CA2365510A1 - Hardenable composition with a particular combination of characteristics - Google Patents

Hardenable composition with a particular combination of characteristics Download PDF

Info

Publication number
CA2365510A1
CA2365510A1 CA002365510A CA2365510A CA2365510A1 CA 2365510 A1 CA2365510 A1 CA 2365510A1 CA 002365510 A CA002365510 A CA 002365510A CA 2365510 A CA2365510 A CA 2365510A CA 2365510 A1 CA2365510 A1 CA 2365510A1
Authority
CA
Canada
Prior art keywords
fillers
composition according
resin
weight
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002365510A
Other languages
English (en)
French (fr)
Inventor
Christian Beisele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2365510A1 publication Critical patent/CA2365510A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CA002365510A 1999-03-16 2000-03-06 Hardenable composition with a particular combination of characteristics Abandoned CA2365510A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH485/99 1999-03-16
CH48599 1999-03-16
PCT/EP2000/001954 WO2000055254A1 (de) 1999-03-16 2000-03-06 Härtbare zusammensetzung mit besonderer eigenschaftskombination

Publications (1)

Publication Number Publication Date
CA2365510A1 true CA2365510A1 (en) 2000-09-21

Family

ID=4188093

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002365510A Abandoned CA2365510A1 (en) 1999-03-16 2000-03-06 Hardenable composition with a particular combination of characteristics

Country Status (7)

Country Link
US (1) US6638567B1 (enExample)
EP (1) EP1165688B1 (enExample)
JP (1) JP4798848B2 (enExample)
CA (1) CA2365510A1 (enExample)
DE (1) DE50014006D1 (enExample)
ES (1) ES2276676T3 (enExample)
WO (1) WO2000055254A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210238408A1 (en) * 2018-10-29 2021-08-05 Henkel Ag & Co. Kgaa Thermal conductive potting composition

