JP4798848B2 - 特別な性質の組合せを有する硬化性組成物 - Google Patents

特別な性質の組合せを有する硬化性組成物 Download PDF

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Publication number
JP4798848B2
JP4798848B2 JP2000605676A JP2000605676A JP4798848B2 JP 4798848 B2 JP4798848 B2 JP 4798848B2 JP 2000605676 A JP2000605676 A JP 2000605676A JP 2000605676 A JP2000605676 A JP 2000605676A JP 4798848 B2 JP4798848 B2 JP 4798848B2
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JP
Japan
Prior art keywords
resin
epoxy resin
composition according
filler
fillers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000605676A
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English (en)
Japanese (ja)
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JP2002539313A5 (enExample
JP2002539313A (ja
Inventor
バイゼレ,クリスチアン
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Huntsman Advanced Materials Switzerland GmbH
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Huntsman Advanced Materials Switzerland GmbH
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Publication of JP2002539313A publication Critical patent/JP2002539313A/ja
Publication of JP2002539313A5 publication Critical patent/JP2002539313A5/ja
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/12Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2000605676A 1999-03-16 2000-03-06 特別な性質の組合せを有する硬化性組成物 Expired - Fee Related JP4798848B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH48599 1999-03-16
CH485/99 1999-03-16
PCT/EP2000/001954 WO2000055254A1 (de) 1999-03-16 2000-03-06 Härtbare zusammensetzung mit besonderer eigenschaftskombination

Publications (3)

Publication Number Publication Date
JP2002539313A JP2002539313A (ja) 2002-11-19
JP2002539313A5 JP2002539313A5 (enExample) 2011-04-07
JP4798848B2 true JP4798848B2 (ja) 2011-10-19

Family

ID=4188093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000605676A Expired - Fee Related JP4798848B2 (ja) 1999-03-16 2000-03-06 特別な性質の組合せを有する硬化性組成物

Country Status (7)

Country Link
US (1) US6638567B1 (enExample)
EP (1) EP1165688B1 (enExample)
JP (1) JP4798848B2 (enExample)
CA (1) CA2365510A1 (enExample)
DE (1) DE50014006D1 (enExample)
ES (1) ES2276676T3 (enExample)
WO (1) WO2000055254A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101506769B1 (ko) * 2011-12-27 2015-03-27 히타치가세이가부시끼가이샤 전자 부품용 액상 수지 조성물 및 그의 제조 방법, 및 전자 부품 장치

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4319332B2 (ja) * 2000-06-29 2009-08-26 株式会社東芝 電気絶縁材料およびその製造方法
PL363757A1 (en) * 2000-11-29 2004-11-29 Vantico Ag Filled epoxy resin system having high mechanical strength values
US20020111420A1 (en) * 2001-02-12 2002-08-15 International Business Machines Corporation Underfill compositions
JP2002338790A (ja) * 2001-05-22 2002-11-27 Nippon Kayaku Co Ltd 固着含浸用エポキシ樹脂組成物
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
DE60312143T2 (de) * 2003-06-16 2007-11-29 Abb Technology Ltd. Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
US7989704B2 (en) * 2005-07-20 2011-08-02 Areva T&D Sa Electric insulator and a method for the production thereof
CA2627509C (en) 2005-11-15 2013-10-22 Valspar Sourcing, Inc. Crush resistant latex topcoat composition for fiber cement substrates
ATE428749T1 (de) * 2005-11-22 2009-05-15 Huntsman Adv Mat Switzerland Witterungsbeständiges epoxidharzsystem
WO2007089913A1 (en) 2006-01-31 2007-08-09 Valspar Sourcing, Inc. Coating system for cement composite articles
US9783622B2 (en) 2006-01-31 2017-10-10 Axalta Coating Systems Ip Co., Llc Coating system for cement composite articles
AU2007211046B2 (en) 2006-01-31 2011-09-01 Valspar Sourcing, Inc. Method for coating a cement fiberboard article
US8293361B2 (en) 2006-01-31 2012-10-23 Valspar Sourcing, Inc. Coating system for cement composite articles
MX2008014749A (es) 2006-05-19 2009-02-04 Valspar Sourcing Inc Sistema de recubrimiento para articulos compuestos de cemento.
EP2035516B2 (en) 2006-06-02 2017-01-04 Valspar Sourcing, Inc. High performance aqueous coating compositions
US7812090B2 (en) 2006-06-02 2010-10-12 Valspar Sourcing, Inc. High performance aqueous coating compositions
EP2043967B1 (en) 2006-07-07 2018-07-04 Valspar Sourcing, Inc. Coating systems for cement composite articles
EP2044138A1 (en) * 2006-07-20 2009-04-08 ABB Research Ltd Hardenable epoxy resin composition
US8202581B2 (en) 2007-02-16 2012-06-19 Valspar Sourcing, Inc. Treatment for cement composite articles
US20100096173A1 (en) * 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
BRPI0722152A2 (pt) * 2007-10-08 2014-03-18 Abb Research Ltd Sistema de isolamento elétrico de concreto polimérico
KR101537130B1 (ko) * 2008-01-28 2015-07-15 카네카 코포레이션 지환식 에폭시 수지 조성물, 그 경화물, 및 그 제조 방법, 그리고 고무 형상 중합체 함유 수지 조성물
EP2243142A1 (en) * 2008-02-12 2010-10-27 ABB Research Ltd. Surface modified electrical insulation system
BRPI0917455B1 (pt) 2008-08-15 2018-11-21 Valspar Sourcing Inc composição de revestimento, método para preparar um artigo revestido, e, artigo revestido
CN102159614A (zh) * 2008-09-19 2011-08-17 Abb研究有限公司 环氧树脂组合物
AU2009316285A1 (en) 2008-11-24 2010-05-27 Valspar Sourcing, Inc. Coating system for cement composite articles
AU2010230455B2 (en) 2009-04-02 2015-05-07 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Direct overmolding
RU2534653C2 (ru) * 2009-05-05 2014-12-10 Хантсман Эдванст Матириалз (Свитзеленд) Гмбх Отверждаемая система
EP2692795A4 (en) * 2011-03-31 2015-04-01 Mitsubishi Gas Chemical Co RESIN COMPOSITION, PRE-IMPREGNATED, AND LAMINATE COATED WITH METAL SHEET
EP2909251B1 (en) * 2012-10-19 2017-07-26 Dow Global Technologies LLC Low odor epoxy resin systems based on nadic anhydride-type harneders
US20160280864A1 (en) * 2013-10-08 2016-09-29 Timothy A. Morley Low odor epoxy resin systems based on nadic anhydride-type hardeners
DE102013226705A1 (de) * 2013-12-19 2015-06-25 Siemens Aktiengesellschaft Durchschlag- und überschlagsichere Gießharzzusammensetzung
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
PL3310838T3 (pl) 2015-06-16 2022-01-10 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Kompozycja żywicy epoksydowej
CN104987662A (zh) * 2015-06-26 2015-10-21 苏州荣昌复合材料有限公司 一种热固性塑料的制备方法
DK3317318T3 (da) * 2015-07-02 2019-07-22 Huntsman Adv Mat Licensing Switzerland Gmbh Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler
US20180262073A1 (en) * 2017-03-10 2018-09-13 3M Innovative Properties Company Electrical insulating material
DE102017125177A1 (de) * 2017-10-26 2019-05-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Elektrisches Bauteil mit Isolationsschicht und Verfahren zu dessen Herstellung
CN111868170B (zh) * 2018-03-16 2024-08-06 亨斯迈先进材料许可(瑞士)有限公司 存储稳定且固化性的树脂组合物
FI3953408T3 (fi) * 2019-04-11 2023-08-21 Huntsman Adv Mat Licensing Switzerland Gmbh Kovetettava kaksikomponenttinen hartsipohjainen järjestelmä
KR20230122627A (ko) 2020-12-22 2023-08-22 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 경화성 투-파트 수지 시스템
JP2025535282A (ja) 2022-10-18 2025-10-24 ハンツマン・アドヴァンスト・マテリアルズ・(スウィツァーランド)・ゲーエムベーハー シャープエッジインサートの封止におけるクラックの回避法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202947A (en) 1961-02-16 1965-08-24 Jefferson Electric Co Epoxy insulated transformer having tris-beta-chloroethylphosphate and hydrated alumina in the insulation
US4009141A (en) 1972-07-07 1977-02-22 General Electric Company Electrical insulating compositions of epoxy resins, zirconium silicate and alumina
JPS6030346B2 (ja) * 1978-01-06 1985-07-16 日立化成工業株式会社 フライバックトランス注型用エポキシ樹脂組成物
US4315085A (en) 1980-07-25 1982-02-09 Gaf Corporation Core-shell composite polymers having high amounts of carboxylic acid units in the shell
US4419496A (en) 1982-02-22 1983-12-06 The Dow Chemical Company Particle agglomeration in rubber latices
DE3239872A1 (de) 1982-10-27 1984-05-03 Siemens AG, 1000 Berlin und 8000 München Vergussmasse fuer elektronische bauelemente
JPH01197554A (ja) * 1988-02-02 1989-08-09 Toshiba Corp 難燃性樹脂組成物およびその製造法
FR2630578B1 (fr) * 1988-04-22 1990-07-27 France Transfo Sa Transformateur sec enrobe a comportement au feu ameliore et procede de preparation de sa resine d'enrobage
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JPH03115351A (ja) * 1989-09-28 1991-05-16 Toshiba Corp 難燃性エポキシ樹脂組成物
DE59310074D1 (de) * 1992-07-09 2000-08-17 Ciba Sc Holding Ag Härtbare Suspensionen auf Basis von Epoxidharzen
JP3186422B2 (ja) * 1993-05-14 2001-07-11 武田薬品工業株式会社 プラスチゾル
DE59508782D1 (de) * 1994-12-13 2000-11-16 Ciba Sc Holding Ag Core/Shell-Zähigkeitsvermittler enthaltende härtbare Epoxidharz-Giessmassen
EP0780436A4 (en) 1995-07-10 2000-04-19 Toray Industries EPOXY RESIN COMPOSITION
JPH0997729A (ja) * 1995-09-28 1997-04-08 Hitachi Ltd フライバックトランスおよびその製造方法
JP3861425B2 (ja) * 1997-12-22 2006-12-20 大日本インキ化学工業株式会社 加熱圧縮成形材料組成物、シートモールディングコンパウンド及びバルクモールディングコンパウンド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101506769B1 (ko) * 2011-12-27 2015-03-27 히타치가세이가부시끼가이샤 전자 부품용 액상 수지 조성물 및 그의 제조 방법, 및 전자 부품 장치

Also Published As

Publication number Publication date
ES2276676T3 (es) 2007-07-01
CA2365510A1 (en) 2000-09-21
DE50014006D1 (de) 2007-03-15
EP1165688A1 (de) 2002-01-02
WO2000055254A1 (de) 2000-09-21
JP2002539313A (ja) 2002-11-19
US6638567B1 (en) 2003-10-28
EP1165688B1 (de) 2007-01-24

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