KR100890661B1 - 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 - Google Patents

부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 Download PDF

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KR100890661B1
KR100890661B1 KR1020070068051A KR20070068051A KR100890661B1 KR 100890661 B1 KR100890661 B1 KR 100890661B1 KR 1020070068051 A KR1020070068051 A KR 1020070068051A KR 20070068051 A KR20070068051 A KR 20070068051A KR 100890661 B1 KR100890661 B1 KR 100890661B1
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South Korea
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mounting
component
angle
information
specifying
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Expired - Fee Related
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KR1020070068051A
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English (en)
Korean (ko)
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KR20080005137A (ko
Inventor
다까후미 찌다
아띨라 렝겔
겐 이가라시
하루히꼬 야마구찌
마나부 오까모또
고이찌 이즈하라
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가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/085Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853Determination of transport trajectories inside mounting machines
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020070068051A 2006-07-07 2007-07-06 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법 Expired - Fee Related KR100890661B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00187533 2006-07-07
JP2006187533A JP4719639B2 (ja) 2006-07-07 2006-07-07 設定装置及びプログラム

Publications (2)

Publication Number Publication Date
KR20080005137A KR20080005137A (ko) 2008-01-10
KR100890661B1 true KR100890661B1 (ko) 2009-03-26

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KR1020070068051A Expired - Fee Related KR100890661B1 (ko) 2006-07-07 2007-07-06 부품 장착 각도를 설정하는 장치, 부품 장착 시스템, 기록 매체 및 부품 장착 각도를 산출하는 방법

Country Status (5)

Country Link
US (1) US7885723B2 (enExample)
EP (1) EP1876878A1 (enExample)
JP (1) JP4719639B2 (enExample)
KR (1) KR100890661B1 (enExample)
CN (1) CN101115383B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006064680A1 (ja) * 2004-12-15 2006-06-22 Matsushita Electric Industrial Co., Ltd. 動作時間短縮方法、動作時間短縮装置、プログラムおよび部品実装機
JP5074334B2 (ja) * 2008-09-22 2012-11-14 株式会社日立ハイテクインスツルメンツ 部品装着装置、部品装着設定算出装置、プログラム及び部品装着設定算出方法
JP5528193B2 (ja) * 2010-04-30 2014-06-25 株式会社日立ハイテクインスツルメンツ 部品実装装置およびその生産スループット低下原因特定方法
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
JP5662839B2 (ja) * 2011-02-25 2015-02-04 Juki株式会社 電子部品実装装置及び電子部品実装方法
JP5687948B2 (ja) * 2011-04-21 2015-03-25 富士機械製造株式会社 電子部品実装機
CN103635073A (zh) * 2012-08-26 2014-03-12 赵盾 一种自动贴附装置
JP5641084B2 (ja) * 2013-03-18 2014-12-17 株式会社安川電機 ロボットシステムおよび被加工物の製造方法
USD757369S1 (en) 2014-09-14 2016-05-24 Matthew E. Marsden Structure for attracting and accumulating aquatic organisms
US9681645B2 (en) 2014-10-14 2017-06-20 Matthew E Marsden Structure for attracting and accumulating aquatic organisms

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832294A (ja) * 1994-07-15 1996-02-02 Matsushita Electric Ind Co Ltd 部品実装方法

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JPS58112387A (ja) * 1981-12-26 1983-07-04 池上通信機株式会社 電子部品のプリント基板への自動插入装置
US5020964A (en) * 1989-11-27 1991-06-04 Ford Motor Company Method and apparatus for robotic transfer of workpieces
CN1130606C (zh) * 1996-01-26 2003-12-10 松下电器产业株式会社 构成安装数据的方法和设备
JPH09204454A (ja) * 1996-01-26 1997-08-05 Matsushita Electric Ind Co Ltd 部品電子カタログ
JP3472404B2 (ja) * 1996-03-15 2003-12-02 富士機械製造株式会社 電子部品供給装置
JP3744066B2 (ja) * 1996-07-30 2006-02-08 松下電器産業株式会社 電子部品実装方法
JP3784935B2 (ja) * 1997-08-12 2006-06-14 山形カシオ株式会社 電子部品の装着方法及び装置
JPH11103199A (ja) * 1997-09-29 1999-04-13 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2000259250A (ja) * 1999-03-04 2000-09-22 Yamagata Casio Co Ltd 部品搭載装置
JP3638233B2 (ja) * 1999-09-14 2005-04-13 松下電器産業株式会社 電子部品実装装置における電子部品実装順序最適化方法、電子部品実装順序最適化装置、上記電子部品実装順序最適化プログラムを記録した、コンピュータ読取可能な記録媒体、及び電子部品実装装置
JP2001102794A (ja) * 1999-10-01 2001-04-13 Matsushita Electric Ind Co Ltd 部品装着方法及びその装置
US6260261B1 (en) * 1999-10-29 2001-07-17 Universal Instruments Corporation Straddle-mount assembly tool and method
CN100508726C (zh) * 2000-08-04 2009-07-01 松下电器产业株式会社 用于优化元件安装顺序的方法,采用该方法的装置及组装机器
WO2002026011A2 (en) * 2000-09-19 2002-03-28 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
US6999835B2 (en) * 2001-07-23 2006-02-14 Fuji Machine Mfg. Co., Ltd. Circuit-substrate working system and electronic-circuit fabricating process
JP3934002B2 (ja) * 2002-07-23 2007-06-20 松下電器産業株式会社 部品実装順序最適化方法、部品実装順序最適化プログラム、及び部品実装装置
KR101113838B1 (ko) * 2004-11-30 2012-02-29 삼성테크윈 주식회사 전자부품 실장 방법 및 이를 채택한 부품 실장기

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH0832294A (ja) * 1994-07-15 1996-02-02 Matsushita Electric Ind Co Ltd 部品実装方法

Also Published As

Publication number Publication date
US7885723B2 (en) 2011-02-08
JP4719639B2 (ja) 2011-07-06
KR20080005137A (ko) 2008-01-10
CN101115383A (zh) 2008-01-30
JP2008016695A (ja) 2008-01-24
CN101115383B (zh) 2011-10-26
US20080005892A1 (en) 2008-01-10
EP1876878A1 (en) 2008-01-09

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