DK3317318T3 - Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler - Google Patents

Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler Download PDF

Info

Publication number
DK3317318T3
DK3317318T3 DK16728949.5T DK16728949T DK3317318T3 DK 3317318 T3 DK3317318 T3 DK 3317318T3 DK 16728949 T DK16728949 T DK 16728949T DK 3317318 T3 DK3317318 T3 DK 3317318T3
Authority
DK
Denmark
Prior art keywords
articles
heat
resin composition
epoxy resin
curing epoxy
Prior art date
Application number
DK16728949.5T
Other languages
English (en)
Inventor
Christian Beisele
Zhijian Liu
Satoru Hishikawa
Original Assignee
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh
Application granted granted Critical
Publication of DK3317318T3 publication Critical patent/DK3317318T3/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Of Coils (AREA)
DK16728949.5T 2015-07-02 2016-06-14 Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler DK3317318T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2015083143 2015-07-02
PCT/EP2016/063556 WO2017001182A1 (en) 2015-07-02 2016-06-14 A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom

Publications (1)

Publication Number Publication Date
DK3317318T3 true DK3317318T3 (da) 2019-07-22

Family

ID=56121087

Family Applications (1)

Application Number Title Priority Date Filing Date
DK16728949.5T DK3317318T3 (da) 2015-07-02 2016-06-14 Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler

Country Status (14)

Country Link
US (1) US20180371153A1 (da)
EP (1) EP3317318B1 (da)
JP (1) JP6916747B2 (da)
KR (1) KR20180036690A (da)
CN (1) CN108026248B (da)
CA (1) CA2990505C (da)
DK (1) DK3317318T3 (da)
ES (1) ES2736398T3 (da)
HU (1) HUE045364T2 (da)
MX (1) MX2017016824A (da)
MY (1) MY184840A (da)
PL (1) PL3317318T3 (da)
TW (1) TWI693256B (da)
WO (1) WO2017001182A1 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3274390B1 (en) * 2015-03-26 2021-07-07 Huntsman Advanced Materials Licensing (Switzerland) GmbH A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom
DE102015213535A1 (de) * 2015-07-17 2017-01-19 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
ES2877512T3 (es) * 2016-07-12 2021-11-17 Abb Power Grids Switzerland Ag Uso de una composición de resina epoxi y producto eléctrico con composición de resina epoxi
CN112117042B (zh) * 2019-06-20 2021-10-29 广西纵览线缆集团有限公司 高负载耐热复合电缆
CN111454680A (zh) * 2019-10-17 2020-07-28 塔威新材料科技(上海)有限公司 一种可拆解热固化环氧胶粘剂组合物及其制备方法
CN111785461B (zh) * 2020-06-24 2022-02-11 常熟理工学院 一种高可靠性光纤复合绝缘子及其制备方法
KR102391224B1 (ko) * 2020-07-06 2022-04-29 주식회사 영창화학기계 부스덕트 몰딩용 몰타르 및 그 제조방법
WO2022210246A1 (ja) * 2021-03-29 2022-10-06 東レ株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及びそれを用いた被覆繊維強化樹脂成形品

