT/EP2000/001954 WO2000055254A1 (de) | 1999-03-16 | 2000-03-06 | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002539313A JP2002539313A (ja) | 2002-11-19 |
| JP2002539313A5 JP2002539313A5 (https=) | 2011-04-07 |
| JP4798848B2 true JP4798848B2 (ja) | 2011-10-19 |
Family
ID=4188093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000605676A Expired - Fee Related JP4798848B2 (ja) | 1999-03-16 | 2000-03-06 | 特別な性質の組合せを有する硬化性組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6638567B1 (https=) |
| EP (1) | EP1165688B1 (https=) |
| JP (1) | JP4798848B2 (https=) |
| CA (1) | CA2365510A1 (https=) |
| DE (1) | DE50014006D1 (https=) |
| ES (1) | ES2276676T3 (https=) |
| WO (1) | WO2000055254A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101506769B1 (ko) * | 2011-12-27 | 2015-03-27 | 히타치가세이가부시끼가이샤 | 전자 부품용 액상 수지 조성물 및 그의 제조 방법, 및 전자 부품 장치 |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4319332B2 (ja) * | 2000-06-29 | 2009-08-26 | 株式会社東芝 | 電気絶縁材料およびその製造方法 |
| ATE271584T1 (de) * | 2000-11-29 | 2004-08-15 | Vantico Ag | Gefülltes epoxidharzsystem mit hoher mechanischer festigkeit |
| US20020111420A1 (en) * | 2001-02-12 | 2002-08-15 | International Business Machines Corporation | Underfill compositions |
| JP2002338790A (ja) * | 2001-05-22 | 2002-11-27 | Nippon Kayaku Co Ltd | 固着含浸用エポキシ樹脂組成物 |
| US7056978B2 (en) * | 2002-11-06 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Toughened epoxy-anhydride no-flow underfill encapsulant |
| ATE355318T1 (de) * | 2003-06-16 | 2006-03-15 | Abb Technology Ltd | Epoxyharzzusammensetzungen und verfahren zur herstellung von geformten gegenständen daraus |
| US7989704B2 (en) * | 2005-07-20 | 2011-08-02 | Areva T&D Sa | Electric insulator and a method for the production thereof |
| WO2007059516A1 (en) | 2005-11-15 | 2007-05-24 | Valspar Sourcing, Inc. | Crush resistant latex topcoat composition for fiber cement substrates |
| EP1951800B1 (en) * | 2005-11-22 | 2009-04-15 | Huntsman Advanced Materials (Switzerland) GmbH | Weather-resistant epoxy resin system |
| CN101374787B (zh) | 2006-01-31 | 2013-12-11 | 威士伯采购公司 | 涂布水泥纤维板制品的方法 |
| CA2636435C (en) | 2006-01-31 | 2013-10-22 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
| EP1979426A1 (en) | 2006-01-31 | 2008-10-15 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
| US9783622B2 (en) | 2006-01-31 | 2017-10-10 | Axalta Coating Systems Ip Co., Llc | Coating system for cement composite articles |
| EP2361955B1 (en) | 2006-05-19 | 2014-12-17 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
| DE602007012700D1 (de) | 2006-06-02 | 2011-04-07 | Valspar Sourcing Inc | Wässrige hochleistungsbeschichtungszusammensetzungen |
| US7812090B2 (en) | 2006-06-02 | 2010-10-12 | Valspar Sourcing, Inc. | High performance aqueous coating compositions |
| ES2716987T3 (es) | 2006-07-07 | 2019-06-18 | Swimc Llc | Sistemas de recubrimiento para artículos composite de cemento |
| EP2044138A1 (en) * | 2006-07-20 | 2009-04-08 | ABB Research Ltd | Hardenable epoxy resin composition |
| MX2008002220A (es) | 2007-02-16 | 2009-02-25 | Valspar Sourcing Inc | Tratamiento para articulos compuestos de cemento. |
