JP7389763B2 - 紙ブッシングの含浸における使用用の硬化性混合物 - Google Patents
紙ブッシングの含浸における使用用の硬化性混合物 Download PDFInfo
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- JP7389763B2 JP7389763B2 JP2020572620A JP2020572620A JP7389763B2 JP 7389763 B2 JP7389763 B2 JP 7389763B2 JP 2020572620 A JP2020572620 A JP 2020572620A JP 2020572620 A JP2020572620 A JP 2020572620A JP 7389763 B2 JP7389763 B2 JP 7389763B2
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- curable mixture
- epoxy
- diglycidyl ether
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- 239000000203 mixture Substances 0.000 title claims description 84
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 239000004593 Epoxy Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 239000012745 toughening agent Substances 0.000 claims description 15
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 13
- -1 4-hydroxycyclohexyl Chemical group 0.000 claims description 12
- 238000005470 impregnation Methods 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- 229910000077 silane Inorganic materials 0.000 claims description 11
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical group C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 claims description 8
- 229920003986 novolac Polymers 0.000 claims description 8
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 7
- 150000002170 ethers Chemical class 0.000 claims description 7
- 239000004615 ingredient Substances 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 5
- 150000008064 anhydrides Chemical group 0.000 claims description 5
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 5
- 229920001400 block copolymer Polymers 0.000 claims description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical group C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 claims description 3
- ZEMIDNFXUZQDFE-UHFFFAOYSA-N 2,2-bis(7-oxabicyclo[4.1.0]heptan-1-yl)acetic acid Chemical compound C1CCCC2OC21C(C(=O)O)C1(O2)C2CCCC1 ZEMIDNFXUZQDFE-UHFFFAOYSA-N 0.000 claims description 3
- RXQVGXQHXIUBPX-UHFFFAOYSA-N 2,6-dimethyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC(C)=C1N(CC1OC1)CC1OC1 RXQVGXQHXIUBPX-UHFFFAOYSA-N 0.000 claims description 3
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- CIRCNIFATDOFLQ-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 4-methylcyclohexane-1,2-dicarboxylate Chemical compound C1C(C)CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 CIRCNIFATDOFLQ-UHFFFAOYSA-N 0.000 claims description 3
- PUZKHBBNPSMDFP-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 5-methylcyclohex-3-ene-1,2-dicarboxylate Chemical compound C1=CC(C)CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 PUZKHBBNPSMDFP-UHFFFAOYSA-N 0.000 claims description 3
- KTPIWUHKYIJBCR-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound C1C=CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KTPIWUHKYIJBCR-UHFFFAOYSA-N 0.000 claims description 3
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 239000001294 propane Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims 2
