MX2020009610A - Composiciones de resina curables y estables al almacenamiento. - Google Patents

Composiciones de resina curables y estables al almacenamiento.

Info

Publication number
MX2020009610A
MX2020009610A MX2020009610A MX2020009610A MX2020009610A MX 2020009610 A MX2020009610 A MX 2020009610A MX 2020009610 A MX2020009610 A MX 2020009610A MX 2020009610 A MX2020009610 A MX 2020009610A MX 2020009610 A MX2020009610 A MX 2020009610A
Authority
MX
Mexico
Prior art keywords
storage stable
curable resin
resin compositions
resin composition
stable resin
Prior art date
Application number
MX2020009610A
Other languages
English (en)
Inventor
Christian Beisele
Hubert Wilbers
Daniel Bär
Original Assignee
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh
Publication of MX2020009610A publication Critical patent/MX2020009610A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

Se describe una composición de resina estable al almacenamiento, que comprende una resina epoxi, un copolímero de bloques con silicona y bloques orgánicos, y un silano, un proceso para obtener dicha composición de resina estable al almacenamiento, una composición de resina curable que se puede obtener a partir de la composición de resina estable al almacenamiento anterior, así como un artículo curado que se puede obtener a partir de esta última y usos del mismo.
MX2020009610A 2018-03-16 2019-03-14 Composiciones de resina curables y estables al almacenamiento. MX2020009610A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18162350 2018-03-16
PCT/EP2019/056473 WO2019175342A1 (en) 2018-03-16 2019-03-14 Storage stable and curable resin compositions

Publications (1)

Publication Number Publication Date
MX2020009610A true MX2020009610A (es) 2020-10-07

Family

ID=61873270

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020009610A MX2020009610A (es) 2018-03-16 2019-03-14 Composiciones de resina curables y estables al almacenamiento.

Country Status (10)

Country Link
US (1) US20210009803A1 (es)
EP (1) EP3765567A1 (es)
JP (1) JP7411587B2 (es)
KR (1) KR20200133267A (es)
CN (1) CN111868170A (es)
BR (1) BR112020018692A2 (es)
CA (1) CA3092009A1 (es)
MX (1) MX2020009610A (es)
PH (1) PH12020551415A1 (es)
WO (1) WO2019175342A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112021017480A2 (pt) * 2019-04-11 2021-11-16 Huntsman Adv Mat Licensing Switzerland Gmbh Sistema curável à base de resina de dois componentes, artigo curado, e, uso de um artigo curado
CA3203571A1 (en) 2020-12-22 2022-06-30 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable two-part resin system

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP3043838B2 (ja) * 1991-06-05 2000-05-22 日本ユニカー株式会社 シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
DE59310074D1 (de) 1992-07-09 2000-08-17 Ciba Sc Holding Ag Härtbare Suspensionen auf Basis von Epoxidharzen
JPH09137041A (ja) * 1995-11-16 1997-05-27 Hitachi Ltd 含浸用樹脂組成物およびそれを用いた電気絶縁線輪
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
EP0899304B1 (de) * 1997-08-27 2005-03-16 Huntsman Advanced Materials (Switzerland) GmbH Hydrophobes Epoxidharzsystem
JP2000026708A (ja) 1998-05-07 2000-01-25 Mitsubishi Electric Corp エポキシ樹脂組成物及び半導体装置
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
WO2000055254A1 (de) 1999-03-16 2000-09-21 Vantico Ag Härtbare zusammensetzung mit besonderer eigenschaftskombination
JP3707531B2 (ja) * 1999-06-08 2005-10-19 信越化学工業株式会社 フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置
JP4221585B2 (ja) * 2002-09-13 2009-02-12 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP4015613B2 (ja) * 2003-12-15 2007-11-28 三洋化成工業株式会社 注型用樹脂組成物
EP1798740B1 (en) 2005-12-14 2011-08-31 ABB Research Ltd. High voltage bushing
JP2009543912A (ja) * 2006-07-20 2009-12-10 アーベーベー・リサーチ・リミテッド 硬化性エポキシ樹脂組成物
JP4952283B2 (ja) * 2007-02-14 2012-06-13 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
WO2009018193A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
JP5176144B2 (ja) * 2007-08-22 2013-04-03 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置
DE102008044199A1 (de) * 2008-11-28 2010-06-02 Wacker Chemie Ag Siloxan-Mischungen enthaltende Epoxidharze und Verfahren zu ihrer Herstellung und deren Verwendung
GB201113196D0 (en) * 2011-08-01 2011-09-14 Cytec Tech Corp Thermoset resin compositions with increased toughness
BR112017015236A2 (pt) * 2015-02-11 2018-01-09 Dow Global Technologies Llc adesivos curáveis em baixa temperatura e uso dos mesmos
DE102016006910A1 (de) * 2016-06-08 2017-12-14 Hexion GmbH Zusammensetzung enthaltend ein Polymer auf der Basis von Epoxidverbindungen

Also Published As

Publication number Publication date
EP3765567A1 (en) 2021-01-20
PH12020551415A1 (en) 2021-09-13
BR112020018692A2 (pt) 2020-12-29
CA3092009A1 (en) 2019-09-19
CN111868170A (zh) 2020-10-30
WO2019175342A1 (en) 2019-09-19
JP7411587B2 (ja) 2024-01-11
KR20200133267A (ko) 2020-11-26
JP2021518483A (ja) 2021-08-02
US20210009803A1 (en) 2021-01-14

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