JP4719079B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP4719079B2
JP4719079B2 JP2006140315A JP2006140315A JP4719079B2 JP 4719079 B2 JP4719079 B2 JP 4719079B2 JP 2006140315 A JP2006140315 A JP 2006140315A JP 2006140315 A JP2006140315 A JP 2006140315A JP 4719079 B2 JP4719079 B2 JP 4719079B2
Authority
JP
Japan
Prior art keywords
heat
circuit board
generating component
cooling fan
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006140315A
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English (en)
Japanese (ja)
Other versions
JP2007310716A (ja
JP2007310716A5 (enExample
Inventor
伸人 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2006140315A priority Critical patent/JP4719079B2/ja
Priority to CN200710089304.XA priority patent/CN101076241A/zh
Priority to US11/787,056 priority patent/US7474526B2/en
Publication of JP2007310716A publication Critical patent/JP2007310716A/ja
Priority to US12/340,449 priority patent/US7719831B2/en
Publication of JP2007310716A5 publication Critical patent/JP2007310716A5/ja
Application granted granted Critical
Publication of JP4719079B2 publication Critical patent/JP4719079B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006140315A 2006-05-19 2006-05-19 電子機器 Expired - Fee Related JP4719079B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006140315A JP4719079B2 (ja) 2006-05-19 2006-05-19 電子機器
CN200710089304.XA CN101076241A (zh) 2006-05-19 2007-03-16 电子设备
US11/787,056 US7474526B2 (en) 2006-05-19 2007-04-13 Electronic apparatus
US12/340,449 US7719831B2 (en) 2006-05-19 2008-12-19 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006140315A JP4719079B2 (ja) 2006-05-19 2006-05-19 電子機器

Publications (3)

Publication Number Publication Date
JP2007310716A JP2007310716A (ja) 2007-11-29
JP2007310716A5 JP2007310716A5 (enExample) 2009-05-21
JP4719079B2 true JP4719079B2 (ja) 2011-07-06

Family

ID=38843496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006140315A Expired - Fee Related JP4719079B2 (ja) 2006-05-19 2006-05-19 電子機器

Country Status (3)

Country Link
US (2) US7474526B2 (enExample)
JP (1) JP4719079B2 (enExample)
CN (1) CN101076241A (enExample)