| CN101616949B (zh) * | 2007-02-23 | 2014-01-01 | 松下电器产业株式会社 | 环氧树脂组合物、预浸渍体、层合板和印刷配线板 |
| CA2701333A1 (en) * | 2007-10-08 | 2009-04-16 | Abb Research Ltd | Polymer concrete electrical insulation system |
| CN101925653B (zh) * | 2008-01-28 | 2013-08-07 | 株式会社钟化 | 脂环族环氧树脂组合物、其固化物及其制造方法以及含有橡胶状聚合物的树脂组合物 |
| WO2009100757A1 (en) * | 2008-02-12 | 2009-08-20 | Abb Research Ltd | Surface modified electrical insulation system |
| MX2011001736A (es) | 2008-08-15 | 2011-05-10 | Valspar Sourcing Inc | Composicion de recubrimiento de sustrato cementoso de auto-grabado. |
| CN102159614A (zh) * | 2008-09-19 | 2011-08-17 | Abb研究有限公司 | 环氧树脂组合物 |
| AU2009316285A1 (en) | 2008-11-24 | 2010-05-27 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
| US8999433B2 (en) | 2009-04-02 | 2015-04-07 | Huntsman International Llc | Direct overmolding |
| RU2534653C2 (ru) * | 2009-05-05 | 2014-12-10 | Хантсман Эдванст Матириалз (Свитзеленд) Гмбх | Отверждаемая система |
| WO2012132965A1 (ja) * | 2011-03-31 | 2012-10-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び金属箔張積層板 |
| EP2909251B1 (en) * | 2012-10-19 | 2017-07-26 | Dow Global Technologies LLC | Low odor epoxy resin systems based on nadic anhydride-type harneders |
| US20160280864A1 (en) * | 2013-10-08 | 2016-09-29 | Timothy A. Morley | Low odor epoxy resin systems based on nadic anhydride-type hardeners |
| DE102013226705A1 (de) * | 2013-12-19 | 2015-06-25 | Siemens Aktiengesellschaft | Durchschlag- und überschlagsichere Gießharzzusammensetzung |
| JP6779476B2 (ja) * | 2015-03-19 | 2020-11-04 | ナガセケムテックス株式会社 | 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材 |
| US20180171101A1 (en) | 2015-06-16 | 2018-06-21 | Huntsman International Llc | Epoxy Resin Composition |
| CN104987662A (zh) * | 2015-06-26 | 2015-10-21 | 苏州荣昌复合材料有限公司 | 一种热固性塑料的制备方法 |
| ES2736398T3 (es) * | 2015-07-02 | 2019-12-30 | Huntsman Adv Mat Licensing Switzerland Gmbh | Una composición de resina epoxi termoendurecible para la preparación de artículos de exterior y artículos obtenidos a partir de los mismos |
| EP3593362A1 (en) * | 2017-03-10 | 2020-01-15 | 3M Innovative Properties Company | Electrical insulating material |
| DE102017125177A1 (de) * | 2017-10-26 | 2019-05-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Elektrisches Bauteil mit Isolationsschicht und Verfahren zu dessen Herstellung |
| BR112020018692B1 (pt) * | 2018-03-16 | 2024-04-30 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Composições de resina estável em armazenamento e de resina curável, processo para obter uma composição de resina estável em armazenamento e de resina curável, artigo curado, e, usos de um artigo curado e de uma composição de resina curável |
| CN113242884B (zh) * | 2018-10-29 | 2023-12-08 | 汉高股份有限及两合公司 | 导热封装组合物 |
| US20220135862A1 (en) * | 2019-04-11 | 2022-05-05 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Curable Two-Component Resin-Based System |
| CN116685617A (zh) | 2020-12-22 | 2023-09-01 | 亨斯迈先进材料许可(瑞士)有限公司 | 可固化的两部分树脂体系 |
| KR20250091262A (ko) | 2022-10-18 | 2025-06-20 | 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 | 모서리가 날카로운 인서트의 캡슐화에서 균열을 방지하는 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3202947A (en) | 1961-02-16 | 1965-08-24 | Jefferson Electric Co | Epoxy insulated transformer having tris-beta-chloroethylphosphate and hydrated alumina in the insulation |
| US4009141A (en) | 1972-07-07 | 1977-02-22 | General Electric Company | Electrical insulating compositions of epoxy resins, zirconium silicate and alumina |
| JPS6030346B2 (ja) * | 1978-01-06 | 1985-07-16 | 日立化成工業株式会社 | フライバックトランス注型用エポキシ樹脂組成物 |
| US4315085A (en) | 1980-07-25 | 1982-02-09 | Gaf Corporation | Core-shell composite polymers having high amounts of carboxylic acid units in the shell |
| US4419496A (en) | 1982-02-22 | 1983-12-06 | The Dow Chemical Company | Particle agglomeration in rubber latices |
| DE3239872A1 (de) | 1982-10-27 | 1984-05-03 | Siemens AG, 1000 Berlin und 8000 München | Vergussmasse fuer elektronische bauelemente |
| JPH01197554A (ja) * | 1988-02-02 | 1989-08-09 | Toshiba Corp | 難燃性樹脂組成物およびその製造法 |
| FR2630578B1 (fr) | 1988-04-22 | 1990-07-27 | France Transfo Sa | Transformateur sec enrobe a comportement au feu ameliore et procede de preparation de sa resine d'enrobage |
| JP2642470B2 (ja) * | 1989-02-23 | 1997-08-20 | 株式会社東芝 | 封止用樹脂組成物及び樹脂封止型半導体装置 |
| JPH03115351A (ja) * | 1989-09-28 | 1991-05-16 | Toshiba Corp | 難燃性エポキシ樹脂組成物 |
| DE59310074D1 (de) | 1992-07-09 | 2000-08-17 | Ciba Sc Holding Ag | Härtbare Suspensionen auf Basis von Epoxidharzen |
| JP3186422B2 (ja) * | 1993-05-14 | 2001-07-11 | 武田薬品工業株式会社 | プラスチゾル |
| DE59508782D1 (de) * | 1994-12-13 | 2000-11-16 | Ciba Sc Holding Ag | Core/Shell-Zähigkeitsvermittler enthaltende härtbare Epoxidharz-Giessmassen |
| EP0780436A4 (en) | 1995-07-10 | 2000-04-19 | Toray Industries | EPOXY RESIN COMPOSITION |
| JPH0997729A (ja) * | 1995-09-28 | 1997-04-08 | Hitachi Ltd | フライバックトランスおよびその製造方法 |
| JP3861425B2 (ja) * | 1997-12-22 | 2006-12-20 | 大日本インキ化学工業株式会社 | 加熱圧縮成形材料組成物、シートモールディングコンパウンド及びバルクモールディングコンパウンド |
-
2000
- 2000-03-06 DE DE50014006T patent/DE50014006D1/de not_active Expired - Lifetime
- 2000-03-06 JP JP2000605676A patent/JP4798848B2/ja not_active Expired - Fee Related
- 2000-03-06 EP EP00918765A patent/EP1165688B1/de not_active Expired - Lifetime
- 2000-03-06 CA CA002365510A patent/CA2365510A1/en not_active Abandoned
- 2000-03-06 ES ES00918765T patent/ES2276676T3/es not_active Expired - Lifetime
- 2000-03-06 US US09/936,706 patent/US6638567B1/en not_active Expired - Lifetime
- 2000-03-06 WO PCT/EP2000/001954 patent/WO2000055254A1/de not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101506769B1 (ko) * | 2011-12-27 | 2015-03-27 | 히타치가세이가부시끼가이샤 | 전자 부품용 액상 수지 조성물 및 그의 제조 방법, 및 전자 부품 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1165688B1 (de) | 2007-01-24 |
| DE50014006D1 (de) | 2007-03-15 |
| CA2365510A1 (en) | 2000-09-21 |
| WO2000055254A1 (de) | 2000-09-21 |
| US6638567B1 (en) | 2003-10-28 |
| JP2002539313A (ja) | 2002-11-19 |
| EP1165688A1 (de) | 2002-01-02 |
| ES2276676T3 (es) | 2007-07-01 |
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