DE50014006D1 - Härtbare zusammensetzung mit besonderer eigenschaftskombination - Google Patents

Härtbare zusammensetzung mit besonderer eigenschaftskombination

Info

Publication number
DE50014006D1
DE50014006D1 DE50014006T DE50014006T DE50014006D1 DE 50014006 D1 DE50014006 D1 DE 50014006D1 DE 50014006 T DE50014006 T DE 50014006T DE 50014006 T DE50014006 T DE 50014006T DE 50014006 D1 DE50014006 D1 DE 50014006D1
Authority
DE
Germany
Prior art keywords
special property
hardenable composition
property combination
combination
hardenable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50014006T
Other languages
German (de)
English (en)
Inventor
Christian Beisele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Application granted granted Critical
Publication of DE50014006D1 publication Critical patent/DE50014006D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE50014006T 1999-03-16 2000-03-06 Härtbare zusammensetzung mit besonderer eigenschaftskombination Expired - Lifetime DE50014006D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH48599 1999-03-16
PCT/EP2000/001954 WO2000055254A1 (de) 1999-03-16 2000-03-06 Härtbare zusammensetzung mit besonderer eigenschaftskombination

Publications (1)

Publication Number Publication Date
DE50014006D1 true DE50014006D1 (de) 2007-03-15

Family

ID=4188093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50014006T Expired - Lifetime DE50014006D1 (de) 1999-03-16 2000-03-06 Härtbare zusammensetzung mit besonderer eigenschaftskombination

Country Status (7)

Country Link
US (1) US6638567B1 (enExample)
EP (1) EP1165688B1 (enExample)
JP (1) JP4798848B2 (enExample)
CA (1) CA2365510A1 (enExample)
DE (1) DE50014006D1 (enExample)
ES (1) ES2276676T3 (enExample)
WO (1) WO2000055254A1 (enExample)

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JP4319332B2 (ja) * 2000-06-29 2009-08-26 株式会社東芝 電気絶縁材料およびその製造方法
US20040039084A1 (en) * 2000-11-29 2004-02-26 Christian Beisele Filled epoxy resin system having high mechanical strength values
US20020111420A1 (en) * 2001-02-12 2002-08-15 International Business Machines Corporation Underfill compositions
JP2002338790A (ja) * 2001-05-22 2002-11-27 Nippon Kayaku Co Ltd 固着含浸用エポキシ樹脂組成物
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
DE60312143T2 (de) * 2003-06-16 2007-11-29 Abb Technology Ltd. Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
EP1905046B1 (fr) * 2005-07-20 2013-04-24 ALSTOM Technology Ltd Isolateur electrique et procede de fabrication.
US8202578B2 (en) 2005-11-15 2012-06-19 Valspar Sourcing, Inc. Crush resistant latex topcoat composition for fiber cement substrates
AU2006316667B2 (en) * 2005-11-22 2012-08-02 Huntsman Advanced Materials (Switzerland) Gmbh Weather-resistant epoxy resin system
WO2007090132A1 (en) 2006-01-31 2007-08-09 Valspar Sourcing, Inc. Method for coating a cement fiberboard article
EP1979293B1 (en) 2006-01-31 2013-03-06 Valspar Sourcing, Inc. Coating system for cement composite articles
US9783622B2 (en) 2006-01-31 2017-10-10 Axalta Coating Systems Ip Co., Llc Coating system for cement composite articles
WO2007089913A1 (en) 2006-01-31 2007-08-09 Valspar Sourcing, Inc. Coating system for cement composite articles
AU2007253690B2 (en) 2006-05-19 2012-07-12 Valspar Holdings I, Inc Coating system for cement composite articles
US7812090B2 (en) 2006-06-02 2010-10-12 Valspar Sourcing, Inc. High performance aqueous coating compositions
WO2007143622A1 (en) 2006-06-02 2007-12-13 Valspar Sourcing, Inc. High performance aqueous coating compositions
WO2008006109A1 (en) * 2006-07-07 2008-01-10 Valspar Sourcing, Inc. Coating systems for cement composite articles
EP2044138A1 (en) * 2006-07-20 2009-04-08 ABB Research Ltd Hardenable epoxy resin composition
US8202581B2 (en) 2007-02-16 2012-06-19 Valspar Sourcing, Inc. Treatment for cement composite articles
US20100096173A1 (en) * 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
ATE500596T1 (de) * 2007-10-08 2011-03-15 Abb Research Ltd Elektrisches polymerbeton-isolationssystem
US8278388B2 (en) 2008-01-28 2012-10-02 Kaneka Corporation Alicyclic epoxy resin composition, cured product thereof, production method thereof, and rubbery polymer-containing resin composition
CN101999151A (zh) * 2008-02-12 2011-03-30 Abb研究有限公司 表面改性的电绝缘系统
BRPI0917455B1 (pt) 2008-08-15 2018-11-21 Valspar Sourcing Inc composição de revestimento, método para preparar um artigo revestido, e, artigo revestido
KR20110043738A (ko) * 2008-09-19 2011-04-27 에이비비 리써치 리미티드 에폭시 수지 조성물
US9133064B2 (en) 2008-11-24 2015-09-15 Valspar Sourcing, Inc. Coating system for cement composite articles
PL2414444T3 (pl) 2009-04-02 2013-09-30 Huntsman Adv Mat Licensing Switzerland Gmbh Bezpośrednie przeformowanie
PL2427517T3 (pl) * 2009-05-05 2013-11-29 Huntsman Adv Mat Licensing Switzerland Gmbh Układ utwardzalny
US20140093736A1 (en) * 2011-03-31 2014-04-03 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and metal foil-clad laminate
CN107353586A (zh) * 2011-12-27 2017-11-17 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
WO2014062409A2 (en) * 2012-10-19 2014-04-24 Dow Global Technologies Llc Low odor epoxy resin systems based on nadic anhydride-type harneders
US20160280864A1 (en) * 2013-10-08 2016-09-29 Timothy A. Morley Low odor epoxy resin systems based on nadic anhydride-type hardeners
DE102013226705A1 (de) * 2013-12-19 2015-06-25 Siemens Aktiengesellschaft Durchschlag- und überschlagsichere Gießharzzusammensetzung
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
HUE055541T2 (hu) 2015-06-16 2021-12-28 Huntsman Adv Mat Licensing Switzerland Gmbh Epoxigyanta kompozit
CN104987662A (zh) * 2015-06-26 2015-10-21 苏州荣昌复合材料有限公司 一种热固性塑料的制备方法
HUE045364T2 (hu) * 2015-07-02 2019-12-30 Huntsman Adv Mat Licensing Switzerland Gmbh Szabadtéri tárgyak elõállítására alkalmas hõre keményedõ epoxigyanta készítmény és az ebbõl elõállított tárgyak
JP2020510283A (ja) * 2017-03-10 2020-04-02 スリーエム イノベイティブ プロパティズ カンパニー 電気絶縁材料
EP4516865A3 (en) * 2017-06-15 2025-05-28 PPG Coatings (kunshan) Co., Ltd. Intumescent coating composition
DE102017125177A1 (de) * 2017-10-26 2019-05-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Elektrisches Bauteil mit Isolationsschicht und Verfahren zu dessen Herstellung
KR102802243B1 (ko) 2018-03-16 2025-05-07 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 저장 안정성 조성물 및 경화성 수지 조성물
CN113242884B (zh) * 2018-10-29 2023-12-08 汉高股份有限及两合公司 导热封装组合物
US20220135862A1 (en) * 2019-04-11 2022-05-05 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable Two-Component Resin-Based System
WO2022136330A1 (en) 2020-12-22 2022-06-30 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable two-part resin system
CN120076913A (zh) 2022-10-18 2025-05-30 亨斯迈先进材料（瑞士）有限公司 在边缘尖锐的插件的封装中避免裂纹的方法
WO2026119737A1 (en) * 2024-12-05 2026-06-11 Huntsman Advanced Materials (Switzerland) Gmbh A two-part resin system for encapsulation of electrical components

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US3202947A (en) 1961-02-16 1965-08-24 Jefferson Electric Co Epoxy insulated transformer having tris-beta-chloroethylphosphate and hydrated alumina in the insulation
US4009141A (en) 1972-07-07 1977-02-22 General Electric Company Electrical insulating compositions of epoxy resins, zirconium silicate and alumina
JPS6030346B2 (ja) * 1978-01-06 1985-07-16 日立化成工業株式会社 フライバックトランス注型用エポキシ樹脂組成物
US4315085A (en) 1980-07-25 1982-02-09 Gaf Corporation Core-shell composite polymers having high amounts of carboxylic acid units in the shell
US4419496A (en) 1982-02-22 1983-12-06 The Dow Chemical Company Particle agglomeration in rubber latices
DE3239872A1 (de) 1982-10-27 1984-05-03 Siemens AG, 1000 Berlin und 8000 München Vergussmasse fuer elektronische bauelemente
JPH01197554A (ja) * 1988-02-02 1989-08-09 Toshiba Corp 難燃性樹脂組成物およびその製造法
FR2630578B1 (fr) * 1988-04-22 1990-07-27 France Transfo Sa Transformateur sec enrobe a comportement au feu ameliore et procede de preparation de sa resine d'enrobage
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JPH03115351A (ja) * 1989-09-28 1991-05-16 Toshiba Corp 難燃性エポキシ樹脂組成物
EP0578613B1 (de) * 1992-07-09 2000-07-12 Ciba SC Holding AG Härtbare Suspensionen auf Basis von Epoxidharzen
JP3186422B2 (ja) * 1993-05-14 2001-07-11 武田薬品工業株式会社 プラスチゾル
ES2151949T3 (es) * 1994-12-13 2001-01-16 Ciba Sc Holding Ag Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura.
KR100388141B1 (ko) 1995-07-10 2003-10-17 도레이 가부시끼가이샤 에폭시수지조성물
JPH0997729A (ja) * 1995-09-28 1997-04-08 Hitachi Ltd フライバックトランスおよびその製造方法
JP3861425B2 (ja) * 1997-12-22 2006-12-20 大日本インキ化学工業株式会社 加熱圧縮成形材料組成物、シートモールディングコンパウンド及びバルクモールディングコンパウンド

Also Published As

Publication number Publication date
JP4798848B2 (ja) 2011-10-19
WO2000055254A1 (de) 2000-09-21
CA2365510A1 (en) 2000-09-21
US6638567B1 (en) 2003-10-28
EP1165688B1 (de) 2007-01-24
JP2002539313A (ja) 2002-11-19
EP1165688A1 (de) 2002-01-02
ES2276676T3 (es) 2007-07-01

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Legal Events

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