KR100890661B1 - 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 - Google Patents
부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 Download PDFInfo
- Publication number
- KR100890661B1 KR100890661B1 KR1020070068051A KR20070068051A KR100890661B1 KR 100890661 B1 KR100890661 B1 KR 100890661B1 KR 1020070068051 A KR1020070068051 A KR 1020070068051A KR 20070068051 A KR20070068051 A KR 20070068051A KR 100890661 B1 KR100890661 B1 KR 100890661B1
- Authority
- KR
- South Korea
- Prior art keywords
- mounting
- component
- angle
- information
- specifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2006-00187533 | 2006-07-07 | ||
| JP2006187533A JP4719639B2 (ja) | 2006-07-07 | 2006-07-07 | 設定装置及びプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080005137A KR20080005137A (ko) | 2008-01-10 |
| KR100890661B1 true KR100890661B1 (ko) | 2009-03-26 |
Family
ID=38535365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070068051A Expired - Fee Related KR100890661B1 (ko) | 2006-07-07 | 2007-07-06 | 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7885723B2 (enExample) |
| EP (1) | EP1876878A1 (enExample) |
| JP (1) | JP4719639B2 (enExample) |
| KR (1) | KR100890661B1 (enExample) |
| CN (1) | CN101115383B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006064680A1 (ja) * | 2004-12-15 | 2006-06-22 | Matsushita Electric Industrial Co., Ltd. | 動作時間短縮方法、動作時間短縮装置、プログラムおよび部品実装機 |
| JP5074334B2 (ja) * | 2008-09-22 | 2012-11-14 | 株式会社日立ハイテクインスツルメンツ | 部品装着装置、部品装着設定算出装置、プログラム及び部品装着設定算出方法 |
| JP5528193B2 (ja) * | 2010-04-30 | 2014-06-25 | 株式会社日立ハイテクインスツルメンツ | 部品実装装置およびその生産スループット低下原因特定方法 |
| JP5597050B2 (ja) * | 2010-07-15 | 2014-10-01 | 富士機械製造株式会社 | 基板停止位置制御方法および装置、ならびに基板装着位置制御方法 |
| JP5662839B2 (ja) * | 2011-02-25 | 2015-02-04 | Juki株式会社 | 電子部品実装装置及び電子部品実装方法 |
| JP5687948B2 (ja) * | 2011-04-21 | 2015-03-25 | 富士機械製造株式会社 | 電子部品実装機 |
| CN103635073A (zh) * | 2012-08-26 | 2014-03-12 | 赵盾 | 一种自动贴附装置 |
| JP5641084B2 (ja) * | 2013-03-18 | 2014-12-17 | 株式会社安川電機 | ロボットシステムおよび被加工物の製造方法 |
| USD757369S1 (en) | 2014-09-14 | 2016-05-24 | Matthew E. Marsden | Structure for attracting and accumulating aquatic organisms |
| US9681645B2 (en) | 2014-10-14 | 2017-06-20 | Matthew E Marsden | Structure for attracting and accumulating aquatic organisms |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832294A (ja) * | 1994-07-15 | 1996-02-02 | Matsushita Electric Ind Co Ltd | 部品実装方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58112387A (ja) * | 1981-12-26 | 1983-07-04 | 池上通信機株式会社 | 電子部品のプリント基板への自動插入装置 |
| US5020964A (en) * | 1989-11-27 | 1991-06-04 | Ford Motor Company | Method and apparatus for robotic transfer of workpieces |
| CN1130606C (zh) * | 1996-01-26 | 2003-12-10 | 松下电器产业株式会社 | 构成安装数据的方法和设备 |
| JPH09204454A (ja) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Ind Co Ltd | 部品電子カタログ |
| JP3472404B2 (ja) * | 1996-03-15 | 2003-12-02 | 富士機械製造株式会社 | 電子部品供給装置 |
| JP3744066B2 (ja) * | 1996-07-30 | 2006-02-08 | 松下電器産業株式会社 | 電子部品実装方法 |
| JP3784935B2 (ja) * | 1997-08-12 | 2006-06-14 | 山形カシオ株式会社 | 電子部品の装着方法及び装置 |
| JPH11103199A (ja) * | 1997-09-29 | 1999-04-13 | Matsushita Electric Ind Co Ltd | 部品装着方法とその装置 |
| JP2000259250A (ja) * | 1999-03-04 | 2000-09-22 | Yamagata Casio Co Ltd | 部品搭載装置 |
