PL3317318T3 - Kompozycja termoutwardzalnej żywicy epoksydowej do wytwarzania produktów zewnętrznych i produkty z niej otrzymane - Google Patents
Kompozycja termoutwardzalnej żywicy epoksydowej do wytwarzania produktów zewnętrznych i produkty z niej otrzymaneInfo
- Publication number
- PL3317318T3 PL3317318T3 PL16728949T PL16728949T PL3317318T3 PL 3317318 T3 PL3317318 T3 PL 3317318T3 PL 16728949 T PL16728949 T PL 16728949T PL 16728949 T PL16728949 T PL 16728949T PL 3317318 T3 PL3317318 T3 PL 3317318T3
- Authority
- PL
- Poland
- Prior art keywords
- articles
- preparation
- resin composition
- epoxy resin
- obtained therefrom
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Insulating Of Coils (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015083143 | 2015-07-02 | ||
| EP16728949.5A EP3317318B1 (en) | 2015-07-02 | 2016-06-14 | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
| PCT/EP2016/063556 WO2017001182A1 (en) | 2015-07-02 | 2016-06-14 | A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3317318T3 true PL3317318T3 (pl) | 2020-04-30 |
Family
ID=56121087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL16728949T PL3317318T3 (pl) | 2015-07-02 | 2016-06-14 | Kompozycja termoutwardzalnej żywicy epoksydowej do wytwarzania produktów zewnętrznych i produkty z niej otrzymane |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US20180371153A1 (pl) |
| EP (1) | EP3317318B1 (pl) |
| JP (1) | JP6916747B2 (pl) |
| KR (1) | KR20180036690A (pl) |
| CN (1) | CN108026248B (pl) |
| CA (1) | CA2990505C (pl) |
| DK (1) | DK3317318T3 (pl) |
| ES (1) | ES2736398T3 (pl) |
| HU (1) | HUE045364T2 (pl) |
| MX (1) | MX394662B (pl) |
| MY (1) | MY184840A (pl) |
| PL (1) | PL3317318T3 (pl) |
| TW (1) | TWI693256B (pl) |
| WO (1) | WO2017001182A1 (pl) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| HUE055642T2 (hu) * | 2015-03-26 | 2021-12-28 | Huntsman Adv Mat Licensing Switzerland Gmbh | Kültéri árucikkek készítésére szolgáló hõre keményedõ epoxigyanta kompozit, és az ebbõl készült árucikkek |
| DE102015213535A1 (de) * | 2015-07-17 | 2017-01-19 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
| CN109415496A (zh) * | 2016-07-12 | 2019-03-01 | Abb瑞士股份有限公司 | 环氧树脂组合物和具有环氧树脂组合物的电力产品的用途 |
| FR3091406B1 (fr) | 2018-12-31 | 2021-01-15 | Centre National De Recherche Scient Cnrs | Matériau pour l’isolation électrique et procédé de fabrication |
| CN114242318B (zh) * | 2019-06-20 | 2025-08-19 | 广西纵览线缆集团有限公司 | 隔热复合电缆 |
| CN111454680A (zh) * | 2019-10-17 | 2020-07-28 | 塔威新材料科技(上海)有限公司 | 一种可拆解热固化环氧胶粘剂组合物及其制备方法 |
| CN111785461B (zh) * | 2020-06-24 | 2022-02-11 | 常熟理工学院 | 一种高可靠性光纤复合绝缘子及其制备方法 |
| KR102391224B1 (ko) * | 2020-07-06 | 2022-04-29 | 주식회사 영창화학기계 | 부스덕트 몰딩용 몰타르 및 그 제조방법 |
| WO2022210246A1 (ja) * | 2021-03-29 | 2022-10-06 | 東レ株式会社 | エポキシ樹脂組成物、エポキシ樹脂硬化物及びそれを用いた被覆繊維強化樹脂成形品 |
| KR102796934B1 (ko) * | 2022-01-19 | 2025-04-18 | 주식회사 에프알에스아이 | 항균 성능을 갖는 방수 코팅 조성물 및 이를 이용한 친환경 항균성 방수 코팅막 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH476787A (de) | 1965-07-10 | 1969-08-15 | Ruetgerswerke Ag | Verfahren zur Herstellung von lichtbogen- und kriechstrombeständigen Formkörpern oder Überzügen aus Kunstharzmassen |
| GB1144638A (en) | 1966-07-29 | 1969-03-05 | Ciba Ltd | Improvements in or relating to electrical switchgear |
| US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
| US4230814A (en) | 1979-02-12 | 1980-10-28 | General Electric Company | Heat curable compositions |
| US4393185A (en) | 1981-06-02 | 1983-07-12 | Ciba-Geigy Corporation | Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds |
| EP0379464B1 (de) | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatische Sulfoniumsalze und deren Verwendung |
| US5106947A (en) * | 1989-04-17 | 1992-04-21 | Ciba-Geigy Corporation | Curable composition based on cycloaliphatic epoxy resins |
| TW237466B (pl) | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
| DE59506324D1 (de) * | 1994-03-16 | 1999-08-12 | Ciba Geigy Ag | Ein-Komponenten-Epoxidharz-Systeme für das Träufelverfahren und Heisstauchrollierverfahren |
| ES2151949T3 (es) * | 1994-12-13 | 2001-01-16 | Ciba Sc Holding Ag | Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura. |
| DE59709744D1 (de) * | 1996-06-17 | 2003-05-15 | Vantico Ag | Herstellung von Formkörpern aus einer Einkomponenten-Expoxidharzmischung mit Hilfe der automatischen Druckgeliertechnik |
| CA2337393A1 (en) | 1998-07-15 | 2000-01-27 | Carl Walter Mayer | Heat curable epoxy compositions |
| ES2276676T3 (es) * | 1999-03-16 | 2007-07-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Composicion endurecible con combinacion especial de propiedades. |
| JP3986000B2 (ja) * | 2002-02-21 | 2007-10-03 | 株式会社リコー | インクジェットヘッド製造用エポキシ樹脂組成物及びインクジェットヘッド製造方法 |
| JP5202052B2 (ja) * | 2008-03-14 | 2013-06-05 | 旭化成株式会社 | 複合材料 |
| JP5430345B2 (ja) * | 2009-10-26 | 2014-02-26 | Jsr株式会社 | 光学的立体造形用放射線硬化性液状樹脂組成物及びそれを光硬化させて得られる立体造形物 |
| EP2707412B1 (en) * | 2011-05-13 | 2016-01-06 | Dow Global Technologies LLC | Insulation formulations |
| CN103415584B (zh) * | 2011-10-14 | 2016-06-08 | Lg化学株式会社 | 用于偏振板的粘合剂和包括该粘合剂的偏振板 |
| KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
-
2016
- 2016-06-14 CA CA2990505A patent/CA2990505C/en active Active
- 2016-06-14 US US15/741,475 patent/US20180371153A1/en not_active Abandoned
- 2016-06-14 EP EP16728949.5A patent/EP3317318B1/en active Active
- 2016-06-14 MX MX2017016824A patent/MX394662B/es unknown
- 2016-06-14 WO PCT/EP2016/063556 patent/WO2017001182A1/en not_active Ceased
- 2016-06-14 MY MYPI2017001907A patent/MY184840A/en unknown
- 2016-06-14 DK DK16728949.5T patent/DK3317318T3/da active
- 2016-06-14 CN CN201680044954.XA patent/CN108026248B/zh active Active
- 2016-06-14 ES ES16728949T patent/ES2736398T3/es active Active
- 2016-06-14 PL PL16728949T patent/PL3317318T3/pl unknown
- 2016-06-14 KR KR1020187000095A patent/KR20180036690A/ko not_active Ceased
- 2016-06-14 HU HUE16728949A patent/HUE045364T2/hu unknown
- 2016-06-14 JP JP2017568319A patent/JP6916747B2/ja active Active
- 2016-06-30 TW TW105120750A patent/TWI693256B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| MX394662B (es) | 2025-03-24 |
| JP6916747B2 (ja) | 2021-08-11 |
| JP2018530628A (ja) | 2018-10-18 |
| HUE045364T2 (hu) | 2019-12-30 |
| EP3317318A1 (en) | 2018-05-09 |
| ES2736398T3 (es) | 2019-12-30 |
| TW201704336A (zh) | 2017-02-01 |
| US20180371153A1 (en) | 2018-12-27 |
| CA2990505C (en) | 2023-09-26 |
| WO2017001182A1 (en) | 2017-01-05 |
| CN108026248B (zh) | 2021-12-10 |
| DK3317318T3 (da) | 2019-07-22 |
| CN108026248A (zh) | 2018-05-11 |
| MX2017016824A (es) | 2018-09-06 |
| CA2990505A1 (en) | 2017-01-05 |
| MY184840A (en) | 2021-04-26 |
| TWI693256B (zh) | 2020-05-11 |
| KR20180036690A (ko) | 2018-04-09 |
| EP3317318B1 (en) | 2019-04-24 |
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