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US20040039084A1 (en) * 2000-11-29 2004-02-26 Christian Beisele Filled epoxy resin system having high mechanical strength values
US20020111420A1 (en) * 2001-02-12 2002-08-15 International Business Machines Corporation Underfill compositions
JP2002338790A (ja) * 2001-05-22 2002-11-27 Nippon Kayaku Co Ltd 固着含浸用エポキシ樹脂組成物
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
DE60312143T2 (de) * 2003-06-16 2007-11-29 Abb Technology Ltd. Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
EP1905046B1 (fr) * 2005-07-20 2013-04-24 ALSTOM Technology Ltd Isolateur electrique et procede de fabrication.
US8202578B2 (en) 2005-11-15 2012-06-19 Valspar Sourcing, Inc. Crush resistant latex topcoat composition for fiber cement substrates
AU2006316667B2 (en) * 2005-11-22 2012-08-02 Huntsman Advanced Materials (Switzerland) Gmbh Weather-resistant epoxy resin system
WO2007090132A1 (en) 2006-01-31 2007-08-09 Valspar Sourcing, Inc. Method for coating a cement fiberboard article
EP1979293B1 (en) 2006-01-31 2013-03-06 Valspar Sourcing, Inc. Coating system for cement composite articles
US9783622B2 (en) 2006-01-31 2017-10-10 Axalta Coating Systems Ip Co., Llc Coating system for cement composite articles
WO2007089913A1 (en) 2006-01-31 2007-08-09 Valspar Sourcing, Inc. Coating system for cement composite articles
AU2007253690B2 (en) 2006-05-19 2012-07-12 Valspar Holdings I, Inc Coating system for cement composite articles
US7812090B2 (en) 2006-06-02 2010-10-12 Valspar Sourcing, Inc. High performance aqueous coating compositions
WO2007143622A1 (en) 2006-06-02 2007-12-13 Valspar Sourcing, Inc. High performance aqueous coating compositions
WO2008006109A1 (en) * 2006-07-07 2008-01-10 Valspar Sourcing, Inc. Coating systems for cement composite articles
EP2044138A1 (en) * 2006-07-20 2009-04-08 ABB Research Ltd Hardenable epoxy resin composition
US8202581B2 (en) 2007-02-16 2012-06-19 Valspar Sourcing, Inc. Treatment for cement composite articles
US20100096173A1 (en) * 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
ATE500596T1 (de) * 2007-10-08 2011-03-15 Abb Research Ltd Elektrisches polymerbeton-isolationssystem
US8278388B2 (en) 2008-01-28 2012-10-02 Kaneka Corporation Alicyclic epoxy resin composition, cured product thereof, production method thereof, and rubbery polymer-containing resin composition
CN101999151A (zh) * 2008-02-12 2011-03-30 Abb研究有限公司 表面改性的电绝缘系统
BRPI0917455B1 (pt) 2008-08-15 2018-11-21 Valspar Sourcing Inc composição de revestimento, método para preparar um artigo revestido, e, artigo revestido
KR20110043738A (ko) * 2008-09-19 2011-04-27 에이비비 리써치 리미티드 에폭시 수지 조성물
US9133064B2 (en) 2008-11-24 2015-09-15 Valspar Sourcing, Inc. Coating system for cement composite articles
PL2414444T3 (pl) 2009-04-02 2013-09-30 Huntsman Adv Mat Licensing Switzerland Gmbh Bezpośrednie przeformowanie
PL2427517T3 (pl) * 2009-05-05 2013-11-29 Huntsman Adv Mat Licensing Switzerland Gmbh Układ utwardzalny
US20140093736A1 (en) * 2011-03-31 2014-04-03 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and metal foil-clad laminate
CN107353586A (zh) * 2011-12-27 2017-11-17 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
WO2014062409A2 (en) * 2012-10-19 2014-04-24 Dow Global Technologies Llc Low odor epoxy resin systems based on nadic anhydride-type harneders
US20160280864A1 (en) * 2013-10-08 2016-09-29 Timothy A. Morley Low odor epoxy resin systems based on nadic anhydride-type hardeners
DE102013226705A1 (de) * 2013-12-19 2015-06-25 Siemens Aktiengesellschaft Durchschlag- und überschlagsichere Gießharzzusammensetzung
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
HUE055541T2 (hu) 2015-06-16 2021-12-28 Huntsman Adv Mat Licensing Switzerland Gmbh Epoxigyanta kompozit
CN104987662A (zh) * 2015-06-26 2015-10-21 苏州荣昌复合材料有限公司 一种热固性塑料的制备方法
HUE045364T2 (hu) * 2015-07-02 2019-12-30 Huntsman Adv Mat Licensing Switzerland Gmbh Szabadtéri tárgyak elõállítására alkalmas hõre keményedõ epoxigyanta készítmény és az ebbõl elõállított tárgyak
JP2020510283A (ja) * 2017-03-10 2020-04-02 スリーエム イノベイティブ プロパティズ カンパニー 電気絶縁材料
EP4516865A3 (en) * 2017-06-15 2025-05-28 PPG Coatings (kunshan) Co., Ltd. Intumescent coating composition
DE102017125177A1 (de) * 2017-10-26 2019-05-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Elektrisches Bauteil mit Isolationsschicht und Verfahren zu dessen Herstellung
KR102802243B1 (ko) 2018-03-16 2025-05-07 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 저장 안정성 조성물 및 경화성 수지 조성물
US20220135862A1 (en) * 2019-04-11 2022-05-05 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable Two-Component Resin-Based System
WO2022136330A1 (en) 2020-12-22 2022-06-30 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable two-part resin system
CN120076913A (zh) 2022-10-18 2025-05-30 亨斯迈先进材料(瑞士)有限公司 在边缘尖锐的插件的封装中避免裂纹的方法
WO2026119737A1 (en) * 2024-12-05 2026-06-11 Huntsman Advanced Materials (Switzerland) Gmbh A two-part resin system for encapsulation of electrical components

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US4315085A (en) 1980-07-25 1982-02-09 Gaf Corporation Core-shell composite polymers having high amounts of carboxylic acid units in the shell
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DE3239872A1 (de) 1982-10-27 1984-05-03 Siemens AG, 1000 Berlin und 8000 München Vergussmasse fuer elektronische bauelemente
JPH01197554A (ja) * 1988-02-02 1989-08-09 Toshiba Corp 難燃性樹脂組成物およびその製造法
FR2630578B1 (fr) * 1988-04-22 1990-07-27 France Transfo Sa Transformateur sec enrobe a comportement au feu ameliore et procede de preparation de sa resine d'enrobage
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210238408A1 (en) * 2018-10-29 2021-08-05 Henkel Ag & Co. Kgaa Thermal conductive potting composition
US12503586B2 (en) * 2018-10-29 2025-12-23 Henkel Ag & Co. Kgaa Thermal conductive potting composition

Also Published As

Publication number Publication date
JP4798848B2 (ja) 2011-10-19
WO2000055254A1 (de) 2000-09-21
US6638567B1 (en) 2003-10-28
DE50014006D1 (de) 2007-03-15
EP1165688B1 (de) 2007-01-24
JP2002539313A (ja) 2002-11-19
EP1165688A1 (de) 2002-01-02
ES2276676T3 (es) 2007-07-01

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