| JP3638233B2 (ja) * | 1999-09-14 | 2005-04-13 | 松下電器産業株式会社 | 電子部品実装装置における電子部品実装順序最適化方法、電子部品実装順序最適化装置、上記電子部品実装順序最適化プログラムを記録した、コンピュータ読取可能な記録媒体、及び電子部品実装装置 |
| JP2001102794A (ja) * | 1999-10-01 | 2001-04-13 | Matsushita Electric Ind Co Ltd | 部品装着方法及びその装置 |
| US6260261B1 (en) * | 1999-10-29 | 2001-07-17 | Universal Instruments Corporation | Straddle-mount assembly tool and method |
| CN100508726C (zh) * | 2000-08-04 | 2009-07-01 | 松下电器产业株式会社 | 用于优化元件安装顺序的方法,采用该方法的装置及组装机器 |
| WO2002026011A2 (en) * | 2000-09-19 | 2002-03-28 | Matsushita Electric Industrial Co., Ltd. | Component suction device, component mounting apparatus and component mounting method |
| US6999835B2 (en) * | 2001-07-23 | 2006-02-14 | Fuji Machine Mfg. Co., Ltd. | Circuit-substrate working system and electronic-circuit fabricating process |
| JP3934002B2 (ja) * | 2002-07-23 | 2007-06-20 | 松下電器産業株式会社 | 部品実装順序最適化方法、部品実装順序最適化プログラム、及び部品実装装置 |
| KR101113838B1 (ko) * | 2004-11-30 | 2012-02-29 | 삼성테크윈 주식회사 | 전자부품 실장 방법 및 이를 채택한 부품 실장기 |
-
2006
- 2006-07-07 JP JP2006187533A patent/JP4719639B2/ja active Active
-
2007
- 2007-07-05 CN CN2007101282363A patent/CN101115383B/zh not_active Expired - Fee Related
- 2007-07-05 US US11/773,836 patent/US7885723B2/en not_active Expired - Fee Related
- 2007-07-05 EP EP07013206A patent/EP1876878A1/en not_active Withdrawn
- 2007-07-06 KR KR1020070068051A patent/KR100890661B1/ko not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832294A (ja) * | 1994-07-15 | 1996-02-02 | Matsushita Electric Ind Co Ltd | 部品実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7885723B2 (en) | 2011-02-08 |
| JP4719639B2 (ja) | 2011-07-06 |
| KR20080005137A (ko) | 2008-01-10 |
| CN101115383A (zh) | 2008-01-30 |
| JP2008016695A (ja) | 2008-01-24 |
| CN101115383B (zh) | 2011-10-26 |
| US20080005892A1 (en) | 2008-01-10 |
| EP1876878A1 (en) | 2008-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100890661B1 (ko) | 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 | |
| KR100338909B1 (ko) | 전자부품의 실장 방법 | |
| JPS62144392A (ja) | 電子部品実装方法 | |
| JP5683006B2 (ja) | 部品実装装置、情報処理装置、情報処理方法及び基板製造方法 | |
| JP5663151B2 (ja) | 部品実装方法および部品実装装置 | |
| JPH11307998A (ja) | 電子部品の実装方法及び電子部品の実装機 | |
| JP4927776B2 (ja) | 部品実装方法 | |
| JP4288221B2 (ja) | 部品配列最適化方法、部品配列最適化装置および部品実装機 | |
| JP2007234790A (ja) | 実装方法および表面実装機 | |
| JP5064758B2 (ja) | データ作成装置および表面実装機 | |
| JP4675703B2 (ja) | 部品取り出し方法 | |
| JP4676302B2 (ja) | 表面実装機および表面実装機の制御方法 | |
| JP5794856B2 (ja) | 電子部品装着装置、および、電子部品装着方法 | |
| JP2001332900A (ja) | 電子部品の実装方法及び電子部品実装機 | |
| JP5622886B2 (ja) | 部品実装方法 | |
| JP3638233B2 (ja) | 電子部品実装装置における電子部品実装順序最適化方法、電子部品実装順序最適化装置、上記電子部品実装順序最適化プログラムを記録した、コンピュータ読取可能な記録媒体、及び電子部品実装装置 | |
| JP2002329999A (ja) | 電子部品装着装置及び方法、並びに電子部品装着用プログラム | |
| CN115136746A (zh) | 图像数据生成装置及元件安装系统 | |
| JP2007053340A (ja) | 基板在庫数シミュレーション方法 | |
| CN111954457B (zh) | 电子部件安装装置以及电子部件安装方法 | |
| JP2007109893A (ja) | 部品実装順序決定方法 | |
| JP4755046B2 (ja) | 部品実装方法 | |
| JP6629617B2 (ja) | 部品実装機、部品実装方法 | |
| JP4486017B2 (ja) | 部品実装順序決定方法 | |
| JP2023167762A (ja) | 部品実装機、リード部品の回転角度算出方法およびリード部品の回転角度算出プログラム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20120223 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20140320 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20140320 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |