MX2017016391A - Composicion de resina epoxica. - Google Patents

Composicion de resina epoxica.

Info

Publication number
MX2017016391A
MX2017016391A MX2017016391A MX2017016391A MX2017016391A MX 2017016391 A MX2017016391 A MX 2017016391A MX 2017016391 A MX2017016391 A MX 2017016391A MX 2017016391 A MX2017016391 A MX 2017016391A MX 2017016391 A MX2017016391 A MX 2017016391A
Authority
MX
Mexico
Prior art keywords
epoxy resin
resin composition
filler
composition
electrical
Prior art date
Application number
MX2017016391A
Other languages
English (en)
Inventor
Beisele Christian
Hollstein Werner
Riegger Andreas
Original Assignee
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh
Publication of MX2017016391A publication Critical patent/MX2017016391A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

Una composición que comprende (a) una resina epóxica polimerizable catiónicamente, (b) un iniciador térmico para la polimerización catiónica, (c) un material de relleno en microparticulas, y (d) un material de relleno en nanopartículas se puede utilizar para la producción de un material aislante térmicamente estable para componentes eléctricos y electrónicos.
MX2017016391A 2015-06-16 2016-06-03 Composicion de resina epoxica. MX2017016391A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15172296 2015-06-16
PCT/EP2016/062596 WO2016202608A1 (en) 2015-06-16 2016-06-03 Epoxy resin composition

Publications (1)

Publication Number Publication Date
MX2017016391A true MX2017016391A (es) 2018-03-02

Family

ID=53513943

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017016391A MX2017016391A (es) 2015-06-16 2016-06-03 Composicion de resina epoxica.

Country Status (14)

Country Link
US (2) US20180171101A1 (es)
EP (1) EP3310838B1 (es)
JP (1) JP6775534B2 (es)
KR (1) KR102579967B1 (es)
CN (1) CN108350150B (es)
CA (1) CA2988827C (es)
DK (1) DK3310838T3 (es)
ES (1) ES2887448T3 (es)
HU (1) HUE055541T2 (es)
MX (1) MX2017016391A (es)
MY (1) MY188498A (es)
PL (1) PL3310838T3 (es)
TW (1) TWI693255B (es)
WO (1) WO2016202608A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3460809A1 (de) * 2017-09-20 2019-03-27 Siemens Aktiengesellschaft Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine, isolationsstoff sowie isolationssystem daraus
JP6516115B1 (ja) * 2018-05-16 2019-05-22 山栄化学株式会社 溶解性・非溶解性粒子含有硬化性樹脂組成物
FI3953408T3 (fi) * 2019-04-11 2023-08-21 Huntsman Adv Mat Licensing Switzerland Gmbh Kovetettava kaksikomponenttinen hartsipohjainen järjestelmä
CN114316416B (zh) * 2019-06-20 2023-03-21 广西纵览线缆集团有限公司 低烟无卤阻燃低压电缆
CN112117042B (zh) * 2019-06-20 2021-10-29 广西纵览线缆集团有限公司 高负载耐热复合电缆
JPWO2022030252A1 (es) * 2020-08-07 2022-02-10
CN116685617A (zh) 2020-12-22 2023-09-01 亨斯迈先进材料许可(瑞士)有限公司 可固化的两部分树脂体系
WO2024083741A1 (en) 2022-10-18 2024-04-25 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Method to avoid cracks in encapsulation of sharp-edged inserts

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058401A (en) 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
JPS5214654A (en) * 1975-07-24 1977-02-03 Shin Etsu Chem Co Ltd An organopolysiloxane composition
IT1070929B (it) * 1975-11-14 1985-04-02 Carrier Corp Impianto di circolazione di alcool
US4336363A (en) 1979-02-12 1982-06-22 General Electric Company Heat curable compositions containing sulfonium salts
US4393185A (en) 1981-06-02 1983-07-12 Ciba-Geigy Corporation Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds
ES2045878T3 (es) 1989-01-16 1994-01-16 Ciba Geigy Ag Sales de sulfonio aralifaticas y su utilizacion.
JP3189988B2 (ja) * 1992-07-07 2001-07-16 住友ベークライト株式会社 絶縁樹脂ペースト
TW237466B (es) 1992-07-21 1995-01-01 Giba Gerigy Ag
DE59506324D1 (de) 1994-03-16 1999-08-12 Ciba Geigy Ag Ein-Komponenten-Epoxidharz-Systeme für das Träufelverfahren und Heisstauchrollierverfahren
DE59709744D1 (de) * 1996-06-17 2003-05-15 Vantico Ag Herstellung von Formkörpern aus einer Einkomponenten-Expoxidharzmischung mit Hilfe der automatischen Druckgeliertechnik
JP2007180044A (ja) * 1997-02-03 2007-07-12 Shin Etsu Chem Co Ltd ポリマー碍子の高電圧電気絶縁特性を改善する方法
US6214905B1 (en) * 1997-12-23 2001-04-10 Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. Epoxy mold compound and method
CN1309680A (zh) * 1998-07-15 2001-08-22 范蒂科股份公司 可热固化的环氧组合物
CA2351333A1 (en) * 1998-12-09 2000-06-15 Vantico Ag Hydrophobic epoxide resin system
JP3581268B2 (ja) * 1999-03-05 2004-10-27 株式会社東芝 ヒートシンク付半導体装置およびその製造方法
US6638567B1 (en) 1999-03-16 2003-10-28 Vantico, Inc. Hardenable composition with a particular combination of characteristics
US6764616B1 (en) * 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
EP1236765A1 (de) 2001-02-28 2002-09-04 hanse chemie GmbH Siliciumdioxiddispersion
US20050040562A1 (en) * 2003-08-19 2005-02-24 3D Systems Inc. Nanoparticle-filled stereolithographic resins
CN1938356B (zh) * 2004-03-30 2010-11-17 株式会社钟化 固化性组合物
CN101313024B (zh) * 2005-11-22 2012-10-10 亨斯迈先进材料（瑞士）有限公司 耐天候性环氧树脂体系
CN101384664B (zh) * 2006-02-17 2012-05-30 中国涂料株式会社 固化性有机聚硅氧烷组合物及防污复合涂膜
JP2008075069A (ja) * 2006-08-23 2008-04-03 Toshiba Corp 注型樹脂組成物およびそれを用いた絶縁材料、絶縁構造体
US8309633B2 (en) * 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
JP5756082B2 (ja) * 2009-04-02 2015-07-29 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー ダイレクトオーバーモールディング
CA2773667C (en) * 2009-10-21 2017-12-05 Huntsman Advanced Materials (Switzerland) Gmbh Thermosetting composition
DE102010015398A1 (de) * 2010-04-19 2011-10-20 Siemens Aktiengesellschaft Isolationsverbundmaterial zur elektrischen Isolation, Verfahren zur Herstellung und Verwendung desselben
EP3266815B1 (en) * 2013-11-05 2021-11-03 Covestro (Netherlands) B.V. Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication

Also Published As

Publication number Publication date
US20220135766A1 (en) 2022-05-05
DK3310838T3 (da) 2021-09-06
KR20180053600A (ko) 2018-05-23
PL3310838T3 (pl) 2022-01-10
US11926727B2 (en) 2024-03-12
KR102579967B1 (ko) 2023-09-20
US20180171101A1 (en) 2018-06-21
JP2018519386A (ja) 2018-07-19
HUE055541T2 (hu) 2021-12-28
TWI693255B (zh) 2020-05-11
TW201704334A (zh) 2017-02-01
CA2988827C (en) 2023-08-22
EP3310838A1 (en) 2018-04-25
ES2887448T3 (es) 2021-12-22
WO2016202608A1 (en) 2016-12-22
CN108350150B (zh) 2021-09-10
EP3310838B1 (en) 2021-08-18
JP6775534B2 (ja) 2020-10-28
CA2988827A1 (en) 2016-12-22
MY188498A (en) 2021-12-16
CN108350150A (zh) 2018-07-31

Similar Documents

Publication Publication Date Title
MX2017016391A (es) Composicion de resina epoxica.
MY176105A (en) Thermosetting resin composition, cured product obtained therefrom, and active ester resin for use therein
EP2966106A4 (en) EPOXY RESIN COMPOSITION, CURED PRODUCT, THERMAL RADIATION MATERIAL, AND ELECTRONIC ELEMENT
EP3128540A4 (en) Thermosetting resin composition, semiconductor device and electrical/electronic component
EP3162868A4 (en) Thermal base generator, thermosetting resin composition, cured film, cured film manufacturing method, and semiconductor device
MX2017006987A (es) Materiales de interfaz termica de alto rendimiento con baja impedancia termica.
PH12017500372A1 (en) Conductive adhesive composition
EP3524573A4 (en) AGGREGATED BORNITRIDE GRAIN, METHOD FOR THE PRODUCTION THEREOF AND HEAT-CONDUCTING RESIN COMPOSITION THEREFOR
EP3130643A4 (en) Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
EP3467044A4 (en) HEAT-CONDUCTIVE SILICONE COMPOSITION AND HARDENED PRODUCT THEREOF
EP3512318A4 (en) HEAT DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
EP3141583A4 (en) Thermally conductive silicone composition and electrical/electronic apparatus
MX2018002863A (es) Recubrimiento en polvo y metodo para producir un recubrimiento en polvo.
EP3228640A4 (en) Curable composition containing semiconductor nanoparticles, cured product, optical material and electronic material
PH12016501725A1 (en) A single crystal alumina filled die attach paste
EP3432316A4 (en) INSULATING RESIN MATERIAL, INSULATING RESIN MATERIAL ATTACHED TO METAL LAYER USING THE SAME, AND WIRING SUBSTRATE
EP3318605A4 (en) THERMOSETTING SILICONE RESIN COMPOSITION CONTAINING BORON NITRIDE, DISPERSANT FOR SILICONE RESIN COMPOSITIONS AND INORGANIC LOAD
EP3733594A4 (en) BORNITRIDE AGGLOMERATE, THIS THERMAL CURING RESIN COMPOSITION, AND USES THEREOF
EP3190144B8 (en) Epoxy-modified silicone resin, making method, curable composition, and electronic part
EP3020767A4 (en) Production method for electrically conductive cured article, electrically conductive cured article, curing method for pulsed light curing composition, and pulsed light curing composition
EP3530614A4 (en) SPHERICAL BORNITRIDE FINE POWDER, METHOD FOR THE PRODUCTION THEREOF AND HEAT-CONDUCTING RESIN COMPOSITION THEREFOR
EP3279261A4 (en) Resin composition, electroconductive resin composition, adhesive, electroconductive adhesive, paste for forming electrodes, and semiconductor device
SG11201801738TA (en) Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
MY189234A (en) Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device
BR112017028216A2 (pt) material compósito condutivo, e, método para fabricação de um material compósito condutivo