JP2021518483A - 貯蔵安定及び硬化性樹脂組成物 - Google Patents
貯蔵安定及び硬化性樹脂組成物 Download PDFInfo
- Publication number
- JP2021518483A JP2021518483A JP2020572621A JP2020572621A JP2021518483A JP 2021518483 A JP2021518483 A JP 2021518483A JP 2020572621 A JP2020572621 A JP 2020572621A JP 2020572621 A JP2020572621 A JP 2020572621A JP 2021518483 A JP2021518483 A JP 2021518483A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- silane
- curable resin
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 48
- 238000003860 storage Methods 0.000 title description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910000077 silane Inorganic materials 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920001400 block copolymer Polymers 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 239000000945 filler Substances 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 238000005470 impregnation Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000009730 filament winding Methods 0.000 claims description 6
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 150000008064 anhydrides Chemical class 0.000 claims description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000012360 testing method Methods 0.000 description 16
- 229920003319 Araldite® Polymers 0.000 description 14
- -1 4-hydroxy-3-methylphenyl Chemical group 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- 238000007872 degassing Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000009864 tensile test Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000012745 toughening agent Substances 0.000 description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 229920002732 Polyanhydride Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229920004482 WACKER® Polymers 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QZIVREPGPYTOJQ-UHFFFAOYSA-N nonoxyperoxymethanediamine Chemical compound CCCCCCCCCOOOC(N)N QZIVREPGPYTOJQ-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 238000003878 thermal aging Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PVXVWWANJIWJOO-UHFFFAOYSA-N 1-(1,3-benzodioxol-5-yl)-N-ethylpropan-2-amine Chemical compound CCNC(C)CC1=CC=C2OCOC2=C1 PVXVWWANJIWJOO-UHFFFAOYSA-N 0.000 description 1
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical compound CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- ZEMIDNFXUZQDFE-UHFFFAOYSA-N 2,2-bis(7-oxabicyclo[4.1.0]heptan-1-yl)acetic acid Chemical compound C1CCCC2OC21C(C(=O)O)C1(O2)C2CCCC1 ZEMIDNFXUZQDFE-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- AQCLQMIIOAXRBP-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dimethylphenyl)-3,6-di(propan-2-yl)phenyl]-2,6-dimethylaniline Chemical compound C=1C(C)=C(N)C(C)=CC=1C=1C(C(C)C)=CC=C(C(C)C)C=1C1=CC(C)=C(N)C(C)=C1 AQCLQMIIOAXRBP-UHFFFAOYSA-N 0.000 description 1
- RZVWLPZIPNEVCN-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-3,6-di(propan-2-yl)phenyl]aniline Chemical compound C=1C=C(N)C=CC=1C=1C(C(C)C)=CC=C(C(C)C)C=1C1=CC=C(N)C=C1 RZVWLPZIPNEVCN-UHFFFAOYSA-N 0.000 description 1