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JP4929101B2 (ja) * 2007-08-24 2012-05-09 株式会社東芝 電子機器
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JP4357569B2 (ja) 2008-01-31 2009-11-04 株式会社東芝 電子機器
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JP5069202B2 (ja) * 2008-11-13 2012-11-07 レノボ・シンガポール・プライベート・リミテッド 電子機器
US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
JP2015038897A (ja) 2009-03-30 2015-02-26 株式会社東芝 電子機器
CN102414813B (zh) * 2009-04-29 2014-04-09 惠普开发有限公司 印刷电路板冷却组件
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JP4892078B2 (ja) * 2010-05-11 2012-03-07 株式会社東芝 電子機器
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JP4929377B2 (ja) 2010-06-18 2012-05-09 株式会社東芝 テレビジョン受像機、及び電子機器
US9629280B2 (en) * 2010-06-24 2017-04-18 Raytheon Company Multiple liquid loop cooling for electronics
JP4818452B2 (ja) * 2010-07-23 2011-11-16 株式会社東芝 電子機器
JP5489911B2 (ja) * 2010-08-18 2014-05-14 三菱電機株式会社 半導体パワーモジュール
TWI573519B (zh) * 2010-09-24 2017-03-01 鴻準精密工業股份有限公司 可攜帶式電子裝置及其散熱模組
CN102445975A (zh) * 2010-10-15 2012-05-09 鸿富锦精密工业（深圳）有限公司 电子装置
TWI479984B (zh) * 2011-01-05 2015-04-01 Asustek Comp Inc 可攜式電子裝置
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JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
JP4897107B2 (ja) * 2011-08-26 2012-03-14 株式会社東芝 電子機器
JP4922467B2 (ja) * 2011-08-26 2012-04-25 株式会社東芝 電子機器
TW201328576A (zh) * 2011-12-30 2013-07-01 鴻海精密工業股份有限公司 電子裝置散熱結構
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JP5775062B2 (ja) * 2012-12-27 2015-09-09 レノボ・シンガポール・プライベート・リミテッド 電子機器および電子機器システム
TW201432421A (zh) * 2013-02-04 2014-08-16 Hon Hai Prec Ind Co Ltd 散熱裝置
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WO2014155685A1 (ja) * 2013-03-29 2014-10-02 株式会社 東芝 表示装置および電子機器
JP6561846B2 (ja) * 2014-01-16 2019-08-21 日本電気株式会社 冷却装置及び電子装置
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JP6117288B2 (ja) * 2015-07-14 2017-04-19 古河電気工業株式会社 冷却装置
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EP3266290B1 (en) * 2016-01-22 2023-03-22 Hewlett Packard Enterprise Development LP Routing a cooling member along a board
US9848515B1 (en) * 2016-05-27 2017-12-19 Advanced Micro Devices, Inc. Multi-compartment computing device with shared cooling device
US10485135B2 (en) * 2017-06-30 2019-11-19 Dell Products, L.P. Storage device cooling utilizing a removable heat pipe
JP6886904B2 (ja) * 2017-09-20 2021-06-16 新光電気工業株式会社 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器
CN107765795A (zh) 2017-11-08 2018-03-06 北京图森未来科技有限公司 一种计算机服务器
CN107885295A (zh) 2017-11-08 2018-04-06 北京图森未来科技有限公司 一种散热系统
CN207486521U (zh) * 2017-11-20 2018-06-12 苏州旭创科技有限公司 光模块
KR102487229B1 (ko) * 2017-11-24 2023-01-11 삼성전자 주식회사 방열 구조를 포함하는 전자 장치
CN212991086U (zh) * 2018-01-31 2021-04-16 古河电气工业株式会社 散热器
CN108958382A (zh) * 2018-08-03 2018-12-07 英业达科技有限公司 笔记本电脑
CN109471512A (zh) * 2018-11-05 2019-03-15 北京小米移动软件有限公司 冷却换热系统及笔记本电脑
US11013141B2 (en) * 2019-05-31 2021-05-18 Microsoft Technology Licensing, Llc Decoupled conduction/convection dual heat sink for on-board memory microcontrollers
CN112087893B (zh) * 2019-06-14 2021-08-24 杭州海康威视数字技术股份有限公司 一种干扰器
CN112486291B (zh) * 2019-09-12 2023-04-28 英业达科技有限公司 散热系统
JP7306250B2 (ja) 2019-12-11 2023-07-11 富士通株式会社 基地局及び装置冷却方法
BR112022018607A2 (pt) 2020-03-27 2022-11-08 Sony Interactive Entertainment Inc Aparelho eletrônico, e, painel externo que deve ser fixado a um alojamento de um aparelho eletrônico e disposto em uma primeira direção em relação ao alojamento
CN115245060B (zh) * 2020-03-27 2024-10-29 索尼互动娱乐股份有限公司 电子设备
CN115245063B (zh) 2020-03-27 2025-11-11 索尼互动娱乐股份有限公司 电子设备
JP7394708B2 (ja) * 2020-06-18 2023-12-08 新光電気工業株式会社 ループ型ヒートパイプ
CN111700725A (zh) * 2020-06-28 2020-09-25 深圳由莱智能电子有限公司 脱毛仪
CN113126727A (zh) * 2021-03-31 2021-07-16 厦门亿联网络技术股份有限公司 一种散热组件及应用散热组件的电子器件
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Also Published As

Publication number Publication date
US7474526B2 (en) 2009-01-06
US20080037227A1 (en) 2008-02-14
US20090168331A1 (en) 2009-07-02
CN101076241A (zh) 2007-11-21
JP2007310716A (ja) 2007-11-29
US7719831B2 (en) 2010-05-18

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