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims 1
- 229920003319 Araldite® Polymers 0.000 description 16
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000004848 polyfunctional curative Substances 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 230000004913 activation Effects 0.000 description 8
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000010561 standard procedure Methods 0.000 description 5
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 4
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002372 labelling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- WXQZLPFNTPKVJM-UHFFFAOYSA-N 4-[(4-hydroxycyclohexyl)methyl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1CC1CCC(O)CC1 WXQZLPFNTPKVJM-UHFFFAOYSA-N 0.000 description 2
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229920003326 Araldite® GY 280 Polymers 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 231100000615 substance of very high concern Toxicity 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- SZCFDTYKNQJQKT-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCC1CO1 SZCFDTYKNQJQKT-UHFFFAOYSA-N 0.000 description 1
- VKADIMFVVBZHTF-UHFFFAOYSA-N 2-[2-(6-oxabicyclo[3.1.0]hexan-2-yl)ethyl]-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1CCC1C2OC2CC1 VKADIMFVVBZHTF-UHFFFAOYSA-N 0.000 description 1
- YSAANLSYLSUVHB-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]ethanol Chemical compound CN(C)CCOCCO YSAANLSYLSUVHB-UHFFFAOYSA-N 0.000 description 1
- LSYBWANTZYUTGJ-UHFFFAOYSA-N 2-[2-(dimethylamino)ethyl-methylamino]ethanol Chemical compound CN(C)CCN(C)CCO LSYBWANTZYUTGJ-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical group OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- WXYTXCXWNITTLN-UHFFFAOYSA-N 3-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCCC(C(O)=O)C1C(O)=O WXYTXCXWNITTLN-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KJYXWNPAZCIVSW-UHFFFAOYSA-N 4-(4-hydroxycyclohexyl)sulfonylcyclohexan-1-ol Chemical compound C1CC(O)CCC1S(=O)(=O)C1CCC(O)CC1 KJYXWNPAZCIVSW-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical class NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- YWVFNWVZBAWOOY-UHFFFAOYSA-N 4-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCC(C(O)=O)C(C(O)=O)C1 YWVFNWVZBAWOOY-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- SVLTVRFYVWMEQN-UHFFFAOYSA-N 5-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound CC1CC(C(O)=O)C(C(O)=O)C=C1 SVLTVRFYVWMEQN-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 102100022419 RPA-interacting protein Human genes 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229920006130 high-performance polyamide Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940102253 isopropanolamine Drugs 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ZMVMYBGDGJLCHV-UHFFFAOYSA-N n-methyl-4-[[4-(methylamino)phenyl]methyl]aniline Chemical compound C1=CC(NC)=CC=C1CC1=CC=C(NC)C=C1 ZMVMYBGDGJLCHV-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000002473 ribonucleic acid immunoprecipitation Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 239000003053 toxin Substances 0.000 description 1
- 231100000765 toxin Toxicity 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/52—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials wood; paper; press board
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-
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/045—Reinforcing macromolecular compounds with loose or coherent fibrous material with vegetable or animal fibrous material
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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Description
本開示は、特に紙ブッシングの含浸における使用用の硬化性混合物、そのような混合物により含浸された紙ブッシング並びにそのような混合物の使用に関する。
樹脂含浸紙(RIP)ブッシングは、例えば高電圧スイッチギヤ又は変圧器のような高電圧装置に用途を見出す。
3に従うエポキシ系はわずか0.5ないし1%の大きさの不満足に低い破断点伸びを生ずる。
本開示の基礎となる目的は、MHHPA及びREACH規則に従ってSVHC又は化学品の分類及び表示に関する世界調和システム(the Globally Harmonized System of Classification and Labelling of Chemicals)に従って毒性と現在表示されている他の材料を含まず、より高い靭性を与え且つ発熱の熱(exothermic heat)のより滑らかな放出に導くことにより前に議論した既知の系の問題を克服しながら、例えば120ないし130℃のTg、23℃において<0.3%の50Hzにおけるタンデルタ、40℃において<250mPasの粘度、<55kJ/モルの活性化エネルギー(80℃及び140℃で測定されるゲル化時間を介して決定される)、>80MPaの引張り強さ、>3.5%の破断点伸び、KIC>0.7MPa.m0.5及び>150J/m2のGICを含むRIP用途のためのすべての他の必要な重要品質側面を保持している、特に高電圧用途用の紙ブッシングの含浸のための費用対効果の高い系を提供することである。
本明細書で他にことわらなければ、本開示と結び付けて用いられる技術用語は当業者が通常理解する意味を有するものとする。さらに、状況により他の意味が必要とされなければ、単数の用語は複数を含むものとし、複数の用語は単数を含むものとする。
」及び「有する(has)」のような有する(having)のいずれかの形態)、「含む(including)」(並びに「含む(includes)」及び「含む(include)」のような含む(including)のいずれかの形態)又は「含む(containing)」(並びに「含む(contains)」及び含む(contain))のような含む(containing)のいずれかの形態)という用語は包括的又は非制限的であり、追加の挙げられていない要素又は方法段階を排除しない。
a)ビスフェノール-A-ジグリシジルエーテル(BADGE);BADGEと異なるポリグリシジルエーテル及び/又は脂環式エポキシ樹脂;N-グリシジル成分;ナノサイズ又は溶解可能強靭化剤;及びシラン成分を含む樹脂組成物並びに
b)メチルテトラヒドロフタル酸無水物(MTHPA)及び硬化剤組成物の100pbw当たり0.1ないし0.001pbwの量の少なくとも1種の硬化促進剤を含む硬化剤組成物
を含む特に紙ブッシングの含浸における使用のための硬化性混合物により解決される。
る。
それらはN,N-ビス(2-ヒドロキシエチル)-アニリン又はp,p’-ビス(2-ヒドロキシエチルアミノ)-ジフェニルメタンのような芳香環を有する。
反応生成物の脱塩化水素により得ることができる。これらのアミンはアニリン、ビス(4-アミノフェニル)メタン、m-キシレンジアミン又はビス(4-メチルアミノフェニル)メタンの場合がある。しかしながら、1,2-エポキシ基が異なる複素原子又は官能基に結合しているエポキシ樹脂を用いることも可能であり;それらの化合物の中に4-アミノフェノールのN,N,O-トリグリシジル誘導体又はサリチル酸のグリシジルエーテル-グリシジルエステルがある。
な硬化促進剤の場合がある。好ましくは、硬化促進剤はスルホニウム塩ではない。
1.Araldite(登録商標) MY 740樹脂:5.0-5.9eq/kgのエポキシ指数を有するBADGE
2.Aradur(登録商標) HY 1102硬化剤:MHHPA
3.Accelerator DY 062促進剤:ベンジルジメチルアミン
4.XB 5860:3-7重量%の4,4’-メチレン-ビス[N,N-ビス(2,3-エポキシプロピル)アニリン]を含むBADGEに基づく樹脂調製物
5.Aradur(登録商標) HY 1235硬化剤:HHPAとMHHPAの混合物
6.Araldite(登録商標) LY 556:5.30-5.45eq/kgのエポキシ指数を有するBADGE
7.Aradur(登録商標) HY 918-1硬化剤:ISO 12058に従って25℃において50-80mPasの粘度を有するMTHPAの種々の異性体の混合物
8.JEFFCAT(登録商標) ZF-10触媒:N,N,N’-トリメチル-N’-ヒドロキシ-エチル-ビスアミノエチルエーテル
9.Accelerator DY 067促進剤:2,4,6-トリス(ジメチルアミノメチル)フェノール
10.Flexibilizer DY 965強靭化剤:ポリウレタン及び4,4’-イソプロピリデン-ビス[2-アリルフェノール]に基づく強靭化剤
11.Araldite(登録商標) EPN 1138樹脂:5.5-5.7eq/kgのエポキシ指数を有するエポキシ-フェノール-ノボラック
12.Araldite(登録商標) CY 179-1樹脂:ビス-(エポキシシクロヘキシル)メチルカルボキシレート
