JP4728380B2 - ダイシング・ダイボンドフィルム及び半導体装置の製造方法 - Google Patents
ダイシング・ダイボンドフィルム及び半導体装置の製造方法 Download PDFInfo
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- JP4728380B2 JP4728380B2 JP2008301557A JP2008301557A JP4728380B2 JP 4728380 B2 JP4728380 B2 JP 4728380B2 JP 2008301557 A JP2008301557 A JP 2008301557A JP 2008301557 A JP2008301557 A JP 2008301557A JP 4728380 B2 JP4728380 B2 JP 4728380B2
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- sensitive adhesive
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- dicing
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- die
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Description
ダイシングフィルムは、粘着剤層が、下記のアクリル系ポリマーAと発泡剤とを含む熱膨張性粘着剤により形成され、且つ表面自由エネルギーが30mJ/m2以下である熱膨張性粘着剤層であり、
アクリルポリマーA:CH2=CHCOOR(式中、Rは炭素数が6〜10のアルキル基である)で表されるアクリル酸エステル50重量%以上と、ヒドロキシル基含有モノマー1重量%〜30重量%を含み且つカルボキシル基含有モノマーを含まないモノマー組成物によるアクリル系ポリマー
ダイボンドフィルムは、エポキシ樹脂を含む樹脂組成物により構成されていることを特徴とするダイシング・ダイボンドフィルムである。
(ダイシングフィルム)
(基材)
基材は、ダイシング・ダイボンドフィルムの強度母体となるものである。基材としては、例えば、低密度ポリエチレン、直鎖状ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、超低密度ポリエチレン、ランダム共重合ポリプロピレン、ブロック共重合ポリプロピレン、ホモポリプロレン、ポリブテン、ポリメチルペンテン等のポリオレフィン、エチレン−酢酸ビニル共重合体、アイオノマー樹脂、エチレン−(メタ)アクリル酸共重合体、エチレン−(メタ)アクリル酸エステル(ランダム、交互)共重合体、エチレン−ブテン共重合体、エチレン−ヘキセン共重合体、アクリル系樹脂、ポリウレタン、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリカーボネート、ポリイミド、ポリエーテルエーテルケトン、ポリイミド、ポリエーテルイミド、ポリアミド、全芳香族ポリアミド、ポリフェニルスルフイド、アラミド(紙)、ガラス、ガラスクロス、フッ素樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、ABS(アクリロニトリル−ブタジエン−スチレン共重合体)、セルロース系樹脂、シリコーン樹脂、金属(箔)、紙等が挙げられる。
熱膨張性粘着剤層は、粘着性を有しているとともに、熱膨張性とを有しており、熱膨張性粘着剤(組成物)により形成することができる。なお、熱膨張性粘着剤層に所定の熱処理を施すことにより、熱膨張性粘着剤層の形状変化が発生し、熱膨張性粘着剤層とダイボンドフィルムの粘着力が著しく低下し、該粘着力をほぼゼロにすることができ、優れたピックアップ性を付与することができる。
粘着剤(又は熱膨張性粘着剤)としては、ベースポリマー又はポリマー主成分として前記アクリルポリマーAを含んでいる粘着剤(又は熱膨張性粘着剤)を用いることが重要である。アクリルポリマーAは、主モノマー成分として、化学式CH2=CHCOOR(式中、Rは炭素数6〜10のアルキル基である)で表されるアクリル酸アルキルエステル(「アクリル酸C6−10アルキルエステル」と称する場合がある)が用いられている。なお、アクリル酸アルキルエステルにおいて、アルキル基の炭素数が6未満のアクリル酸アルキルエステルを主モノマー成分として用いると、剥離力が大きくなり過ぎてピックアップ性が低下する場合がある。一方、アルキル基の炭素数が10を超えるアクリル酸アルキルエステルを主モノマー成分として用いると、ダイボンドフィルムとの接着性又は密着性が低下し、その結果、ダイシングの際にチップ飛びが発生する場合がある。
γL=γL d+γL p (1b)
(1+cosθ)γL=2(γS dγL d)1/2+2(γS pγL p)1/2 (1c)
ただし、式(1a)〜(1c)中の各記号は、それぞれ以下の通りである。
・γS:粘着剤層(熱膨張性粘着剤層)の表面自由エネルギー(mJ/m2)
・γS d:粘着剤層(熱膨張性粘着剤層)の表面自由エネルギーにおける分散成分(mJ/m2)
・γS p:粘着剤層(熱膨張性粘着剤層)の表面自由エネルギーにおける極性成分(mJ/m2)
・γL:水又はヨウ化メチレンの表面自由エネルギー(mJ/m2)
・γL d:水又はヨウ化メチレンの表面自由エネルギーにおける分散成分(mJ/m2)
・γL p:水又はヨウ化メチレンの表面自由エネルギーにおける極性成分(mJ/m2)
また、熱膨張性粘着剤層の表面に対する水およびヨウ化メチレンの接触角の測定は、JIS Z 8703に記載されている試験場所(温度:23±2℃,湿度:50±5%RH)の環境下において、熱膨張性粘着剤層表面に、約1μLの水(蒸留水)またはヨウ化メチレンの液滴を滴下し、表面接触角計「CA−X」(FACE社製)を用いて、滴下30秒後に3点法より接触角を測定した。
本発明では、基材と熱膨張性粘着剤層の間に中間層が設けられていても良い。このような中間層としては、密着力の向上を目的とした下塗り剤のコーティング層などが挙げられる。また、下塗り剤のコーティング層以外の中間層としては、例えば、良好な変形性の付与を目的とした層、被着物(半導体ウェハなど)への接着面積の増大を目的とした層、接着力の向上を目的とした層、被着物(半導体ウェハなど)の表面形状に良好に追従させることを目的とした層、加熱による接着力低減の処理性の向上を目的とした層、加熱後の被着物(半導体ウエハなど)よりの剥離性の向上を目的とした層などが挙げられる。
ダイボンドフィルムは、該ダイボンドフィルム上に圧着されている半導体ウエハの加工(例えば、チップ状に切断する切断加工など)の際には、半導体ウエハに密着して支持し、半導体ウエハの加工体(例えば、チップ状に切断加工される半導体チップなど)をマウントする際には、該半導体ウエハの加工体と、各種キャリアとの接着層として作用する機能を有していることが重要である。特に、ダイボンドフィルムとしては、半導体ウエハの加工(例えば、切断加工などの加工)の際に、切断片を飛散させない接着性を有していることが重要である。
本発明のダイシング・ダイボンドフィルムの製造方法について、ダイシング・ダイボンドフィルム10を例にして説明する。先ず、基材1aは、従来公知の製膜方法により製膜することができる。当該製膜方法としては、例えばカレンダー製膜法、有機溶媒中でのキャスティング法、密閉系でのインフレーション押出法、Tダイ押出法、共押出し法、ドライラミネート法等が例示できる。
半導体ウェハ(半導体ウエハ)としては、公知乃至慣用の半導体ウェハであれば特に制限されず、各種素材の半導体ウェハから適宜選択して用いることができる。本発明では、半導体ウェハとしては、シリコンウエハを好適に用いることができる。
本発明の半導体装置の製造方法は、前記ダイシング・ダイボンドフィルムを用いた半導体装置の製造方法であれば特に制限されない。例えば、本発明のダイシング・ダイボンドフィルムを、ダイボンドフィルム上に任意に設けられたセパレータを適宜に剥離して、次の様に使用することにより、半導体装置を製造することができる。なお、以下では、図3を参照しながらダイシング・ダイボンドフィルム11を用いた場合を例にして説明する。先ず、ダイシング・ダイボンドフィルム11におけるダイボンドフィルム31上に半導体ウェハ4を圧着し、これを接着保持させて固定する(マウント工程)。本工程は、圧着ロール等の押圧手段により押圧しながら行う。
<ダイシングフィルムの作製>
冷却管、窒素導入管、温度計および撹拌装置を備えた反応容器に、アクリル酸2−エチルヘキシル(「2EHA」と称する場合がある):95部、アクリル酸−2−ヒドロキシエチル(「HEA」と称する場合がある):5部及びトルエン:65部を入れ、窒素気流中で61℃にて6時間重合処理をしてアクリル系ポリマーXを得た。
アクリル酸エチル−メチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(商品名「パラクロンW−197CM」根上工業株式会社製):100部に対して、エポキシ樹脂1(商品名「エピコート1004」ジャパンエポキシレジン(JER)株式会社製):59部、エポキシ樹脂2(商品名「エピコート827」ジャパンエポキシレジン(JER)株式会社製):53部、フェノール樹脂(商品名「ミレックスXLC−4L」三井化学株式会社製):121部、球状シリカ(商品名「SO−25R」株式会社アドマテックス製):222部をメチルエチルケトンに溶解して、固形分の濃度が23.6重量%となる接着剤組成物の溶液を調製した。
<ダイボンドフィルムの作製>
アクリル酸エチル−メチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(商品名「パラクロンW−197CM」根上工業株式会社製):100部に対して、エポキシ樹脂1(商品名「エピコート1004」JER株式会社製):102部、エポキシ樹脂2(商品名「エピコート827」JER株式会社製):13部、フェノール樹脂(商品名「ミレックスXLC−4L」三井化学株式会社製):119部、球状シリカ(商品名「SO−25R」株式会社アドマテックス製):222部をメチルエチルケトンに溶解して、固形分の濃度が23.6重量%となる接着剤組成物の溶液を調製した。
各実施例3〜4については、ダイシングフィルムAを、表1に示す組成及び含有量によるダイシングフィルムに変更したこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
各比較例1〜5については、ダイシングフィルムAを、表1に示す組成及び含有量によるダイシングフィルムに変更したこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
比較例6については、ダイシングフィルムの粘着剤に、テルペンフェノール系樹脂(商品名「PR−12603」住友ベークライト株式会社製):20部を加えたこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
BA:アクリル酸n−ブチル
AA:アクリル酸
HEA:2−ヒドロキシエチルアクリレート
C/L:ポリイソシアネート化合物(商品名「コロネートL」日本ポリウレタン工業株式会社製)
スミライト:テルペンフェノール系樹脂(商品名「PR−12603」住友ベークライト株式会社製)
(評価)
実施例1〜9及び比較例1〜4に係るダイシング・ダイボンドフィルムについて、ダイシングフィルム中の粘着剤層の表面自由エネルギー、ダイシングフィルム中の粘着剤層に関する弾性率、ダイボンドフィルムの弾性率、ダイボンドフィルムの弾性率/ダイシングフィルム中の粘着剤層に関する弾性率(T0+20℃)、ダイシング性、ピックアップ性を、下記の評価又は測定方法により評価又は測定した。評価又は測定結果は表1に併記した。
JIS Z 8703に記載されている試験場所(温度:23±2℃,湿度:50±5%RH)の環境下において、ダイシングフィルム中の粘着剤層(熱膨張性粘着剤層(実施例1〜4、比較例1〜4、比較例6)の場合は、熱膨張前の熱膨張性粘着剤層)の表面に、約1μLの水(蒸留水)またはヨウ化メチレンの液滴を滴下し、表面接触角計「CA−X」(FACE社製)を用いて、滴下30秒後に3点法より接触角[θ(rad)]を測定した。得られた2つの接触角と、水、ヨウ化メチレンの表面自由エネルギー値として文献より既知である値と、下記の式(1a)〜(1c)とを利用して得られる二つの式を連立一次方程式として解くことにより、ダイシングフィルム中の熱膨張性粘着剤層の表面自由エネルギー(γS)を算出した。
γL=γL d+γL p (1b)
(1+cosθ)γL=2(γS dγL d)1/2+2(γS pγL p)1/2 (1c)
ただし、式(1a)〜(1c)中の各記号は、それぞれ以下の通りである。
・γS:粘着剤層の表面自由エネルギー(mJ/m2)
・γS d:粘着剤層の表面自由エネルギーにおける分散成分(mJ/m2)
・γS p:粘着剤層の表面自由エネルギーにおける極性成分(mJ/m2)
・γL:水又はヨウ化メチレンの表面自由エネルギー(mJ/m2)
・γL d:水又はヨウ化メチレンの表面自由エネルギーにおける分散成分(mJ/m2)
・γL p:水又はヨウ化メチレンの表面自由エネルギーにおける極性成分(mJ/m2)
・水(蒸留水)の表面自由エネルギー値として既知である値:[分散成分(γL d):21.8(mJ/m2)、極性成分(γL p):51.0(mJ/m2)]
