JP4719639B2 - 設定装置及びプログラム - Google Patents

設定装置及びプログラム Download PDF

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Publication number
JP4719639B2
JP4719639B2 JP2006187533A JP2006187533A JP4719639B2 JP 4719639 B2 JP4719639 B2 JP 4719639B2 JP 2006187533 A JP2006187533 A JP 2006187533A JP 2006187533 A JP2006187533 A JP 2006187533A JP 4719639 B2 JP4719639 B2 JP 4719639B2
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JP
Japan
Prior art keywords
mounting
component
information
angle
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006187533A
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English (en)
Japanese (ja)
Other versions
JP2008016695A (ja
JP2008016695A5 (enExample
Inventor
崇文 智田
アティラ レンゲェル
健 五十嵐
晴彦 山口
学 岡本
弘一 泉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Priority to JP2006187533A priority Critical patent/JP4719639B2/ja
Priority to EP07013206A priority patent/EP1876878A1/en
Priority to US11/773,836 priority patent/US7885723B2/en
Priority to CN2007101282363A priority patent/CN101115383B/zh
Priority to KR1020070068051A priority patent/KR100890661B1/ko
Publication of JP2008016695A publication Critical patent/JP2008016695A/ja
Publication of JP2008016695A5 publication Critical patent/JP2008016695A5/ja
Application granted granted Critical
Publication of JP4719639B2 publication Critical patent/JP4719639B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2006187533A 2006-07-07 2006-07-07 設定装置及びプログラム Active JP4719639B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006187533A JP4719639B2 (ja) 2006-07-07 2006-07-07 設定装置及びプログラム
EP07013206A EP1876878A1 (en) 2006-07-07 2007-07-05 Setting device, component mounting sytem, program and calculating method
US11/773,836 US7885723B2 (en) 2006-07-07 2007-07-05 Setting device, component mounting system, program and calculating method
CN2007101282363A CN101115383B (zh) 2006-07-07 2007-07-05 设定装置、部件安装系统、程序以及计算方法
KR1020070068051A KR100890661B1 (ko) 2006-07-07 2007-07-06 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006187533A JP4719639B2 (ja) 2006-07-07 2006-07-07 設定装置及びプログラム

Publications (3)

Publication Number Publication Date
JP2008016695A JP2008016695A (ja) 2008-01-24
JP2008016695A5 JP2008016695A5 (enExample) 2009-04-02
JP4719639B2 true JP4719639B2 (ja) 2011-07-06

Family

ID=38535365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006187533A Active JP4719639B2 (ja) 2006-07-07 2006-07-07 設定装置及びプログラム

Country Status (5)

Country Link
US (1) US7885723B2 (enExample)
EP (1) EP1876878A1 (enExample)
JP (1) JP4719639B2 (enExample)
KR (1) KR100890661B1 (enExample)
CN (1) CN101115383B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7899561B2 (en) * 2004-12-15 2011-03-01 Panasonic Corporation Operating time reducing method, operating time reducing apparatus, program and component mounter
JP5074334B2 (ja) * 2008-09-22 2012-11-14 株式会社日立ハイテクインスツルメンツ 部品装着装置、部品装着設定算出装置、プログラム及び部品装着設定算出方法
JP5528193B2 (ja) * 2010-04-30 2014-06-25 株式会社日立ハイテクインスツルメンツ 部品実装装置およびその生産スループット低下原因特定方法
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
JP5662839B2 (ja) * 2011-02-25 2015-02-04 Juki株式会社 電子部品実装装置及び電子部品実装方法
JP5687948B2 (ja) * 2011-04-21 2015-03-25 富士機械製造株式会社 電子部品実装機
CN103635073A (zh) * 2012-08-26 2014-03-12 赵盾 一种自动贴附装置
JP5641084B2 (ja) * 2013-03-18 2014-12-17 株式会社安川電機 ロボットシステムおよび被加工物の製造方法
USD757369S1 (en) 2014-09-14 2016-05-24 Matthew E. Marsden Structure for attracting and accumulating aquatic organisms
US9681645B2 (en) 2014-10-14 2017-06-20 Matthew E Marsden Structure for attracting and accumulating aquatic organisms

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112387A (ja) * 1981-12-26 1983-07-04 池上通信機株式会社 電子部品のプリント基板への自動插入装置
US5020964A (en) * 1989-11-27 1991-06-04 Ford Motor Company Method and apparatus for robotic transfer of workpieces
JP3419893B2 (ja) 1994-07-15 2003-06-23 松下電器産業株式会社 部品実装方法
JPH09204454A (ja) * 1996-01-26 1997-08-05 Matsushita Electric Ind Co Ltd 部品電子カタログ
KR100284782B1 (ko) * 1996-01-26 2001-04-02 모리시타 요이찌 실장데이터 작성방법 및 장치, 이에 이용되는 저장매체 그리고 이를 이용한 부품실장 방법 및 장치
JP3472404B2 (ja) * 1996-03-15 2003-12-02 富士機械製造株式会社 電子部品供給装置
JP3744066B2 (ja) * 1996-07-30 2006-02-08 松下電器産業株式会社 電子部品実装方法
JP3784935B2 (ja) 1997-08-12 2006-06-14 山形カシオ株式会社 電子部品の装着方法及び装置
JPH11103199A (ja) * 1997-09-29 1999-04-13 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2000259250A (ja) 1999-03-04 2000-09-22 Yamagata Casio Co Ltd 部品搭載装置
JP3638233B2 (ja) 1999-09-14 2005-04-13 松下電器産業株式会社 電子部品実装装置における電子部品実装順序最適化方法、電子部品実装順序最適化装置、上記電子部品実装順序最適化プログラムを記録した、コンピュータ読取可能な記録媒体、及び電子部品実装装置
JP2001102794A (ja) * 1999-10-01 2001-04-13 Matsushita Electric Ind Co Ltd 部品装着方法及びその装置
US6260261B1 (en) * 1999-10-29 2001-07-17 Universal Instruments Corporation Straddle-mount assembly tool and method
CN1258962C (zh) * 2000-08-04 2006-06-07 松下电器产业株式会社 用于优化元件安装顺序的方法,采用该方法的装置及组装机器
EP1319327A2 (en) * 2000-09-19 2003-06-18 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
US6999835B2 (en) * 2001-07-23 2006-02-14 Fuji Machine Mfg. Co., Ltd. Circuit-substrate working system and electronic-circuit fabricating process
JP3934002B2 (ja) * 2002-07-23 2007-06-20 松下電器産業株式会社 部品実装順序最適化方法、部品実装順序最適化プログラム、及び部品実装装置
KR101113838B1 (ko) * 2004-11-30 2012-02-29 삼성테크윈 주식회사 전자부품 실장 방법 및 이를 채택한 부품 실장기

Also Published As

Publication number Publication date
KR20080005137A (ko) 2008-01-10
CN101115383B (zh) 2011-10-26
CN101115383A (zh) 2008-01-30
JP2008016695A (ja) 2008-01-24
KR100890661B1 (ko) 2009-03-26
US7885723B2 (en) 2011-02-08
EP1876878A1 (en) 2008-01-09
US20080005892A1 (en) 2008-01-10

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