PL3765567T3 - Stabilne podczas przechowywania i utwardzalne kompozycje żywiczne - Google Patents
Stabilne podczas przechowywania i utwardzalne kompozycje żywiczneInfo
- Publication number
- PL3765567T3 PL3765567T3 PL19709531.8T PL19709531T PL3765567T3 PL 3765567 T3 PL3765567 T3 PL 3765567T3 PL 19709531 T PL19709531 T PL 19709531T PL 3765567 T3 PL3765567 T3 PL 3765567T3
- Authority
- PL
- Poland
- Prior art keywords
- curable resin
- resin compositions
- storage stable
- stable
- storage
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18162350 | 2018-03-16 | ||
| PCT/EP2019/056473 WO2019175342A1 (en) | 2018-03-16 | 2019-03-14 | Storage stable and curable resin compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3765567T3 true PL3765567T3 (pl) | 2025-02-03 |
Family
ID=61873270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL19709531.8T PL3765567T3 (pl) | 2018-03-16 | 2019-03-14 | Stabilne podczas przechowywania i utwardzalne kompozycje żywiczne |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US20210009803A1 (pl) |
| EP (1) | EP3765567B1 (pl) |
| JP (1) | JP7411587B2 (pl) |
| KR (1) | KR102802243B1 (pl) |
| CN (1) | CN111868170B (pl) |
| BR (1) | BR112020018692B1 (pl) |
| CA (1) | CA3092009A1 (pl) |
| DK (1) | DK3765567T3 (pl) |
| ES (1) | ES2993018T3 (pl) |
| FI (1) | FI3765567T3 (pl) |
| HU (1) | HUE069184T2 (pl) |
| MX (1) | MX2020009610A (pl) |
| MY (1) | MY208152A (pl) |
| PH (1) | PH12020551415A1 (pl) |
| PL (1) | PL3765567T3 (pl) |
| WO (1) | WO2019175342A1 (pl) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK3953408T3 (da) * | 2019-04-11 | 2023-08-21 | Huntsman Adv Mat Licensing Switzerland Gmbh | Hærdbart, harpiksbaseret tokomponentsystem |
| JP2023554147A (ja) | 2020-12-22 | 2023-12-26 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー | 硬化性二液型樹脂系 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| JP3043838B2 (ja) * | 1991-06-05 | 2000-05-22 | 日本ユニカー株式会社 | シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物 |
| DE59310074D1 (de) | 1992-07-09 | 2000-08-17 | Ciba Sc Holding Ag | Härtbare Suspensionen auf Basis von Epoxidharzen |
| JPH09137041A (ja) * | 1995-11-16 | 1997-05-27 | Hitachi Ltd | 含浸用樹脂組成物およびそれを用いた電気絶縁線輪 |
| US6103157A (en) * | 1997-07-02 | 2000-08-15 | Ciba Specialty Chemicals Corp. | Process for impregnating electrical coils |
| EP0899304B1 (de) * | 1997-08-27 | 2005-03-16 | Huntsman Advanced Materials (Switzerland) GmbH | Hydrophobes Epoxidharzsystem |
| DE69922577T2 (de) * | 1998-05-07 | 2005-12-01 | Shin-Etsu Chemical Co., Ltd. | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen |
| JP2000026708A (ja) | 1998-05-07 | 2000-01-25 | Mitsubishi Electric Corp | エポキシ樹脂組成物及び半導体装置 |
| ES2276676T3 (es) * | 1999-03-16 | 2007-07-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Composicion endurecible con combinacion especial de propiedades. |
| CA2365480C (en) * | 1999-03-17 | 2009-05-26 | Vantico Ag | Epoxy resin compositions having a long shelf life |
| JP3707531B2 (ja) | 1999-06-08 | 2005-10-19 | 信越化学工業株式会社 | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
| JP4221585B2 (ja) | 2002-09-13 | 2009-02-12 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
| JP4015613B2 (ja) | 2003-12-15 | 2007-11-28 | 三洋化成工業株式会社 | 注型用樹脂組成物 |
| EP1798740B1 (en) | 2005-12-14 | 2011-08-31 | ABB Research Ltd. | High voltage bushing |
| CN101490124A (zh) * | 2006-07-20 | 2009-07-22 | Abb研究有限公司 | 抗病毒面罩和过滤材料 |
| JP4952283B2 (ja) | 2007-02-14 | 2012-06-13 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| JP5176144B2 (ja) | 2007-08-22 | 2013-04-03 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 |
| KR101372616B1 (ko) * | 2008-09-30 | 2014-03-11 | 히타치가세이가부시끼가이샤 | 코트제, 이것을 사용한 광반도체 소자 탑재용 기판 및 광반도체 장치 |
| DE102008044199A1 (de) * | 2008-11-28 | 2010-06-02 | Wacker Chemie Ag | Siloxan-Mischungen enthaltende Epoxidharze und Verfahren zu ihrer Herstellung und deren Verwendung |
| GB201113196D0 (en) * | 2011-08-01 | 2011-09-14 | Cytec Tech Corp | Thermoset resin compositions with increased toughness |
| BR112017015236A2 (pt) * | 2015-02-11 | 2018-01-09 | Dow Global Technologies Llc | adesivos curáveis em baixa temperatura e uso dos mesmos |
| DE102016006910A1 (de) | 2016-06-08 | 2017-12-14 | Hexion GmbH | Zusammensetzung enthaltend ein Polymer auf der Basis von Epoxidverbindungen |
-
2019
- 2019-03-14 FI FIEP19709531.8T patent/FI3765567T3/fi active
- 2019-03-14 EP EP19709531.8A patent/EP3765567B1/en active Active
- 2019-03-14 CN CN201980019849.4A patent/CN111868170B/zh active Active
- 2019-03-14 DK DK19709531.8T patent/DK3765567T3/da active
- 2019-03-14 BR BR112020018692-9A patent/BR112020018692B1/pt active IP Right Grant
- 2019-03-14 US US16/981,334 patent/US20210009803A1/en active Pending
- 2019-03-14 WO PCT/EP2019/056473 patent/WO2019175342A1/en not_active Ceased
- 2019-03-14 JP JP2020572621A patent/JP7411587B2/ja active Active
- 2019-03-14 ES ES19709531T patent/ES2993018T3/es active Active
- 2019-03-14 MX MX2020009610A patent/MX2020009610A/es unknown
- 2019-03-14 CA CA3092009A patent/CA3092009A1/en active Pending
- 2019-03-14 HU HUE19709531A patent/HUE069184T2/hu unknown
- 2019-03-14 PL PL19709531.8T patent/PL3765567T3/pl unknown
- 2019-03-14 MY MYPI2020004355A patent/MY208152A/en unknown
- 2019-03-14 KR KR1020207029884A patent/KR102802243B1/ko active Active
-
2020
- 2020-09-09 PH PH12020551415A patent/PH12020551415A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MX2020009610A (es) | 2020-10-07 |
| JP2021518483A (ja) | 2021-08-02 |
| FI3765567T3 (fi) | 2024-11-13 |
| CN111868170A (zh) | 2020-10-30 |
| KR20200133267A (ko) | 2020-11-26 |
| EP3765567A1 (en) | 2021-01-20 |
| BR112020018692A2 (pt) | 2020-12-29 |
| CN111868170B (zh) | 2024-08-06 |
| BR112020018692B1 (pt) | 2024-04-30 |
| JP7411587B2 (ja) | 2024-01-11 |
| ES2993018T3 (en) | 2024-12-20 |
| US20210009803A1 (en) | 2021-01-14 |
| KR102802243B1 (ko) | 2025-05-07 |
| EP3765567B1 (en) | 2024-09-18 |
| DK3765567T3 (da) | 2024-11-18 |
| CA3092009A1 (en) | 2019-09-19 |
| HUE069184T2 (hu) | 2025-02-28 |
| PH12020551415A1 (en) | 2021-09-13 |
| WO2019175342A1 (en) | 2019-09-19 |
| MY208152A (en) | 2025-04-18 |
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