・ヨウ化メチレンの表面自由エネルギー値として既知である値:[分散成分(γL d):49.5(mJ/m2)、極性成分(γL p):1.3(mJ/m2)]
<ダイシングフィルムの粘着剤層の弾性率の測定方法>
ダイシングフィルム中の粘着剤層に関する弾性率は、発泡剤を含有していないこと以外は同様の粘着剤層(サンプル)を作製して評価又は測定を行った。弾性率の測定は、レオメトリック社製の動的粘弾性測定装置「ARES」を用いて、サンプル厚さ:約1.5mmで、φ7.9mmパラレルプレート[素材:ステンレス(SUS316)]の治具を用い、剪断モードにて、周波数:1Hz、昇温速度:5℃/分、歪み:0.1%(23℃)、0.3%(150℃)にて測定し、23℃および150℃で得られた剪断貯蔵弾性率G´の値とした。
ダイボンドフィルムの弾性率は、ダイシングフィルムに積層させずに、ダイボンドフィルムを作製し、レオメトリック社製の動的粘弾性測定装置「Solid Analyzer RS A2」を用いて、引張モードにて、サンプル幅:10mm、サンプル長さ:22.5mm、サンプル厚さ:0.2mmで、周波数:1Hz、昇温速度:10℃/分、窒素雰囲気下、所定の温度(T0℃、T0+20℃)にて測定し、得られた引張貯蔵弾性率E´の値とした。
ダイボンドフィルムの弾性率/ダイシングフィルム中の粘着剤層の弾性率(T0+20℃)は、前記の<ダイシングフィルムの粘着剤層の弾性率の測定方法>や、<ダイボンドフィルムの弾性率の測定方法>にて評価又は測定して得られた「(T0+20℃)におけるダイボンドフィルムの弾性率」と、「(T0+20℃)におけるダイシングフィルム中の粘着剤層の弾性率」より計算して算出した。
実施例及び比較例のそれぞれのダイシング・ダイボンドフィルムを用いて、以下の要領で、実際に半導体ウェハのダイシングを行ってダイシング性を評価し、その後に剥離性の評価を行い、各ダイシング・ダイボンドフィルムのダイシング性能とピックアップ性能を評価とした。
研削装置:商品名「DFG−8560」ディスコ社製
半導体ウェハ:8インチ径(厚さ0.6mmから0.025mmに裏面研削)
(貼り合わせ条件)
貼り付け装置:商品名「MA−3000II」日東精機株式会社製
貼り付け速度計:10mm/min
貼り付け圧力:0.15MPa
貼り付け時のステージ温度:40℃
(ダイシング条件)
ダイシング装置:商品名「DFD−6361」ディスコ社製
ダイシングリング:「2−8−1」(ディスコ社製)
ダイシング速度:30mm/sec
ダイシングブレード:
Z1;ディスコ社製「NBC−ZH226J27HAAA」
ダイシングブレード回転数:
Z1;30,000rpm
カット方式:シングルステップカット
ウェハチップサイズ:10.0mm角
このダイシングで、ミラーウェハ(ワーク)が剥離せずにダイシング・ダイボンドフィルムにしっかりと保持され、ダイシングを良好に行うことができたどうかを確認し、ダイシングを良好に行うことができた場合を「○」とし、ダイシングを良好に行うことができなかった場合を「×」として、ダイシング性を評価した。
1a 基材
1b 熱膨張性粘着剤層
2 ダイシングフィルム
3,31 ダイボンドフィルム
4 半導体ウェハ
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
9 スペーサ
Claims (4)
- 基材上に粘着剤層を有するダイシングフィルムと、前記粘着剤層上に設けられたダイボンドフィルムとを有するダイシング・ダイボンドフィルムであって、
ダイシングフィルムは、粘着剤層が、下記のアクリル系ポリマーAと発泡剤とを含む熱膨張性粘着剤により形成され、且つ表面自由エネルギーが30mJ/m2以下である熱膨張性粘着剤層であり、
アクリルポリマーA:CH2=CHCOOR(式中、Rは炭素数が6〜10のアルキル基である)で表されるアクリル酸エステル50重量%以上と、ヒドロキシル基含有モノマー1重量%〜30重量%を含み且つカルボキシル基含有モノマーを含まないモノマー組成物によるアクリル系ポリマー
ダイボンドフィルムは、エポキシ樹脂を含む樹脂組成物により構成されていることを特徴とするダイシング・ダイボンドフィルム。 - 前記発泡剤が、熱膨張性微小球である請求項1記載のダイシング・ダイボンドフィルム。
- 前記ダイシングフィルムの熱膨張性粘着剤層が、23℃〜150℃における弾性率が5×104Pa〜1×106Paである粘着剤層を形成可能な粘着剤と、発泡剤とを含む熱膨張性粘着剤により形成されており、前記ダイボンドフィルムの弾性率が、前記ダイシングフィルムの熱膨張性粘着剤層の発泡開始温度(T0)〜T0+20℃において1×105Pa〜1×1010Paであることを特徴とする請求項1又は2記載のダイシング・ダイボンドフィルム。