- YRKVLGUIGNRYJX-UHFFFAOYSA-N 4-[9-(4-amino-3-methylphenyl)fluoren-9-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(N)=CC=2)=C1 YRKVLGUIGNRYJX-UHFFFAOYSA-N 0.000 description 1
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000010754 BS 2869 Class F Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 241001251094 Formica Species 0.000 description 1
- QMMZSJPSPRTHGB-UHFFFAOYSA-N MDEA Natural products CC(C)CCCCC=CCC=CC(O)=O QMMZSJPSPRTHGB-UHFFFAOYSA-N 0.000 description 1
- CXOFVDLJLONNDW-UHFFFAOYSA-N Phenytoin Chemical compound N1C(=O)NC(=O)C1(C=1C=CC=CC=1)C1=CC=CC=C1 CXOFVDLJLONNDW-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- CIRCNIFATDOFLQ-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 4-methylcyclohexane-1,2-dicarboxylate Chemical compound C1C(C)CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 CIRCNIFATDOFLQ-UHFFFAOYSA-N 0.000 description 1
- PUZKHBBNPSMDFP-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 5-methylcyclohex-3-ene-1,2-dicarboxylate Chemical compound C1=CC(C)CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 PUZKHBBNPSMDFP-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- UNYOJUYSNFGNDV-UHFFFAOYSA-M magnesium monohydroxide Chemical compound [Mg]O UNYOJUYSNFGNDV-UHFFFAOYSA-M 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
本開示は貯蔵安定組成物、それから得られる硬化性樹脂組成物、後者から得られる製品及びそれらの使用に関する。
硬化性樹脂組成物は種々の目的のために広く知られている。非常に興味深い1つの目的は、電気的用途のための硬化性樹脂組成物の使用である。例えば計器用変成器、スイッチギヤ、絶縁材料、ブッシング又はDDTsのような電気装置は、硬化性樹脂組成物を自動加圧ゲル化(APG)及び/又は真空鋳造し、次いでそれを適した条件下で硬化させることにより製造される。そのような用途のために、通常、充填剤を硬化性樹脂組成物に加え、必要な機械的特性を得る。
先行技術の欠点を見て、本開示の目的は、同等に低いコストで向上した靭性(同等の高いTgレベルにおける)及び耐熱性並びに同時により低い粘度を有する硬化性樹脂組成物を提供することである。充填剤が加えられない用途(高電圧樹脂含浸紙ブッシング及びマイカテープ用途及びフィラメントワインディング)のためにも、より高い靭性は望ましいであろう。
本明細書で他にことわらなければ、本開示と結び付けて用いられる技術用語は当業者が通常理解する意味を有するものとする。さらに、状況により他の意味が必要とされなければ、単数の用語は複数を含むものとし、複数の用語は単数を含むものとする。
mprise)」及び「含む(comprises)」のような含む(comprising)のいずれかの形態)、「有する(having)」(並びに「有する(have)」及び「有する(has)」のような有する(having)のいずれかの形態)、「含む(including)」(並びに「含む(includes)」及び「含む(include)」のような含む(including)のいずれかの形態)又は「含む(containing)」(並びに「含む(contains)」及び含む(contain))のような含む(containing)のいずれかの形態)という用語は包括的又は非制限的であり、追加の挙げられていない要素又は方法段階を排除しない。
示の貯蔵安定樹脂組成物を得るための方法にも関する。
ゼオライト(特にモレキュラーシーブ)、タルカム、マイカ、カオリン、ウォラストナイト及び他のようなケイ酸塩の群からのものである。
ロフェニル−N,N−ジメチル−ウレア;3,4−ジクロロフェニル−N,N−ジメチル−ウレア;9,9−ビス(3−メチル−4−アミノフェニル)フルオレン;9,9−ビス(4−アミノフェニル)フルオレン;ジアミノシクロヘキサン(DACH);イソホロンジアミン(IPDA);4,4’−ジアミノジシクロヘキシルメタン;ビスアミノプロピルピペラジン;及びN−アミノエチルピペラジンが含まれる。
Araldite(登録商標) MY 740樹脂:180−190g/eqのエポキシ当量を有するビスフェノール−Aジグリシジルエーテルエポキシ樹脂。
Araldite(登録商標) CY 5995樹脂:ポリブタジエンに基づきPMMAシェルを有するコア−シェル強靭化剤を含むビスフェノール−Aジグリシジルエーテルエポキシ樹脂。
Aradur(登録商標) HY 918−1硬化剤:メチルテトラヒドロフタル酸無水物の種々の異性体からなる無水物硬化剤。
Accelerator DY 070促進剤:1−メチル−イミダゾールシリカ
Silbond W12シリカ:16μmの平均粒度を有するシリカ粉末(供給者:Quarzwerke GmbH,Frechen,Germany)
Silquest(登録商標) A−187シラン:[3−(2,3−エポキシプロポキシ)プロピル]トリメトキシシラン(供給者:Momentive Performance Materials,Albany,NY)