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH476787A (de) 1965-07-10 1969-08-15 Ruetgerswerke Ag Verfahren zur Herstellung von lichtbogen- und kriechstrombeständigen Formkörpern oder Überzügen aus Kunstharzmassen
GB1144638A (en) 1966-07-29 1969-03-05 Ciba Ltd Improvements in or relating to electrical switchgear
US4058401A (en) 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4230814A (en) 1979-02-12 1980-10-28 General Electric Company Heat curable compositions
US4393185A (en) 1981-06-02 1983-07-12 Ciba-Geigy Corporation Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds
EP0379464B1 (de) 1989-01-16 1993-02-10 Ciba-Geigy Ag Araliphatische Sulfoniumsalze und deren Verwendung
US5106947A (en) * 1989-04-17 1992-04-21 Ciba-Geigy Corporation Curable composition based on cycloaliphatic epoxy resins
TW237466B (da) 1992-07-21 1995-01-01 Giba Gerigy Ag
DE59506324D1 (de) * 1994-03-16 1999-08-12 Ciba Geigy Ag Ein-Komponenten-Epoxidharz-Systeme für das Träufelverfahren und Heisstauchrollierverfahren
EP0717073B1 (de) * 1994-12-13 2000-10-11 Ciba SC Holding AG Core/Shell-Zähigkeitsvermittler enthaltende härtbare Epoxidharz-Giessmassen
ES2193341T3 (es) * 1996-06-17 2003-11-01 Vantico Ag Fabricacion de objetos moldeados de una composicion con un monocomponente de resina epoxi mediante la tecnica automatica de gelificacion a presion.
DE69905173T2 (de) 1998-07-15 2003-07-24 Vantico Ag, Basel Heisshärtbare epoxidzusammensetzungen
EP1165688B1 (de) * 1999-03-16 2007-01-24 Huntsman Advanced Materials (Switzerland) GmbH Härtbare zusammensetzung mit besonderer eigenschaftskombination
JP3986000B2 (ja) * 2002-02-21 2007-10-03 株式会社リコー インクジェットヘッド製造用エポキシ樹脂組成物及びインクジェットヘッド製造方法
JP5202052B2 (ja) * 2008-03-14 2013-06-05 旭化成株式会社 複合材料
JP5430345B2 (ja) * 2009-10-26 2014-02-26 Jsr株式会社 光学的立体造形用放射線硬化性液状樹脂組成物及びそれを光硬化させて得られる立体造形物
CA2835658C (en) * 2011-05-13 2020-01-28 Dow Global Technologies Llc Insulation formulations
JP6066211B2 (ja) * 2011-10-14 2017-01-25 エルジー・ケム・リミテッド 偏光板用接着剤、偏光板及び光学素子
KR101355855B1 (ko) * 2011-12-19 2014-01-29 제일모직주식회사 이방성 도전 필름

Also Published As

Publication number Publication date
EP3317318B1 (en) 2019-04-24
JP6916747B2 (ja) 2021-08-11
US20180371153A1 (en) 2018-12-27
PL3317318T3 (pl) 2020-04-30
ES2736398T3 (es) 2019-12-30
WO2017001182A1 (en) 2017-01-05
JP2018530628A (ja) 2018-10-18
CA2990505C (en) 2023-09-26
CN108026248B (zh) 2021-12-10
MX2017016824A (es) 2018-09-06
TW201704336A (zh) 2017-02-01
CN108026248A (zh) 2018-05-11
MY184840A (en) 2021-04-26
TWI693256B (zh) 2020-05-11
EP3317318A1 (en) 2018-05-09
KR20180036690A (ko) 2018-04-09
HUE045364T2 (hu) 2019-12-30
CA2990505A1 (en) 2017-01-05

Similar Documents

Publication Publication Date Title
TWI800019B (zh) 樹脂組成物
DK3317318T3 (da) Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler
PT3344677T (pt) Composição de resina epóxi de baixa emissão
EP3569653A4 (en) EPOXY RESIN COMPOSITION
DK3303395T3 (da) Anti-cd40-antistoffer og anvendelser deraf
ZA201704978B (en) Epoxy resin composition
PL2957584T3 (pl) Szybko utwardzane epoksydowe kompozycje klejące
DK3393655T3 (da) Fenfluramin-sammensætninger og fremgangsmåder til fremstilling af samme
HUE055552T2 (hu) Epoxigyanta készítmény és szerkezet
DK3310838T3 (da) Epoxyharpikssammensætning
DK3274390T3 (da) Termohærdende epoxyharpiks-sammensætning til fremstilling af udendørsartikler, og artiklerne tilvejebragt ud fra denne
EP3569627A4 (en) EPOXY RESIN COMPOSITION
EP3569626A4 (en) EPOXY RESIN COMPOSITION
MA42692A (fr) Compositions biopharmaceutiques
EP3660093A4 (en) EPOXY RESIN COMPOSITION
FR3042891B1 (fr) Puce electronique securisee
EP3569628A4 (en) EPOXY RESIN COMPOSITION
EP3683270A4 (en) EPOXY RESIN COMPOSITION
EP3275935A4 (en) Epoxy resin composition
EP3480238A4 (en) TWO COMPONENT TYPE EPOXY RESIN COMPOSITION
EP3569654A4 (en) EPOXY RESIN COMPOSITION
TWI799393B (zh) 樹脂組成物
DK3298061T3 (da) Hærdningsmiddel til varmehærdende epoxyharpikser og fremgangsmåde til fremstilling af isolationssystemer til elektroteknik
EP3406645A4 (en) epoxy resin
IL281713A (en) Epoxy resin preparation