- ダイシング・ダイボンドフィルムを用いた半導体装置の製造方法であって、ダイシング・ダイボンドフィルムとして、請求項1〜3の何れか1項に記載のダイシング・ダイボンドフィルムを用いたことを特徴とする半導体装置の製造方法。
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CN110690125A (zh) * | 2019-09-10 | 2020-01-14 | 广东芯华微电子技术有限公司 | 一种foplp晶圆整体封装方法 |
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US4961804A (en) * | 1983-08-03 | 1990-10-09 | Investment Holding Corporation | Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same |
JPH03268345A (ja) * | 1990-03-16 | 1991-11-29 | Nitto Denko Corp | ダイ接着用シート及び半導体チップ固着キャリアの製造方法 |
JP2001226650A (ja) * | 2000-02-16 | 2001-08-21 | Nitto Denko Corp | 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
JP4651799B2 (ja) * | 2000-10-18 | 2011-03-16 | 日東電工株式会社 | エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
JP2004221336A (ja) * | 2003-01-15 | 2004-08-05 | Hitachi Chem Co Ltd | ダイボンドダイシング一体型フィルム |
JP4275522B2 (ja) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2006303472A (ja) * | 2005-03-23 | 2006-11-02 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
US20100019365A1 (en) * | 2006-09-12 | 2010-01-28 | Nitto Denko Corporation | Dicing/die bonding film |
KR100773634B1 (ko) * | 2006-10-26 | 2007-11-05 | 제일모직주식회사 | 아크릴 바인더 수지조성물를 포함하는 광경화형 점착조성물및 이를 이용한 점착테이프 |
JP2010053346A (ja) * | 2008-07-31 | 2010-03-11 | Nitto Denko Corp | 再剥離型粘着剤及び再剥離型粘着シート |
JP5519971B2 (ja) * | 2008-11-26 | 2014-06-11 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010129700A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010129699A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP4810565B2 (ja) * | 2008-11-26 | 2011-11-09 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
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TW201030118A (en) | 2010-08-16 |
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KR20100059734A (ko) | 2010-06-04 |
US20100129987A1 (en) | 2010-05-27 |
CN101740351A (zh) | 2010-06-16 |
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