Genioperl(登録商標) W35:シリコーン及び有機ブロックを有するブロックコポリマー(供給者:Wacker Chemie AG,Munich,Germany)
Bae 3579−3:82pbwのAradur HY 918−1及び0.5pbwのAccelerator DY 070の予備混合物。
50−60℃においてブレード撹拌機を用い、100gのAraldite(登録商標) CY 5995樹脂を82.5gのBae 3579−3と5分間混合した。
50−60℃においてブレード撹拌機を用い、100gのAraldite(登録商標) MY 740樹脂を85gのBae 3579−3と5分間混合した。次いで混合物を約60℃に加熱しながら278gのSilbond(登録商標) W12シリカを10分以内に分けて加えた。最後に混合物を真空下で脱ガスした。
90℃においてブレードミキサーを用い、94gのAraldite(登録商標) MY 740樹脂を6gのGenioperl(登録商標) W 35と15分間混合した。
60℃においてブレードミキサーを用い、99gのAraldite(登録商標) MY 740樹脂を1gのSilquest(登録商標) A−187シランと15分間混合した。次いで85gのBae 3579−3を加え、ブレード撹拌機を用いて60℃で5分間混合した。
90℃においてブレードミキサーを用い、93gのAraldite(登録商標) MY 740樹脂を6gのGenioperl(登録商標) W 35と15分間混合した。
90℃においてブレードミキサーを用い、93.5gのAraldite(登録商標)
MY 740樹脂を6gのGenioperl(登録商標) W 35と15分間混合した。
90℃においてブレードミキサーを用い、96gのAraldite(登録商標) MY 740樹脂を3gのGenioperl(登録商標) W 35と15分間混合した。
90℃においてブレードミキサーを用い、96.5gのAraldite(登録商標)
MY 740樹脂を3gのGenioperl(登録商標) W 35と15分間混合した。
RI=−498.08・Z0.18480890・G0.194114601・(A−18)-0.391334273・T-
0.158387791+224.25
である。
RI=℃における模擬亀裂温度
Z=%における破断点伸び
G=J/m2におけるGIC
A=ppm/KにおけるCTE
T=℃におけるTg
Claims (16)
- エポキシ樹脂、シリコーンと有機ブロックを有するブロックコポリマー及びシランを含む貯蔵安定樹脂組成物。
- エポキシ樹脂がビスフェノール−Aエポキシ樹脂である請求項1に記載の貯蔵安定樹脂組成物。
- 組成物が、エポキシ樹脂、ブロックコポリマー及びシランの量の合計に基づいて4ないし8重量%の量で、ブロックコポリマーを含む請求項1又は2に記載の貯蔵安定樹脂組成物。
- シランがエポキシシランである請求項1ないし3のいずれかに記載の貯蔵安定樹脂組成物。
- 組成物が、エポキシ樹脂、ブロックコポリマー及びシランの量の合計に基づいて0.6ないし1.5重量%の量で、シランを含む請求項1ないし4のいずれかに記載の貯蔵安定樹脂組成物。
- エポキシ樹脂を80℃以上、好ましくは80と120℃の間、最も好ましくは80と100℃の間の温度でブロックコポリマーと配合してブレンドを得、ブレンドを60℃以下、好ましくは60と40℃の間の温度に冷まし、次いでシランと混合する請求項1ないし5のいずれかに記載の貯蔵安定樹脂組成物を得るための方法。
- 請求項1ないし5のいずれかに記載の貯蔵安定樹脂組成物及び硬化剤成分を含む硬化性樹脂組成物。
- 硬化剤成分が無水物、アミン、ジシアンジアミド又はエポキシ重合を開始させる触媒に基づく請求項7に記載の硬化性樹脂組成物。
- 組成物がさらに充填剤成分を含む請求項7及び8のいずれかに記載の硬化性樹脂組成物。
- 組成物が、エポキシ樹脂、ブロックコポリマー、シラン、硬化剤及び充填剤成分の量の合計に基づいて、60ないし70重量%の量で充填剤成分を含む請求項9に記載の硬化性樹脂組成物。
- 充填剤成分がシリカを含む請求項9又は10に記載の硬化性樹脂組成物。
- 充填剤成分中のシリカの含有率が、充填剤成分の構成成分の合計に基づいて、50ないし100重量%である請求項11に記載の硬化性樹脂組成物。
- 請求項7ないし12のいずれかに記載の硬化性樹脂組成物を硬化させることにより得ることができる硬化製品。
- 計器用変成器、スイッチギヤ、絶縁材料、ブッシング、中空芯絶縁材料又は乾式配電変成器のような電気的用途のための請求項13に記載の硬化製品の使用。
- 高電圧用途のための紙ブッシングの含浸のため、又は絶縁された大きい発電機及びモーターのマイカテープ又はフィラメントワインディングの含浸のための請求項7及び8のいずれかに記載の硬化性樹脂組成物の使用。
- 電気モーターの固定子の封入のための請求項7ないし12のいずれかに記載の硬化性樹脂組成物の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18162350 | 2018-03-16 | ||
EP18162350.5 | 2018-03-16 | ||
PCT/EP2019/056473 WO2019175342A1 (en) | 2018-03-16 | 2019-03-14 | Storage stable and curable resin compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021518483A true JP2021518483A (ja) | 2021-08-02 |
JP7411587B2 JP7411587B2 (ja) | 2024-01-11 |
Family
ID=61873270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020572621A Active JP7411587B2 (ja) | 2018-03-16 | 2019-03-14 | 貯蔵安定及び硬化性樹脂組成物 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20210009803A1 (ja) |
EP (1) | EP3765567A1 (ja) |
JP (1) | JP7411587B2 (ja) |
KR (1) | KR20200133267A (ja) |
CN (1) | CN111868170A (ja) |
BR (1) | BR112020018692B1 (ja) |
CA (1) | CA3092009A1 (ja) |
