JP4721743B2 - 半導体ブロックの保持装置 - Google Patents

半導体ブロックの保持装置 Download PDF

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Publication number
JP4721743B2
JP4721743B2 JP2005095386A JP2005095386A JP4721743B2 JP 4721743 B2 JP4721743 B2 JP 4721743B2 JP 2005095386 A JP2005095386 A JP 2005095386A JP 2005095386 A JP2005095386 A JP 2005095386A JP 4721743 B2 JP4721743 B2 JP 4721743B2
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JP
Japan
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adhesive
semiconductor
slice base
semiconductor block
block
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Expired - Lifetime
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JP2005095386A
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English (en)
Japanese (ja)
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JP2006272756A5 (enExample
JP2006272756A (ja
Inventor
聡 川村
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Kyocera Corp
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Kyocera Corp
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Priority to JP2005095386A priority Critical patent/JP4721743B2/ja
Publication of JP2006272756A publication Critical patent/JP2006272756A/ja
Publication of JP2006272756A5 publication Critical patent/JP2006272756A5/ja
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Publication of JP4721743B2 publication Critical patent/JP4721743B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005095386A 2005-03-29 2005-03-29 半導体ブロックの保持装置 Expired - Lifetime JP4721743B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005095386A JP4721743B2 (ja) 2005-03-29 2005-03-29 半導体ブロックの保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005095386A JP4721743B2 (ja) 2005-03-29 2005-03-29 半導体ブロックの保持装置

Publications (3)

Publication Number Publication Date
JP2006272756A JP2006272756A (ja) 2006-10-12
JP2006272756A5 JP2006272756A5 (enExample) 2008-02-07
JP4721743B2 true JP4721743B2 (ja) 2011-07-13

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ID=37207961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005095386A Expired - Lifetime JP4721743B2 (ja) 2005-03-29 2005-03-29 半導体ブロックの保持装置

Country Status (1)

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JP (1) JP4721743B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884246B1 (ko) * 2007-08-24 2009-02-17 주식회사 다우빔 실리콘 인고트 절단용 받침대
JP2009090416A (ja) * 2007-10-10 2009-04-30 Dainippon Printing Co Ltd メンブレン構造体の製造方法
JP5117880B2 (ja) * 2008-02-21 2013-01-16 セイコーインスツル株式会社 ウエハの作製方法
ATE500940T1 (de) * 2008-04-23 2011-03-15 Applied Materials Switzerland Sa Montierscheibe für eine drahtsägevorrichtung, drahtsägevorrichtung damit, und drahtsägeverfahren, das mit der vorrichtung durchgeführt wird
JP5196604B2 (ja) * 2008-06-19 2013-05-15 信濃電気製錬株式会社 インゴットスライシング用フレットバーを用いたインゴットの切断方法及び該フレットバーを貼着したインゴット
JP5348746B2 (ja) * 2008-11-17 2013-11-20 株式会社パイロットコーポレーション 歯列矯正用ブラケット
KR101078178B1 (ko) 2008-12-10 2011-10-28 주식회사 엘지실트론 잉곳 지지유닛 및 이를 포함하는 잉곳절단장치
JP5495981B2 (ja) * 2010-06-29 2014-05-21 京セラ株式会社 半導体基板の製造方法
KR200464626Y1 (ko) * 2011-01-21 2013-01-21 주식회사 넥솔론 기판 블록 고정장치
US10731016B2 (en) 2016-07-18 2020-08-04 Conopco, Inc. Method of modifying the dispensing properties of a container
CN117103474A (zh) * 2023-09-07 2023-11-24 常州时创能源股份有限公司 一种半片切割工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819387A (en) * 1987-12-16 1989-04-11 Motorola, Inc. Method of slicing semiconductor crystal
JP3351053B2 (ja) * 1993-10-19 2002-11-25 株式会社豊田自動織機 電子部品
JPH09155855A (ja) * 1995-12-06 1997-06-17 Sony Corp 単結晶加工用貼付台及び単結晶の加工方法
JP4325889B2 (ja) * 1999-07-13 2009-09-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの積層治具および半導体ウェハの製造方法
JP4361658B2 (ja) * 2000-02-14 2009-11-11 富士通マイクロエレクトロニクス株式会社 実装基板及び実装方法
JP2004082282A (ja) * 2002-08-27 2004-03-18 Kyocera Corp 半導体ブロックのスライス方法
JP2004114503A (ja) * 2002-09-26 2004-04-15 Kyocera Corp インゴットの切断方法
JP4388362B2 (ja) * 2003-12-22 2009-12-24 京セラ株式会社 半導体インゴットの切断方法

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Publication number Publication date
JP2006272756A (ja) 2006-10-12

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