13.Araldite(登録商標) MY 9512樹脂:N,N,N’,N’-テトラグリシジル-4,4’-メチレン-ビスベンゼンアミン
14.Araldite(登録商標) PY 302-2樹脂:5.65-5.90eq/kgのエポキシ指数を有するBADGE/BFDGEの混合物
15.Araldite(登録商標) GY 280樹脂:3.57-4.45eq/kgのエポキシ指数を有するビスフェノール-A-エポキシ樹脂
16.Genioperl(登録商標) W35:シリコーン及び有機ブロックを有するブロックコポリマー
17.Silquest A 187シラン:[(3-(2,3-エポキシプロポキシ)-プロピル]トリメトキシシラン
200gのAraldite(登録商標) MY 740樹脂を金属反応器中に入れた。次いで180gのAradur(登録商標) HY 1102及び0.1gのAccelerator DY 062促進剤を加えた。次いでアンカー撹拌機を用いて室温で約15分間成分を混合した。最後に混合物を真空に供し、すべて又は実質的にすべての泡を混合物から除去した。
200gのAraldite(登録商標) MY 740樹脂を金属反応器中に入れた。次いで170gのAradur(登録商標) HY 918-1硬化剤及び0.05gのAccelerator DY 062促進剤を加えた。次いでアンカー撹拌機を用いて室温で約15分間成分を混合した。最後に混合物を真空に供し、すべて又は実質的にすべての泡を混合物から除去した。
200gのXB 5860を金属反応器中に入れた。次いで170gのAradur(登録商標) HY 1235硬化剤を加えた。次いでアンカー撹拌機を用いて室温で約15分間成分を混合した。最後に混合物を真空に供し、すべて又は実質的にすべての泡を混合物から除去した。
60.450gのAraldite(登録商標) LY 556樹脂を90℃に加熱した。次いで3.9gのGenioperl(登録商標) W35を加え、混合物を90℃で30分間攪拌しながら樹脂中に溶解した。次いで混合物を60℃に冷ました。20gのAraldite(登録商標) EPN 1138樹脂、10gのAraldite(登録商標) CY 179-1樹脂及び5gのAraldite(登録商標) MY 9512樹脂を加え、すべてを一緒に60℃で5分間混合した。最後に0.65gのSilquest(商標) A 187シランを加え、10分間攪拌混入し、樹脂A-1を得た。
室温で5分間攪拌しながら99.2gのAradur(登録商標) HY 918-1硬化剤を0.8gのAccelerator DY 067促進剤と混合し、マスターバッチBを得た。
30gのAraldite(登録商標) GY 280樹脂(約60℃に予備加熱された)を加熱可能な混合容器中に入れた。次いで46.50gのAraldite(登録商標) PY 302-2樹脂、13.0gのAraldite(登録商標) CY 179-1樹脂、5.0gのAraldite(登録商標) MY 9512樹脂及び5gのFlexibilizer DY 965強靭化剤を加えた。最高で60℃まで加熱しながらすべての成分を10分間混合した。40℃に冷ました後、0.50gのSilques(商標) A 187シランを加え、10分間攪拌混入し、樹脂A-2を得た。
Ea=(ln((80℃におけるゲル化時間)/分)-ln((140℃におけるゲル化時間)/分))/(1/(80℃*1K/℃+273K)-1/(140℃*1K/℃+273K))*8.31J/(モル*K)/1000J/kJ
問題は解決されるが、毒性とみなされるAccelerator DY 062、Tgが遥かに低すぎる事実、機械的性質がまだ劣っている事実及び反応が比較実施例1におけるよりさらにもっと潜在性である(Ea=77.3kJ/モル)事実の故のこの系の問題がまだある。発熱実験における温度上昇は121.1℃までにも達する。
Claims (14)
- a)ビスフェノール-A-ジグリシジルエーテル(BADGE);BADGEと異なるポリグリシジルエーテル及び/又は脂環式エポキシ樹脂;N-グリシジル成分;ナノサイズの又は溶解可能な強靭化剤;及びシラン成分を含む樹脂組成物並びに
b)メチルテトラヒドロフタル酸無水物(MTHPA)及び硬化剤組成物の100pbw当たり0.1ないし0.001pbwの量で存在する少なくとも1種の硬化促進剤を含む硬化剤組成物
を含む、紙ブッシングの含浸における使用のための硬化性混合物であって、
100pbwの樹脂組成物当たりのpbwとしての、樹脂組成物の成分の比率は以下の通りであり:
30-75のBADGE;
20-50のBADGEと異なるポリジグリシジルエーテル及び/又は脂環式エポキシ樹脂;
2-10のN-グリシジル成分;
2-10のナノサイズの又は溶解可能な強靭剤化剤;
1-3のシラン成分;
0-3の他の成分、
100pbwの硬化剤組成物当たりのpbwとしての、硬化剤組成物の成分の比率は以下の通りであり:
99.9-99.999のMTHPA;
0.001-1.0の促進剤、
硬化剤組成物に対する樹脂組成物の比率は、硬化性混合物中の無水物基に対するエポキシの化学量論比に関して80ないし120%の範囲内である、
硬化性混合物。 - BADGEのISO 3001に従うエポキシ指数が3.5と5.9eq/kgの間の範囲内である請求項1に記載の硬化性混合物。
- BADGEのISO 3001に従うエポキシ指数が5.0と5.9eq/kgの間の範囲内である請求項2に記載の硬化性混合物。
- BADGEと異なるポリグリシジルエーテルがビスフェノール-F-ジグリシジルエーテル、2,2-ビス(4-ヒドロキシ-3-メチルフェニル)プロパン-ジグリシジルエーテル、ビスフェノール-E-ジグリシジルエーテル、2,2-ビス(4-ヒドロキシフェニル)ブタン-ジグリシジル-エーテル、ビス(4-ヒドロキシフェニル)-2,2-ジクロロ-エチレン、ビス(4-ヒドロキシフェニル)ジフェニル-メタン-ジグリシジルエーテル、9,9-ビス(4-ヒドロキシフェニル)-フルオレン-ジグリシジルエーテル、4,4’-シクロヘキシリデンビスフェノール-ジグリシジルエーテル、エポキシフェノールノボラック、エポキシクレゾールノボラック又はそれらの組み合わせから選ばれる請求項1ないし3のいずれかに記載の硬化性混合物。
- 脂環式エポキシ樹脂がビス-(エポキシシクロヘキシル)-メチルカルボキシレート又はヘキサヒドロフタル酸-ジグリシジルエステル、ビス(4-ヒドロキシシクロヘキシル)メタン-ジグリシジルエーテル、2,2-ビス(4-ヒドロキシシクロヘキシル)プロパン-ジグリシジルエーテル、テトラヒドロフタル酸-ジグリシジルエステル、4-メチルテトラヒドロフタル酸-ジグリシジルエステル、4-メチルヘキサヒドロフタル酸-ジグリシジルエステル又はそれらの組み合わせから選ばれる請求項1ないし4のいずれかに記載の硬化性混合物。
- N-グリシジル成分がN,N,N’,N’-テトラグリシジル-4,4’-メチレン-ビス-ベンゼンアミン、N,N,N’,N’-テトラグリシジル-3,3’-ジエチル-4,4’-ジアミノジフェニルメタン、4,4’-メチレン-ビス[N,N-ビス-(2,3-エポキシプロピル)アニリン]、2,6-ジメチル-N,N-ビス[(オキシラン-2-イル)メチル]アニリン又はそれらの組み合わせから選ばれる請求項1ないし5のいずれかに記載の硬化性混合物。
- ナノサイズの強靭化剤が(i)シリコーン及び有機ブロックを有するブロックコポリマー及び/又は(ii)エポキシ樹脂中のナノサイズのSiO2粒子から選ばれる請求項1ないし
6のいずれかに記載の硬化性混合物。 - 溶解可能な強靭化剤が(i)ポリウレタンと4,4’-イソプロピリデン-ビス[2-アリルフェノール]に基づく強靭化剤及び/又は(ii)官能基化ポリブタジエンから選ばれる請求項1ないし6のいずれかに記載の硬化性混合物。
- シラン成分が[3-(2,3-エポキシプロポキシ)-プロピル]トリメトキシシラン又は他のエポキシ官能基性若しくはアミン官能基性アルコキシシランである請求項1ないし8のいずれかに記載の硬化性混合物。
- 硬化剤組成物に対する樹脂組成物の比率が、硬化性混合物中の無水物基に対するエポキシの化学量論比に関して90ないし110%の範囲内である請求項1に記載の硬化性混合物。
- 硬化剤組成物に対する樹脂組成物の比率が、硬化性混合物中の無水物基に対するエポキシの化学量論比に関して95ないし105%の範囲内である請求項10に記載の硬化性混合物。
- 請求項1ないし11のいずれかに記載の硬化性混合物が含浸された紙ブッシング。
- 紙ブッシングが高電圧用途のためのブッシングである請求項12に記載の紙ブッシング。
- 高電圧用途のための紙ブッシングのための含浸系としての請求項1ないし11のいずれかに記載の硬化性混合物の使用。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009503169A (ja) | 2005-07-26 | 2009-01-29 | ハンツマン アドバンスト マテリアルズ (スイッツァランド) ゲーエムベーハー | 組成物 |
JP2010523747A (ja) | 2007-04-03 | 2010-07-15 | アーベーベー・リサーチ・リミテッド | 硬化性エポキシ樹脂組成物 |
US20130203897A1 (en) | 2010-02-03 | 2013-08-08 | Abb Research Ltd | Electrical insulation system |
JP2014518921A (ja) | 2011-05-13 | 2014-08-07 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271509A (en) | 1963-04-12 | 1966-09-06 | Westinghouse Electric Corp | Electrical insulation for condenser bushings and the like |
KR100193147B1 (ko) * | 1990-03-30 | 1999-06-15 | 월터클라웨인, 한느-피터 위트린 | 개질된 에폭시 수지 |
GB9927431D0 (en) * | 1999-11-22 | 2000-01-19 | Ciba Sc Holding Ag | Casting resin and process for the fabrication of resin molds |
ATE522912T1 (de) | 2005-12-14 | 2011-09-15 | Abb Research Ltd | Hochspannungsdurchführung |
JP2009543912A (ja) * | 2006-07-20 | 2009-12-10 | アーベーベー・リサーチ・リミテッド | 硬化性エポキシ樹脂組成物 |
CN102695739B (zh) * | 2009-08-27 | 2014-08-13 | Abb研究有限公司 | 可固化环氧树脂组合物 |
BR112014001465B1 (pt) * | 2011-07-29 | 2020-11-17 | Abb Schweiz Ag | Composiqao de resina de epoxi curavel, uso da composiqao de resina de epoxi curavel, artigo moldado na forma de um isolador eletrico, artigos eletricos e metodo de produzir uma composiqao de resina de epoxi curavel |
ITTO20111208A1 (it) | 2011-12-23 | 2013-06-24 | Bridgestone Corp | Mescola di gomma per pneumatici |
CN104271667B (zh) * | 2012-04-27 | 2018-01-26 | 陶氏环球技术有限责任公司 | 可固化环氧树脂组合物和由其制造的复合材料 |
EP3430630A1 (en) * | 2016-03-15 | 2019-01-23 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof |
CN106987094A (zh) * | 2017-04-01 | 2017-07-28 | 泰山体育产业集团有限公司 | 一种环氧树脂体系及其制备方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009503169A (ja) | 2005-07-26 | 2009-01-29 | ハンツマン アドバンスト マテリアルズ (スイッツァランド) ゲーエムベーハー | 組成物 |
JP2010523747A (ja) | 2007-04-03 | 2010-07-15 | アーベーベー・リサーチ・リミテッド | 硬化性エポキシ樹脂組成物 |
US20130203897A1 (en) | 2010-02-03 | 2013-08-08 | Abb Research Ltd | Electrical insulation system |
JP2014518921A (ja) | 2011-05-13 | 2014-08-07 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
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