MX (1) | MX2020009610A (ja) |
PH (1) | PH12020551415A1 (ja) |
WO (1) | WO2019175342A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL3953408T3 (pl) * | 2019-04-11 | 2023-10-30 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Utwardzalny, dwuskładnikowy układ na bazie żywicy |
US20240093022A1 (en) | 2020-12-22 | 2024-03-21 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Curable Two-Part Resin System |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04359023A (ja) * | 1991-06-05 | 1992-12-11 | Nippon Unicar Co Ltd | シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物 |
JPH09137041A (ja) * | 1995-11-16 | 1997-05-27 | Hitachi Ltd | 含浸用樹脂組成物およびそれを用いた電気絶縁線輪 |
JPH11162258A (ja) * | 1997-07-02 | 1999-06-18 | Ciba Specialty Chem Holding Inc | 電気コイルを含浸する方法、および含浸するための選択されたエポキシ樹脂組成物 |
JP2001055487A (ja) * | 1999-06-08 | 2001-02-27 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
JP2004124089A (ja) * | 2002-09-13 | 2004-04-22 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
JP2005171166A (ja) * | 2003-12-15 | 2005-06-30 | Sanyo Chem Ind Ltd | 注型用樹脂組成物 |
JP2008195875A (ja) * | 2007-02-14 | 2008-08-28 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2009068007A (ja) * | 2007-08-22 | 2009-04-02 | Hitachi Chem Co Ltd | 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 |
US20170355848A1 (en) * | 2016-06-08 | 2017-12-14 | Hexion Inc. | Composition comprising a polymer based on epoxide compounds |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
DE59310074D1 (de) | 1992-07-09 | 2000-08-17 | Ciba Sc Holding Ag | Härtbare Suspensionen auf Basis von Epoxidharzen |
DE59812650D1 (de) * | 1997-08-27 | 2005-04-21 | Huntsman Adv Mat Switzerland | Hydrophobes Epoxidharzsystem |
DE69922577T2 (de) * | 1998-05-07 | 2005-12-01 | Shin-Etsu Chemical Co., Ltd. | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen |
JP2000026708A (ja) | 1998-05-07 | 2000-01-25 | Mitsubishi Electric Corp | エポキシ樹脂組成物及び半導体装置 |
WO2000055254A1 (de) | 1999-03-16 | 2000-09-21 | Vantico Ag | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
EP1798740B1 (en) | 2005-12-14 | 2011-08-31 | ABB Research Ltd. | High voltage bushing |
EP2044138A1 (en) * | 2006-07-20 | 2009-04-08 | ABB Research Ltd | Hardenable epoxy resin composition |
CN101772546B (zh) * | 2007-08-02 | 2012-05-23 | 陶氏环球技术公司 | 用来增强热固性聚合物性能的两亲性嵌段共聚物和无机纳米填料 |
DE102008044199A1 (de) * | 2008-11-28 | 2010-06-02 | Wacker Chemie Ag | Siloxan-Mischungen enthaltende Epoxidharze und Verfahren zu ihrer Herstellung und deren Verwendung |
GB201113196D0 (en) * | 2011-08-01 | 2011-09-14 | Cytec Tech Corp | Thermoset resin compositions with increased toughness |
US20170349795A1 (en) * | 2015-02-11 | 2017-12-07 | Dow Global Technologies Llc | Low temperature curable adhesives and use thereof |
-
2019
- 2019-03-14 EP EP19709531.8A patent/EP3765567A1/en active Pending
- 2019-03-14 MX MX2020009610A patent/MX2020009610A/es unknown
- 2019-03-14 CA CA3092009A patent/CA3092009A1/en active Pending
- 2019-03-14 BR BR112020018692-9A patent/BR112020018692B1/pt active IP Right Grant
- 2019-03-14 CN CN201980019849.4A patent/CN111868170A/zh active Pending
- 2019-03-14 US US16/981,334 patent/US20210009803A1/en active Pending
- 2019-03-14 JP JP2020572621A patent/JP7411587B2/ja active Active
- 2019-03-14 KR KR1020207029884A patent/KR20200133267A/ko not_active Application Discontinuation
- 2019-03-14 WO PCT/EP2019/056473 patent/WO2019175342A1/en active Application Filing
-
2020
- 2020-09-09 PH PH12020551415A patent/PH12020551415A1/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04359023A (ja) * | 1991-06-05 | 1992-12-11 | Nippon Unicar Co Ltd | シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物 |
JPH09137041A (ja) * | 1995-11-16 | 1997-05-27 | Hitachi Ltd | 含浸用樹脂組成物およびそれを用いた電気絶縁線輪 |
JPH11162258A (ja) * | 1997-07-02 | 1999-06-18 | Ciba Specialty Chem Holding Inc | 電気コイルを含浸する方法、および含浸するための選択されたエポキシ樹脂組成物 |
JP2001055487A (ja) * | 1999-06-08 | 2001-02-27 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
JP2004124089A (ja) * | 2002-09-13 | 2004-04-22 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
JP2005171166A (ja) * | 2003-12-15 | 2005-06-30 | Sanyo Chem Ind Ltd | 注型用樹脂組成物 |
JP2008195875A (ja) * | 2007-02-14 | 2008-08-28 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2009068007A (ja) * | 2007-08-22 | 2009-04-02 | Hitachi Chem Co Ltd | 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 |
US20170355848A1 (en) * | 2016-06-08 | 2017-12-14 | Hexion Inc. | Composition comprising a polymer based on epoxide compounds |
Also Published As
Publication number | Publication date |
---|---|
CN111868170A (zh) | 2020-10-30 |
BR112020018692A2 (pt) | 2020-12-29 |
KR20200133267A (ko) | 2020-11-26 |
US20210009803A1 (en) | 2021-01-14 |
JP7411587B2 (ja) | 2024-01-11 |
BR112020018692B1 (pt) | 2024-04-30 |
CA3092009A1 (en) | 2019-09-19 |
PH12020551415A1 (en) | 2021-09-13 |
MX2020009610A (es) | 2020-10-07 |
EP3765567A1 (en) | 2021-01-20 |
WO2019175342A1 (en) | 2019-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6030126B2 (ja) | 絶縁配合物 | |
JP6030125B2 (ja) | 絶縁配合物 | |
JP7324336B2 (ja) | 屋外用製品を製造するための熱硬化性エポキシ樹脂組成物、およびそれから得られる屋外用製品 | |
JP7365118B2 (ja) | 電気工学用の絶縁系の製造方法、それから得られる製品及びその使用 | |
TWI777917B (zh) | 製備電子工程用絕緣系統的方法,得到的物件及其用途 | |
JP7411587B2 (ja) | 貯蔵安定及び硬化性樹脂組成物 | |
KR102530214B1 (ko) | 전기공학용 제품의 제조를 위한 열경화성 에폭시 수지 조성물 및 이로부터 수득한 제품 | |
JP7389763B2 (ja) | 紙ブッシングの含浸における使用用の硬化性混合物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220222 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230515 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230823 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230907 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231206 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231225 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7411587 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |