DE602006006338D1 - Witterungsbeständiges epoxidharzsystem - Google Patents

Witterungsbeständiges epoxidharzsystem

Info

Publication number
DE602006006338D1
DE602006006338D1 DE200660006338 DE602006006338T DE602006006338D1 DE 602006006338 D1 DE602006006338 D1 DE 602006006338D1 DE 200660006338 DE200660006338 DE 200660006338 DE 602006006338 T DE602006006338 T DE 602006006338T DE 602006006338 D1 DE602006006338 D1 DE 602006006338D1
Authority
DE
Germany
Prior art keywords
alkyl
epoxy resin
weatherproof
absorber
antioxidant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660006338
Other languages
English (en)
Inventor
Christian Beisele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Publication of DE602006006338D1 publication Critical patent/DE602006006338D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
DE200660006338 2005-11-22 2006-10-26 Witterungsbeständiges epoxidharzsystem Active DE602006006338D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05111098 2005-11-22
PCT/EP2006/067828 WO2007060077A1 (en) 2005-11-22 2006-10-26 Weather-resistant epoxy resin system

Publications (1)

Publication Number Publication Date
DE602006006338D1 true DE602006006338D1 (de) 2009-05-28

Family

ID=35453586

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660006338 Active DE602006006338D1 (de) 2005-11-22 2006-10-26 Witterungsbeständiges epoxidharzsystem

Country Status (12)

Country Link
US (1) US8436079B2 (de)
EP (1) EP1951800B1 (de)
JP (1) JP5226526B2 (de)
CN (1) CN101313024B (de)
AT (1) ATE428749T1 (de)
AU (1) AU2006316667B2 (de)
BR (1) BRPI0618438B1 (de)
DE (1) DE602006006338D1 (de)
PL (1) PL1951800T3 (de)
TW (1) TWI412557B (de)
WO (1) WO2007060077A1 (de)
ZA (1) ZA200803382B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540485B2 (ja) * 2007-10-09 2014-07-02 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
WO2011006530A1 (en) * 2009-07-14 2011-01-20 Abb Research Ltd Epoxy resin composition
TWI422638B (zh) * 2009-08-25 2014-01-11 Everlight Chem Ind Corp 含矽樹脂封裝組成物
US9074049B2 (en) * 2009-10-21 2015-07-07 Huntsman International Llc Thermosetting composition
WO2012036291A1 (ja) * 2010-09-16 2012-03-22 積水化学工業株式会社 調光シート、調光体、合わせガラス用中間膜及び合わせガラス
EP2439240A1 (de) * 2010-10-06 2012-04-11 Henkel AG & Co. KGaA Strahlungshärtbare Zusammensetzung
EP2854260A1 (de) * 2013-09-27 2015-04-01 Siemens Aktiengesellschaft Nutverschlussmasse, Nutverschluss und Verfahren zum Herstellen eines Nutverschlusses
EP2874280A1 (de) * 2013-11-14 2015-05-20 Siemens Aktiengesellschaft Nutverschlussmasse, Nutverschluss und Verfahren zum Herstellen eines Nutverschlusses
PL3310838T3 (pl) * 2015-06-16 2022-01-10 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Kompozycja żywicy epoksydowej
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
US10959344B2 (en) 2017-10-06 2021-03-23 Trench Limited Outdoor electrical apparatus having an outer housing arranged to selectively encase a main encapsulant

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1467672A (en) * 1974-04-11 1977-03-16 Ciba Geigy Ag Stabilised epoxy resin
DE3016097A1 (de) * 1980-04-25 1981-10-29 Siemens AG, 1000 Berlin und 8000 München Schnellhaertende epoxidharzmassen
DE3167225D1 (en) * 1980-11-17 1984-12-20 Ciba Geigy Ag Stabilisers against photo degradation
DE3242711A1 (de) * 1982-11-19 1984-05-24 Bayer Ag, 5090 Leverkusen Mischungen spezieller cycloaliphatischer 1,2-diepoxide und ihre verwendung
US5026751A (en) 1986-03-17 1991-06-25 General Electric Company UV light stabilizer composition comprising cyclic aliphatic epoxy UV screener, and polyalkyldipiperidine (HALS) compounds
US5124378A (en) * 1987-09-21 1992-06-23 Ciba-Geigy Corporation Stabilization of ambient cured coatings
JPH0668016B2 (ja) * 1988-04-26 1994-08-31 三洋化成工業株式会社 エポキシ樹脂組成物
KR0169709B1 (ko) * 1988-12-13 1999-03-20 하쯔도리 마사미쯔 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물
JPH02170820A (ja) * 1988-12-23 1990-07-02 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
TW289044B (de) * 1994-08-02 1996-10-21 Ciba Geigy Ag
JP3065246B2 (ja) * 1995-03-10 2000-07-17 富士化学工業株式会社 ハロゲン含有樹脂用安定剤、その製造法及びハロゲン含有樹脂組成物
CA2365510A1 (en) * 1999-03-16 2000-09-21 Vantico Ag Hardenable composition with a particular combination of characteristics
DE10027206A1 (de) * 2000-05-31 2001-12-13 Osram Opto Semiconductors Gmbh Alterungsstabile Epoxidharzsysteme, daraus hergestellte Formstoffe und Bauelemente und deren Verwendung
JP3981239B2 (ja) * 2000-12-01 2007-09-26 関西ペイント株式会社 一回塗装仕上げ用防食塗料組成物
US20040210019A1 (en) * 2001-06-21 2004-10-21 Nobuhiro Hasegawa Quick curing compositions
KR101005948B1 (ko) * 2002-09-05 2011-01-05 다이셀 가가꾸 고교 가부시끼가이샤 지환족 디에폭시 화합물의 제조 방법, 경화성 에폭시 수지조성물, 전자 부품 봉지용 에폭시 수지 조성물, 전기 절연유용 안정제 및 전기 절연용 주형 에폭시 수지 조성물
JP2004315744A (ja) * 2003-04-18 2004-11-11 Omron Corp 硬化物の耐光性に優れた硬化型樹脂組成物

Also Published As

Publication number Publication date
EP1951800A1 (de) 2008-08-06
US20090023843A1 (en) 2009-01-22
JP5226526B2 (ja) 2013-07-03
ATE428749T1 (de) 2009-05-15
US8436079B2 (en) 2013-05-07
BRPI0618438A2 (pt) 2016-08-30
TW200730577A (en) 2007-08-16
WO2007060077A1 (en) 2007-05-31
TWI412557B (zh) 2013-10-21
BRPI0618438B1 (pt) 2018-03-13
AU2006316667A1 (en) 2007-05-31
ZA200803382B (en) 2009-01-28
EP1951800B1 (de) 2009-04-15
AU2006316667B2 (en) 2012-08-02
CN101313024B (zh) 2012-10-10
PL1951800T3 (pl) 2009-09-30
CN101313024A (zh) 2008-11-26
JP2009516759A (ja) 2009-04-23

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